Infineon Technologies IRF1310NSTRRPBF
- Part Number:
- IRF1310NSTRRPBF
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 2854007-IRF1310NSTRRPBF
- Description:
- MOSFET N-CH 100V 42A D2PAK
- Datasheet:
- IRF1310NSTRRPBF
Infineon Technologies IRF1310NSTRRPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF1310NSTRRPBF.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / CaseTO-263-3, D2Pak (2 Leads Tab), TO-263AB
- Number of Pins3
- PackagingTape & Reel (TR)
- SeriesHEXFET®
- Published2004
- JESD-609 Codee3
- Part StatusDiscontinued
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations2
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn) - with Nickel (Ni) barrier
- Max Operating Temperature175°C
- Min Operating Temperature-55°C
- Additional FeatureAVALANCHE RATED, HIGH RELIABILITY
- SubcategoryFET General Purpose Power
- TechnologyMOSFET (Metal Oxide)
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)260
- Time@Peak Reflow Temperature-Max (s)30
- JESD-30 CodeR-PSSO-G2
- Number of Elements1
- Power Dissipation-Max3.8W Ta 160W Tc
- Element ConfigurationSingle
- Operating ModeENHANCEMENT MODE
- Power Dissipation3.8W
- Case ConnectionDRAIN
- Turn On Delay Time11 ns
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs36m Ω @ 22A, 10V
- Vgs(th) (Max) @ Id4V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds1900pF @ 25V
- Current - Continuous Drain (Id) @ 25°C42A Tc
- Gate Charge (Qg) (Max) @ Vgs110nC @ 10V
- Rise Time56ns
- Drive Voltage (Max Rds On,Min Rds On)10V
- Vgs (Max)±20V
- Fall Time (Typ)40 ns
- Turn-Off Delay Time45 ns
- Continuous Drain Current (ID)42A
- Gate to Source Voltage (Vgs)20V
- Drain to Source Breakdown Voltage100V
- Avalanche Energy Rating (Eas)420 mJ
- Height4.826mm
- Length10.668mm
- Width9.65mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
IRF1310NSTRRPBF Overview
In this case, the MOSFET is susceptible to avalanche breakdown, applied energy is termed avalanche energy, and the avalanche energy rating (Eas) for the MOSFET is 420 mJ.As an op amp's input capacitance parameter, CI, is defined as the capacitance between the input terminals when one input is grounded, this device's maximum input capacitance is 1900pF @ 25V.This device conducts a continuous drain current (ID) of 42A, which is the maximum continuous current transistor can conduct.Using VGS=100V and a specified value of ID, the drain-source breakdown voltage is VDS at which a specified value of ID flows. This device has a drain-source breakdown voltage of 100V (that is, no charge flow from drain to source).When the device is turned off, a turn-off delay time of 45 ns occurs as the input capacitance charges before drain current conduction commences.Before drain current conduction can begin, the device's turning-on delay time takes time to charge its input capacitance. This delay time is 11 ns.Voltage at the gate-source terminal of a FET transistor, called the gate-source voltage, or VGS, can be 20V.In order to reduce power consumption, this device uses a drive voltage of 10V volts (10V).
IRF1310NSTRRPBF Features
the avalanche energy rating (Eas) is 420 mJ
a continuous drain current (ID) of 42A
a drain-to-source breakdown voltage of 100V voltage
the turn-off delay time is 45 ns
IRF1310NSTRRPBF Applications
There are a lot of Infineon Technologies
IRF1310NSTRRPBF applications of single MOSFETs transistors.
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
In this case, the MOSFET is susceptible to avalanche breakdown, applied energy is termed avalanche energy, and the avalanche energy rating (Eas) for the MOSFET is 420 mJ.As an op amp's input capacitance parameter, CI, is defined as the capacitance between the input terminals when one input is grounded, this device's maximum input capacitance is 1900pF @ 25V.This device conducts a continuous drain current (ID) of 42A, which is the maximum continuous current transistor can conduct.Using VGS=100V and a specified value of ID, the drain-source breakdown voltage is VDS at which a specified value of ID flows. This device has a drain-source breakdown voltage of 100V (that is, no charge flow from drain to source).When the device is turned off, a turn-off delay time of 45 ns occurs as the input capacitance charges before drain current conduction commences.Before drain current conduction can begin, the device's turning-on delay time takes time to charge its input capacitance. This delay time is 11 ns.Voltage at the gate-source terminal of a FET transistor, called the gate-source voltage, or VGS, can be 20V.In order to reduce power consumption, this device uses a drive voltage of 10V volts (10V).
IRF1310NSTRRPBF Features
the avalanche energy rating (Eas) is 420 mJ
a continuous drain current (ID) of 42A
a drain-to-source breakdown voltage of 100V voltage
the turn-off delay time is 45 ns
IRF1310NSTRRPBF Applications
There are a lot of Infineon Technologies
IRF1310NSTRRPBF applications of single MOSFETs transistors.
