Infineon Technologies IRF1324SPBF
- Part Number:
- IRF1324SPBF
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 2854207-IRF1324SPBF
- Description:
- MOSFET N-CH 24V 195A D2-PAK
- Datasheet:
- IRF1324(L,S)PBF
Infineon Technologies IRF1324SPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF1324SPBF.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / CaseTO-263-3, D2Pak (2 Leads Tab), TO-263AB
- Number of Pins3
- Supplier Device PackageD2PAK
- Operating Temperature-55°C~175°C TJ
- PackagingTube
- SeriesHEXFET®
- Published2008
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- TerminationSMD/SMT
- Max Operating Temperature175°C
- Min Operating Temperature-55°C
- TechnologyMOSFET (Metal Oxide)
- Number of Elements1
- Power Dissipation-Max300W Tc
- Power Dissipation300W
- Turn On Delay Time17 ns
- FET TypeN-Channel
- Rds On (Max) @ Id, Vgs1.65mOhm @ 195A, 10V
- Vgs(th) (Max) @ Id4V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds7590pF @ 24V
- Current - Continuous Drain (Id) @ 25°C195A Tc
- Gate Charge (Qg) (Max) @ Vgs240nC @ 10V
- Rise Time190ns
- Drain to Source Voltage (Vdss)24V
- Drive Voltage (Max Rds On,Min Rds On)10V
- Vgs (Max)±20V
- Fall Time (Typ)120 ns
- Turn-Off Delay Time83 ns
- Continuous Drain Current (ID)340A
- Threshold Voltage4V
- Gate to Source Voltage (Vgs)20V
- Drain to Source Breakdown Voltage24V
- Dual Supply Voltage24V
- Input Capacitance7.59nF
- Drain to Source Resistance1.65mOhm
- Rds On Max1.65 mΩ
- Nominal Vgs4 V
- Height4.826mm
- Length10.668mm
- Width9.65mm
- REACH SVHCNo SVHC
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
IRF1324SPBF Overview
The input capacitance parameter, CI, is defined as the capacitance between the input terminals of an op amp with either input grounded, and this device's maximal input capacitance is 7590pF @ 24V.The drain current is the maximum continuous current the device can conduct, and the continuous drain current (ID) of this device is 340A. Drain-source breakdown voltage is the VDS at which a specified value of ID flows, with VGS=24V. And this device has 24V drain to source breakdown voltage.Turn-Off delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its turn-off delay time is 83 ns. Drain to Source Resistance is the resistance between the drain and the source of a MOSFET when a specific gate-to-source voltage (VGS) is applied to bias the device to the on state, and the resistance of this device is 1.65mOhm. Turn-on delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its delay time is 17 ns.The gate-source voltage, VGS, of a FET transistor is the voltage that falls across the gate-source terminal of the transistor and its voltage can be 20V.Threshold voltage is the point at which an electrical device is set to activate any one of its operations, and this transistor has 4V threshold voltage. Operating this transistor requires a 24V drain to source voltage (Vdss).By using drive voltage (10V), this device helps reduce its overall power consumption.
IRF1324SPBF Features
a continuous drain current (ID) of 340A
a drain-to-source breakdown voltage of 24V voltage
the turn-off delay time is 83 ns
single MOSFETs transistor is 1.65mOhm
a threshold voltage of 4V
a 24V drain to source voltage (Vdss)
IRF1324SPBF Applications
There are a lot of Infineon Technologies
IRF1324SPBF applications of single MOSFETs transistors.
LCD/LED TV
Consumer Appliances
Lighting
Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
The input capacitance parameter, CI, is defined as the capacitance between the input terminals of an op amp with either input grounded, and this device's maximal input capacitance is 7590pF @ 24V.The drain current is the maximum continuous current the device can conduct, and the continuous drain current (ID) of this device is 340A. Drain-source breakdown voltage is the VDS at which a specified value of ID flows, with VGS=24V. And this device has 24V drain to source breakdown voltage.Turn-Off delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its turn-off delay time is 83 ns. Drain to Source Resistance is the resistance between the drain and the source of a MOSFET when a specific gate-to-source voltage (VGS) is applied to bias the device to the on state, and the resistance of this device is 1.65mOhm. Turn-on delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its delay time is 17 ns.The gate-source voltage, VGS, of a FET transistor is the voltage that falls across the gate-source terminal of the transistor and its voltage can be 20V.Threshold voltage is the point at which an electrical device is set to activate any one of its operations, and this transistor has 4V threshold voltage. Operating this transistor requires a 24V drain to source voltage (Vdss).By using drive voltage (10V), this device helps reduce its overall power consumption.
IRF1324SPBF Features
a continuous drain current (ID) of 340A
a drain-to-source breakdown voltage of 24V voltage
the turn-off delay time is 83 ns
single MOSFETs transistor is 1.65mOhm
a threshold voltage of 4V
a 24V drain to source voltage (Vdss)
IRF1324SPBF Applications
There are a lot of Infineon Technologies
IRF1324SPBF applications of single MOSFETs transistors.
