IXFR30N50Q

IXYS IXFR30N50Q

Part Number:
IXFR30N50Q
Manufacturer:
IXYS
Ventron No:
2851135-IXFR30N50Q
Description:
MOSFET N-CH 500V 30A ISOPLUS247
ECAD Model:
Datasheet:
IXFR(30,32)N50Q

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Specifications
IXYS IXFR30N50Q technical specifications, attributes, parameters and parts with similar specifications to IXYS IXFR30N50Q.
  • Mount
    Through Hole
  • Mounting Type
    Through Hole
  • Package / Case
    ISOPLUS247™
  • Number of Pins
    3
  • Transistor Element Material
    SILICON
  • Operating Temperature
    -55°C~150°C TJ
  • Packaging
    Tube
  • Series
    HiPerFET™
  • Published
    2000
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    3
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Additional Feature
    AVALANCHE RATED
  • Subcategory
    FET General Purpose Power
  • Technology
    MOSFET (Metal Oxide)
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Pin Count
    3
  • Qualification Status
    Not Qualified
  • Number of Elements
    1
  • Power Dissipation-Max
    310W Tc
  • Element Configuration
    Single
  • Operating Mode
    ENHANCEMENT MODE
  • Power Dissipation
    310W
  • Case Connection
    ISOLATED
  • FET Type
    N-Channel
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    160m Ω @ 15A, 10V
  • Vgs(th) (Max) @ Id
    4V @ 4mA
  • Input Capacitance (Ciss) (Max) @ Vds
    3950pF @ 25V
  • Current - Continuous Drain (Id) @ 25°C
    30A Tc
  • Gate Charge (Qg) (Max) @ Vgs
    150nC @ 10V
  • Rise Time
    42ns
  • Drive Voltage (Max Rds On,Min Rds On)
    10V
  • Vgs (Max)
    ±20V
  • Fall Time (Typ)
    20 ns
  • Turn-Off Delay Time
    75 ns
  • Continuous Drain Current (ID)
    30A
  • Gate to Source Voltage (Vgs)
    20V
  • Drain Current-Max (Abs) (ID)
    29A
  • Drain-source On Resistance-Max
    0.16Ohm
  • Drain to Source Breakdown Voltage
    500V
  • Pulsed Drain Current-Max (IDM)
    120A
  • Avalanche Energy Rating (Eas)
    1500 mJ
  • RoHS Status
    RoHS Compliant
Description
IXFR30N50Q Overview
Avalanche breakdown occurs when energy is applied to the MOSFET, and the avalanche energy ratings (Eas) are 1500 mJ.A device's maximal input capacitance is 3950pF @ 25V, which is defined as the capacitance between its input terminals with either input grounded.This device's continuous drain current (ID) is 30A, which represents the maximum continuous current it can conduct.In this device, the drain-source breakdown voltage is 500V and the drain-source breakdown voltage is the VDS at which a specified value of ID flows.In this device, the drain current is 29A, which is the maximum continuous current the device can conduct.Its turn-off delay time is 75 ns, which is the time to charge the device's input capacitance before drain current conduction begins.In terms of pulsed drain current, it has a maximum of 120A, which is its maximum rated peak drain current.Gate-source voltage, or VGS, is the voltage across a FET transistor's gate-source terminal, and can be 20V volts.This device reduces its overall power consumption by using drive voltage (10V).

IXFR30N50Q Features
the avalanche energy rating (Eas) is 1500 mJ
a continuous drain current (ID) of 30A
a drain-to-source breakdown voltage of 500V voltage
the turn-off delay time is 75 ns
based on its rated peak drain current 120A.


IXFR30N50Q Applications
There are a lot of IXYS
IXFR30N50Q applications of single MOSFETs transistors.


