IRF1405ZS

Infineon Technologies IRF1405ZS

Part Number:
IRF1405ZS
Manufacturer:
Infineon Technologies
Ventron No:
2492647-IRF1405ZS
Description:
MOSFET N-CH 55V 75A D2PAK
ECAD Model:
Datasheet:
IRF1405Z(S,L)

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Specifications
Infineon Technologies IRF1405ZS technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF1405ZS.
  • Mounting Type
    Surface Mount
  • Package / Case
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
  • Surface Mount
    YES
  • Transistor Element Material
    SILICON
  • Operating Temperature
    -55°C~175°C TJ
  • Packaging
    Tube
  • Series
    HEXFET®
  • Published
    2003
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    2
  • Additional Feature
    AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
  • Technology
    MOSFET (Metal Oxide)
  • Terminal Position
    SINGLE
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PSSO-G2
  • Number of Elements
    1
  • Configuration
    SINGLE WITH BUILT-IN DIODE
  • Power Dissipation-Max
    230W Tc
  • Operating Mode
    ENHANCEMENT MODE
  • Case Connection
    DRAIN
  • FET Type
    N-Channel
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    4.9m Ω @ 75A, 10V
  • Vgs(th) (Max) @ Id
    4V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds
    4780pF @ 25V
  • Current - Continuous Drain (Id) @ 25°C
    75A Tc
  • Gate Charge (Qg) (Max) @ Vgs
    180nC @ 10V
  • Drain to Source Voltage (Vdss)
    55V
  • Drive Voltage (Max Rds On,Min Rds On)
    10V
  • Vgs (Max)
    ±20V
  • Drain Current-Max (Abs) (ID)
    75A
  • Drain-source On Resistance-Max
    0.0049Ohm
  • Pulsed Drain Current-Max (IDM)
    600A
  • DS Breakdown Voltage-Min
    55V
  • Avalanche Energy Rating (Eas)
    420 mJ
  • RoHS Status
    Non-RoHS Compliant
Description
IRF1405ZS Overview
As a result of avalanche breakdown, energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating is 420 mJ.CI refers to the capacitance between two input terminals on an op amp with either input grounded, and this device's maximum input capacitance is 4780pF @ 25V.There is no drain current on this device since the maximum continuous current it can conduct is 75A.There is a peak drain current of 600A, its maximum pulsed drain current.In order for DS breakdown voltage to remain above 55V, it should remain above the 55V level.The transistor must receive a 55V drain to source voltage (Vdss) in order to function.In addition to reducing power consumption, this device uses drive voltage (10V).

IRF1405ZS Features
the avalanche energy rating (Eas) is 420 mJ
based on its rated peak drain current 600A.
a 55V drain to source voltage (Vdss)


IRF1405ZS Applications
There are a lot of Infineon Technologies
IRF1405ZS applications of single MOSFETs transistors.


DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV,
Lighting, Server, Telecom and UPS.
IRF1405ZS More Descriptions
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package
MOSFET N-CH 55V 75A D2PAK
CAP CER 39PF 250V C0G/NP0 0805
Product Comparison
The three parts on the right have similar specifications to IRF1405ZS.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Transistor Element Material
    Operating Temperature
    Packaging
    Series
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Elements
    Configuration
    Power Dissipation-Max
    Operating Mode
    Case Connection
    FET Type
    Transistor Application
    Rds On (Max) @ Id, Vgs
    Vgs(th) (Max) @ Id
    Input Capacitance (Ciss) (Max) @ Vds
    Current - Continuous Drain (Id) @ 25°C
    Gate Charge (Qg) (Max) @ Vgs
    Drain to Source Voltage (Vdss)
    Drive Voltage (Max Rds On,Min Rds On)
    Vgs (Max)
    Drain Current-Max (Abs) (ID)
    Drain-source On Resistance-Max
    Pulsed Drain Current-Max (IDM)
    DS Breakdown Voltage-Min
    Avalanche Energy Rating (Eas)
    RoHS Status
    Mount
    Number of Pins
    JESD-609 Code
    ECCN Code
    Terminal Finish
    Max Operating Temperature
    Min Operating Temperature
    Subcategory
    Element Configuration
    Power Dissipation
    Turn On Delay Time
    Rise Time
    Fall Time (Typ)
    Turn-Off Delay Time
    Continuous Drain Current (ID)
    Gate to Source Voltage (Vgs)
    Drain to Source Breakdown Voltage
    Height
    Length
    Width
    Radiation Hardening
    Supplier Device Package
    View Compare
  • IRF1405ZS
    IRF1405ZS
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    YES
    SILICON
    -55°C~175°C TJ
    Tube
    HEXFET®
    2003
    Obsolete
    1 (Unlimited)
    2
    AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
    MOSFET (Metal Oxide)
    SINGLE
    GULL WING
    NOT SPECIFIED
    NOT SPECIFIED
    R-PSSO-G2
    1
    SINGLE WITH BUILT-IN DIODE
    230W Tc
    ENHANCEMENT MODE
    DRAIN
    N-Channel
    SWITCHING
    4.9m Ω @ 75A, 10V
    4V @ 250μA
    4780pF @ 25V
    75A Tc
    180nC @ 10V
    55V
    10V
    ±20V
    75A
    0.0049Ohm
    600A
    55V
    420 mJ
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IRF1310NSTRRPBF
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    -
    -
    -
    Tape & Reel (TR)
    HEXFET®
    2004
    Discontinued
    1 (Unlimited)
    2
    AVALANCHE RATED, HIGH RELIABILITY
    MOSFET (Metal Oxide)
    -
    GULL WING
    260
    30
    R-PSSO-G2
    1
    -
    3.8W Ta 160W Tc
    ENHANCEMENT MODE
    DRAIN
    N-Channel
    SWITCHING
    36m Ω @ 22A, 10V
    4V @ 250μA
    1900pF @ 25V
    42A Tc
    110nC @ 10V
    -
    10V
    ±20V
    -
    -
    -
    -
    420 mJ
    ROHS3 Compliant
    Surface Mount
    3
    e3
    EAR99
    Matte Tin (Sn) - with Nickel (Ni) barrier
    175°C
    -55°C
    FET General Purpose Power
    Single
    3.8W
    11 ns
    56ns
    40 ns
    45 ns
    42A
    20V
    100V
    4.826mm
    10.668mm
    9.65mm
    No
    -
  • IRF1010ESTRR
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    -
    -
    -55°C~175°C TJ
    Tape & Reel (TR)
    HEXFET®
    2002
    Obsolete
    1 (Unlimited)
    -
    -
    MOSFET (Metal Oxide)
    -
    -
    -
    -
    -
    -
    -
    200W Tc
    -
    -
    N-Channel
    -
    12mOhm @ 50A, 10V
    4V @ 250μA
    3210pF @ 25V
    84A Tc
    130nC @ 10V
    60V
    10V
    ±20V
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    D2PAK
  • IRF1405SPBF
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    -
    -
    -55°C~175°C TJ
    Tube
    HEXFET®
    -
    Obsolete
    1 (Unlimited)
    -
    -
    MOSFET (Metal Oxide)
    -
    -
    -
    -
    -
    -
    -
    200W Tc
    -
    -
    N-Channel
    -
    5.3mOhm @ 101A, 10V
    4V @ 250μA
    5.48pF @ 25V
    131A Tc
    260nC @ 10V
    55V
    10V
    ±20V
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    D2PAK
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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