LCD/LED TV
Consumer Appliances
Lighting
Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
IRF1324SPBF More Descriptions
MOSFET Operating temperature: -55... 175 °C Housing type: D2PAK Polarity: N Power dissipation: 300 W
24V Single N-Channel HEXFET Power MOSFET in a Lead Free D2-Pak package
Trans MOSFET N-CH Si 24V 340A 3-Pin(2 Tab) D2PAK
Power Field-Effect Transistor, 195A I(D), 24V, 0.0165ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB
MOSFET, N-CH 24V 195A D2PAK; Transistor Polarity:N Channel; Continuous Drain Current Id:195A; Drain Source Voltage Vds:24V; On Resistance Rds(on):1.65mohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs Typ:4V; Power Dissipation Pd:300W; Operating Temperature Range:-55°C to 175°C; Transistor Case Style:D2-PAK; No. of Pins:3; SVHC:No SVHC (20-Jun-2011); Current Id Max:340A; Package / Case:D2-PAK; Power Dissipation Pd:300W; Power Dissipation Pd:300W; Termination Type:SMD; Transistor Type:Power MOSFET; Voltage Vds Typ:24V; Voltage Vgs Max:4V; Voltage Vgs Rds on Measurement:10V; Voltage Vgs th Max:4V
24V Single N-Channel HEXFET Power MOSFET in a Lead Free D2-Pak package
Trans MOSFET N-CH Si 24V 340A 3-Pin(2 Tab) D2PAK
Power Field-Effect Transistor, 195A I(D), 24V, 0.0165ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB
MOSFET, N-CH 24V 195A D2PAK; Transistor Polarity:N Channel; Continuous Drain Current Id:195A; Drain Source Voltage Vds:24V; On Resistance Rds(on):1.65mohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs Typ:4V; Power Dissipation Pd:300W; Operating Temperature Range:-55°C to 175°C; Transistor Case Style:D2-PAK; No. of Pins:3; SVHC:No SVHC (20-Jun-2011); Current Id Max:340A; Package / Case:D2-PAK; Power Dissipation Pd:300W; Power Dissipation Pd:300W; Termination Type:SMD; Transistor Type:Power MOSFET; Voltage Vds Typ:24V; Voltage Vgs Max:4V; Voltage Vgs Rds on Measurement:10V; Voltage Vgs th Max:4V
The three parts on the right have similar specifications to IRF1324SPBF.
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ImagePart NumberManufacturerMountMounting TypePackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingSeriesPublishedPart StatusMoisture Sensitivity Level (MSL)TerminationMax Operating TemperatureMin Operating TemperatureTechnologyNumber of ElementsPower Dissipation-MaxPower DissipationTurn On Delay TimeFET TypeRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrain to Source Voltage (Vdss)Drive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Threshold VoltageGate to Source Voltage (Vgs)Drain to Source Breakdown VoltageDual Supply VoltageInput CapacitanceDrain to Source ResistanceRds On MaxNominal VgsHeightLengthWidthREACH SVHCRadiation HardeningRoHS StatusJESD-609 CodeNumber of TerminationsECCN CodeTerminal FinishAdditional FeatureSubcategoryTerminal FormPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)JESD-30 CodeElement ConfigurationOperating ModeCase ConnectionTransistor ApplicationAvalanche Energy Rating (Eas)Surface MountTransistor Element MaterialTerminal PositionQualification StatusConfigurationDrain Current-Max (Abs) (ID)Drain-source On Resistance-MaxPulsed Drain Current-Max (IDM)DS Breakdown Voltage-MinView Compare
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IRF1324SPBFSurface MountSurface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB3D2PAK-55°C~175°C TJTubeHEXFET®2008Obsolete1 (Unlimited)SMD/SMT175°C-55°CMOSFET (Metal Oxide)1300W Tc300W17 nsN-Channel1.65mOhm @ 195A, 10V4V @ 250μA7590pF @ 24V195A Tc240nC @ 10V190ns24V10V±20V120 ns83 ns340A4V20V24V24V7.59nF1.65mOhm1.65 mΩ4 V4.826mm10.668mm9.65mmNo SVHCNoRoHS Compliant-------------------------
-
Surface MountSurface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB3--Tape & Reel (TR)HEXFET®2004Discontinued1 (Unlimited)-175°C-55°CMOSFET (Metal Oxide)13.8W Ta 160W Tc3.8W11 nsN-Channel36m Ω @ 22A, 10V4V @ 250μA1900pF @ 25V42A Tc110nC @ 10V56ns-10V±20V40 ns45 ns42A-20V100V-----4.826mm10.668mm9.65mm-NoROHS3 Compliante32EAR99Matte Tin (Sn) - with Nickel (Ni) barrierAVALANCHE RATED, HIGH RELIABILITYFET General Purpose PowerGULL WING26030R-PSSO-G2SingleENHANCEMENT MODEDRAINSWITCHING420 mJ---------
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-Surface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB---55°C~175°C TJTape & Reel (TR)HEXFET®1998Obsolete1 (Unlimited)---MOSFET (Metal Oxide)13.8W Ta 160W Tc--N-Channel36m Ω @ 22A, 10V4V @ 250μA1900pF @ 25V42A Tc110nC @ 10V-100V10V±20V----------------Non-RoHS Compliante32EAR99Matte Tin (Sn) - with Nickel (Ni) barrierAVALANCHE RATED, HIGH RELIABILITYFET General Purpose PowerGULL WING26030R-PSSO-G2-ENHANCEMENT MODEDRAINSWITCHING420 mJYESSILICONSINGLENot QualifiedSINGLE WITH BUILT-IN DIODE42A0.036Ohm140A100V
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-Surface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB---55°C~175°C TJTape & Reel (TR)HEXFET®2002Obsolete1 (Unlimited)---MOSFET (Metal Oxide)1180W Tc--N-Channel11m Ω @ 43A, 10V4V @ 250μA3210pF @ 25V85A Tc120nC @ 10V-55V10V±20V----------------Non-RoHS Compliante32EAR99Matte Tin (Sn) - with Nickel (Ni) barrierAVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCEFET General Purpose PowerGULL WING26030R-PSSO-G2-ENHANCEMENT MODEDRAINSWITCHING250 mJYESSILICONSINGLENot QualifiedSINGLE WITH BUILT-IN DIODE75A0.011Ohm290A55V
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