Consumer Appliances
Lighting
Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
IXFR30N50Q More Descriptions
Trans MOSFET N-CH 500V 30A 3-Pin(3 Tab) ISOPLUS247
Product Comparison
The three parts on the right have similar specifications to IXFR30N50Q.
  • Image
    Part Number
    Manufacturer
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Transistor Element Material
    Operating Temperature
    Packaging
    Series
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    Subcategory
    Technology
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    Qualification Status
    Number of Elements
    Power Dissipation-Max
    Element Configuration
    Operating Mode
    Power Dissipation
    Case Connection
    FET Type
    Transistor Application
    Rds On (Max) @ Id, Vgs
    Vgs(th) (Max) @ Id
    Input Capacitance (Ciss) (Max) @ Vds
    Current - Continuous Drain (Id) @ 25°C
    Gate Charge (Qg) (Max) @ Vgs
    Rise Time
    Drive Voltage (Max Rds On,Min Rds On)
    Vgs (Max)
    Fall Time (Typ)
    Turn-Off Delay Time
    Continuous Drain Current (ID)
    Gate to Source Voltage (Vgs)
    Drain Current-Max (Abs) (ID)
    Drain-source On Resistance-Max
    Drain to Source Breakdown Voltage
    Pulsed Drain Current-Max (IDM)
    Avalanche Energy Rating (Eas)
    RoHS Status
    ECCN Code
    Factory Lead Time
    Resistance
    Voltage - Rated DC
    Current Rating
    Lead Free
    Drain to Source Voltage (Vdss)
    View Compare
  • IXFR30N50Q
    IXFR30N50Q
    Through Hole
    Through Hole
    ISOPLUS247™
    3
    SILICON
    -55°C~150°C TJ
    Tube
    HiPerFET™
    2000
    e1
    yes
    Obsolete
    1 (Unlimited)
    3
    Tin/Silver/Copper (Sn/Ag/Cu)
    AVALANCHE RATED
    FET General Purpose Power
    MOSFET (Metal Oxide)
    NOT SPECIFIED
    NOT SPECIFIED
    3
    Not Qualified
    1
    310W Tc
    Single
    ENHANCEMENT MODE
    310W
    ISOLATED
    N-Channel
    SWITCHING
    160m Ω @ 15A, 10V
    4V @ 4mA
    3950pF @ 25V
    30A Tc
    150nC @ 10V
    42ns
    10V
    ±20V
    20 ns
    75 ns
    30A
    20V
    29A
    0.16Ohm
    500V
    120A
    1500 mJ
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • IXFR80N15Q
    Through Hole
    Through Hole
    ISOPLUS247™
    3
    SILICON
    -55°C~150°C TJ
    Tube
    HiPerFET™
    2000
    e1
    yes
    Obsolete
    1 (Unlimited)
    3
    Tin/Silver/Copper (Sn/Ag/Cu)
    AVALANCHE RATED
    FET General Purpose Power
    MOSFET (Metal Oxide)
    NOT SPECIFIED
    NOT SPECIFIED
    3
    Not Qualified
    1
    310W Tc
    Single
    ENHANCEMENT MODE
    310W
    ISOLATED
    N-Channel
    SWITCHING
    22.5m Ω @ 40A, 10V
    4V @ 4mA
    4600pF @ 25V
    75A Tc
    180nC @ 10V
    55ns
    10V
    ±20V
    20 ns
    68 ns
    75A
    20V
    -
    0.0225Ohm
    150V
    -
    1500 mJ
    RoHS Compliant
    EAR99
    -
    -
    -
    -
    -
    -
  • IXFR44N50P
    Through Hole
    Through Hole
    ISOPLUS247™
    3
    SILICON
    -55°C~150°C TJ
    Tube
    HiPerFET™, PolarHT™
    2006
    e1
    yes
    Active
    1 (Unlimited)
    3
    Tin/Silver/Copper (Sn/Ag/Cu)
    AVALANCHE RATED, UL RECOGNIZED
    -
    MOSFET (Metal Oxide)
    NOT SPECIFIED
    NOT SPECIFIED
    3
    Not Qualified
    1
    208W Tc
    Single
    ENHANCEMENT MODE
    208W
    ISOLATED
    N-Channel
    SWITCHING
    150m Ω @ 22A, 10V
    5V @ 4mA
    5440pF @ 25V
    24A Tc
    98nC @ 10V
    27ns
    10V
    ±30V
    18 ns
    70 ns
    24A
    30V
    -
    -
    500V
    -
    1700 mJ
    ROHS3 Compliant
    -
    30 Weeks
    150MOhm
    500V
    44A
    Lead Free
    -
  • IXFR12N120P
    Through Hole
    Through Hole
    ISOPLUS247™
    -
    -
    -
    Tube
    -
    -
    -
    -
    Active
    1 (Unlimited)
    -
    -
    -
    -
    MOSFET (Metal Oxide)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    N-Channel
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    18 Weeks
    -
    -
    -
    -
    1200V
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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