IXFR26N50Q

IXYS IXFR26N50Q

Part Number:
IXFR26N50Q
Manufacturer:
IXYS
Ventron No:
2852367-IXFR26N50Q
Description:
MOSFET N-CH 500V 24A ISOPLUS247
ECAD Model:
Datasheet:
IXFR26N50Q

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Specifications
IXYS IXFR26N50Q technical specifications, attributes, parameters and parts with similar specifications to IXYS IXFR26N50Q.
  • Mount
    Through Hole
  • Mounting Type
    Through Hole
  • Package / Case
    ISOPLUS247™
  • Number of Pins
    3
  • Transistor Element Material
    SILICON
  • Operating Temperature
    -55°C~150°C TJ
  • Packaging
    Tube
  • Series
    HiPerFET™
  • Published
    2001
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    3
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Additional Feature
    AVALANCHE RATED
  • Subcategory
    FET General Purpose Power
  • Technology
    MOSFET (Metal Oxide)
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Pin Count
    3
  • Qualification Status
    Not Qualified
  • Number of Elements
    1
  • Power Dissipation-Max
    250W Tc
  • Element Configuration
    Single
  • Operating Mode
    ENHANCEMENT MODE
  • Power Dissipation
    250W
  • Case Connection
    ISOLATED
  • FET Type
    N-Channel
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    200m Ω @ 13A, 10V
  • Vgs(th) (Max) @ Id
    4.5V @ 4mA
  • Input Capacitance (Ciss) (Max) @ Vds
    3900pF @ 25V
  • Current - Continuous Drain (Id) @ 25°C
    24A Tc
  • Gate Charge (Qg) (Max) @ Vgs
    95nC @ 10V
  • Rise Time
    30ns
  • Drive Voltage (Max Rds On,Min Rds On)
    10V
  • Vgs (Max)
    ±20V
  • Fall Time (Typ)
    16 ns
  • Turn-Off Delay Time
    55 ns
  • Continuous Drain Current (ID)
    24A
  • Gate to Source Voltage (Vgs)
    20V
  • Drain-source On Resistance-Max
    0.2Ohm
  • Drain to Source Breakdown Voltage
    500V
  • Pulsed Drain Current-Max (IDM)
    104A
  • Avalanche Energy Rating (Eas)
    1500 mJ
  • RoHS Status
    RoHS Compliant
Description
IXFR26N50Q Overview
There is a phenomenon known as "avalanche break down", where avalanche energy is applied to the MOSFET and avalanche energy rating (Eas) is 1500 mJ.Input capacitance, CI, is defined as the capacitance between two input terminals of an op amp with one input grounded, and the input capacitance of this device is 3900pF @ 25V.This device has a continuous drain current (ID) of [24A], which is its maximum continuous current.At a given drain-source breakdown voltage, a specified value of ID will flow. With VGS=500V, the drain-source breakdown voltage is 500V.The turn-off delay time of a device is the time it takes to charge its input capacitance before drain current can flow. The turn-off delay time of a device is 55 ns.A maximum pulsed drain current of 104A is the maximum peak drain current rated for this device.Gate-source voltage, or VGS, is the voltage across a FET transistor's gate-source terminal, and can be 20V volts.Its overall power consumption can be reduced by using drive voltage (10V).

IXFR26N50Q Features
the avalanche energy rating (Eas) is 1500 mJ
a continuous drain current (ID) of 24A
a drain-to-source breakdown voltage of 500V voltage
the turn-off delay time is 55 ns
based on its rated peak drain current 104A.


IXFR26N50Q Applications
There are a lot of IXYS
IXFR26N50Q applications of single MOSFETs transistors.


Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
IXFR26N50Q More Descriptions
MOSFET N-CH 500V 24A ISOPLUS247
Product Comparison
The three parts on the right have similar specifications to IXFR26N50Q.
  • Image
    Part Number
    Manufacturer
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Transistor Element Material
    Operating Temperature
    Packaging
    Series
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    Subcategory
    Technology
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    Qualification Status
    Number of Elements
    Power Dissipation-Max
    Element Configuration
    Operating Mode
    Power Dissipation
    Case Connection
    FET Type
    Transistor Application
    Rds On (Max) @ Id, Vgs
    Vgs(th) (Max) @ Id
    Input Capacitance (Ciss) (Max) @ Vds
    Current - Continuous Drain (Id) @ 25°C
    Gate Charge (Qg) (Max) @ Vgs
    Rise Time
    Drive Voltage (Max Rds On,Min Rds On)
    Vgs (Max)
    Fall Time (Typ)
    Turn-Off Delay Time
    Continuous Drain Current (ID)
    Gate to Source Voltage (Vgs)
    Drain-source On Resistance-Max
    Drain to Source Breakdown Voltage
    Pulsed Drain Current-Max (IDM)
    Avalanche Energy Rating (Eas)
    RoHS Status
    Factory Lead Time
    ECCN Code
    Voltage - Rated DC
    Current Rating
    Lead Free
    Drain Current-Max (Abs) (ID)
    Drain to Source Voltage (Vdss)
    View Compare
  • IXFR26N50Q
    IXFR26N50Q
    Through Hole
    Through Hole
    ISOPLUS247™
    3
    SILICON
    -55°C~150°C TJ
    Tube
    HiPerFET™
    2001
    e1
    yes
    Obsolete
    1 (Unlimited)
    3
    Tin/Silver/Copper (Sn/Ag/Cu)
    AVALANCHE RATED
    FET General Purpose Power
    MOSFET (Metal Oxide)
    NOT SPECIFIED
    NOT SPECIFIED
    3
    Not Qualified
    1
    250W Tc
    Single
    ENHANCEMENT MODE
    250W
    ISOLATED
    N-Channel
    SWITCHING
    200m Ω @ 13A, 10V
    4.5V @ 4mA
    3900pF @ 25V
    24A Tc
    95nC @ 10V
    30ns
    10V
    ±20V
    16 ns
    55 ns
    24A
    20V
    0.2Ohm
    500V
    104A
    1500 mJ
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • IXFR48N60P
    Through Hole
    Through Hole
    ISOPLUS247™
    3
    SILICON
    -55°C~150°C TJ
    Tube
    HiPerFET™, PolarHT™
    2006
    e1
    yes
    Active
    1 (Unlimited)
    3
    Tin/Silver/Copper (Sn/Ag/Cu)
    AVALANCHE RATED, UL RECOGNIZED
    -
    MOSFET (Metal Oxide)
    NOT SPECIFIED
    NOT SPECIFIED
    3
    Not Qualified
    1
    300W Tc
    Single
    ENHANCEMENT MODE
    300W
    ISOLATED
    N-Channel
    SWITCHING
    150m Ω @ 24A, 10V
    5V @ 8mA
    8860pF @ 25V
    32A Tc
    150nC @ 10V
    25ns
    10V
    ±30V
    22 ns
    85 ns
    32A
    30V
    0.15Ohm
    600V
    110A
    2000 mJ
    ROHS3 Compliant
    30 Weeks
    EAR99
    600V
    48A
    Lead Free
    -
    -
  • IXFR30N50Q
    Through Hole
    Through Hole
    ISOPLUS247™
    3
    SILICON
    -55°C~150°C TJ
    Tube
    HiPerFET™
    2000
    e1
    yes
    Obsolete
    1 (Unlimited)
    3
    Tin/Silver/Copper (Sn/Ag/Cu)
    AVALANCHE RATED
    FET General Purpose Power
    MOSFET (Metal Oxide)
    NOT SPECIFIED
    NOT SPECIFIED
    3
    Not Qualified
    1
    310W Tc
    Single
    ENHANCEMENT MODE
    310W
    ISOLATED
    N-Channel
    SWITCHING
    160m Ω @ 15A, 10V
    4V @ 4mA
    3950pF @ 25V
    30A Tc
    150nC @ 10V
    42ns
    10V
    ±20V
    20 ns
    75 ns
    30A
    20V
    0.16Ohm
    500V
    120A
    1500 mJ
    RoHS Compliant
    -
    -
    -
    -
    -
    29A
    -
  • IXFR12N120P
    Through Hole
    Through Hole
    ISOPLUS247™
    -
    -
    -
    Tube
    -
    -
    -
    -
    Active
    1 (Unlimited)
    -
    -
    -
    -
    MOSFET (Metal Oxide)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    N-Channel
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    18 Weeks
    -
    -
    -
    -
    -
    1200V
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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