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
IRF1310NSTRRPBF More Descriptions
MOSFET, Power;N-Ch;VDSS 100V;RDS(ON) 0.036Ohm;ID 42A;D2Pak;PD 160W;VGS /-20V
100V Single N-Channel HEXFET Power MOSFET in a D2-Pak package, D2PAK-3, RoHSInfineon SCT
Trans MOSFET N-CH 100V 42A 3-Pin(2 Tab) D2PAK T/R
Benefits: RoHS Compliant; Low RDS(on); Industry-leading quality; Dynamic dv/dt Rating; Fast Switching; Fully Avalanche Rated; 175C Operating Temperature
MOSFET; Transistor Type:MOSFET; Transistor Polarity:N Channel; Drain Source Voltage, Vds:100V; Continuous Drain Current, Id:42A; On Resistance, Rds(on):36mohm; Rds(on) Test Voltage, Vgs:10V; Package/Case:D2PAK ;RoHS Compliant: Yes
100V Single N-Channel HEXFET Power MOSFET in a D2-Pak package, D2PAK-3, RoHSInfineon SCT
Trans MOSFET N-CH 100V 42A 3-Pin(2 Tab) D2PAK T/R
Benefits: RoHS Compliant; Low RDS(on); Industry-leading quality; Dynamic dv/dt Rating; Fast Switching; Fully Avalanche Rated; 175C Operating Temperature
MOSFET; Transistor Type:MOSFET; Transistor Polarity:N Channel; Drain Source Voltage, Vds:100V; Continuous Drain Current, Id:42A; On Resistance, Rds(on):36mohm; Rds(on) Test Voltage, Vgs:10V; Package/Case:D2PAK ;RoHS Compliant: Yes
The three parts on the right have similar specifications to IRF1310NSTRRPBF.
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ImagePart NumberManufacturerMountMounting TypePackage / CaseNumber of PinsPackagingSeriesPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishMax Operating TemperatureMin Operating TemperatureAdditional FeatureSubcategoryTechnologyTerminal FormPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)JESD-30 CodeNumber of ElementsPower Dissipation-MaxElement ConfigurationOperating ModePower DissipationCase ConnectionTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Gate to Source Voltage (Vgs)Drain to Source Breakdown VoltageAvalanche Energy Rating (Eas)HeightLengthWidthRadiation HardeningRoHS StatusSupplier Device PackageOperating TemperatureTerminationDrain to Source Voltage (Vdss)Threshold VoltageDual Supply VoltageInput CapacitanceDrain to Source ResistanceRds On MaxNominal VgsREACH SVHCSurface MountTransistor Element MaterialTerminal PositionQualification StatusConfigurationDrain Current-Max (Abs) (ID)Drain-source On Resistance-MaxPulsed Drain Current-Max (IDM)DS Breakdown Voltage-MinView Compare
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IRF1310NSTRRPBFSurface MountSurface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB3Tape & Reel (TR)HEXFET®2004e3Discontinued1 (Unlimited)2EAR99Matte Tin (Sn) - with Nickel (Ni) barrier175°C-55°CAVALANCHE RATED, HIGH RELIABILITYFET General Purpose PowerMOSFET (Metal Oxide)GULL WING26030R-PSSO-G213.8W Ta 160W TcSingleENHANCEMENT MODE3.8WDRAIN11 nsN-ChannelSWITCHING36m Ω @ 22A, 10V4V @ 250μA1900pF @ 25V42A Tc110nC @ 10V56ns10V±20V40 ns45 ns42A20V100V420 mJ4.826mm10.668mm9.65mmNoROHS3 Compliant---------------------
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Surface MountSurface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB3TubeHEXFET®2008-Obsolete1 (Unlimited)---175°C-55°C--MOSFET (Metal Oxide)----1300W Tc--300W-17 nsN-Channel-1.65mOhm @ 195A, 10V4V @ 250μA7590pF @ 24V195A Tc240nC @ 10V190ns10V±20V120 ns83 ns340A20V24V-4.826mm10.668mm9.65mmNoRoHS CompliantD2PAK-55°C~175°C TJSMD/SMT24V4V24V7.59nF1.65mOhm1.65 mΩ4 VNo SVHC---------
-
-Surface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB-Tape & Reel (TR)HEXFET®2002-Obsolete1 (Unlimited)-------MOSFET (Metal Oxide)-----200W Tc-----N-Channel-12mOhm @ 50A, 10V4V @ 250μA3210pF @ 25V84A Tc130nC @ 10V-10V±20V----------Non-RoHS CompliantD2PAK-55°C~175°C TJ-60V----------------
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-Surface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB-Tape & Reel (TR)HEXFET®1998e3Obsolete1 (Unlimited)2EAR99Matte Tin (Sn) - with Nickel (Ni) barrier--AVALANCHE RATED, HIGH RELIABILITYFET General Purpose PowerMOSFET (Metal Oxide)GULL WING26030R-PSSO-G213.8W Ta 160W Tc-ENHANCEMENT MODE-DRAIN-N-ChannelSWITCHING36m Ω @ 22A, 10V4V @ 250μA1900pF @ 25V42A Tc110nC @ 10V-10V±20V-----420 mJ----Non-RoHS Compliant--55°C~175°C TJ-100V-------YESSILICONSINGLENot QualifiedSINGLE WITH BUILT-IN DIODE42A0.036Ohm140A100V
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