Infineon Technologies IRFR9N20DTRLPBF
- Part Number:
- IRFR9N20DTRLPBF
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 2850937-IRFR9N20DTRLPBF
- Description:
- MOSFET N-CH 200V 9.4A DPAK
- Datasheet:
- IRFR9N20DTRLPBF
Infineon Technologies IRFR9N20DTRLPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRFR9N20DTRLPBF.
- Factory Lead Time12 Weeks
- Mounting TypeSurface Mount
- Package / CaseTO-252-3, DPak (2 Leads Tab), SC-63
- Surface MountYES
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~175°C TJ
- PackagingTape & Reel (TR)
- SeriesHEXFET®
- Published2000
- JESD-609 Codee3
- Part StatusNot For New Designs
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations2
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn) - with Nickel (Ni) barrier
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionSINGLE
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)260
- Reach Compliance Codenot_compliant
- Time@Peak Reflow Temperature-Max (s)30
- JESD-30 CodeR-PSSO-G2
- Qualification StatusNot Qualified
- Number of Elements1
- ConfigurationSINGLE WITH BUILT-IN DIODE
- Power Dissipation-Max86W Tc
- Operating ModeENHANCEMENT MODE
- Case ConnectionDRAIN
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs380m Ω @ 5.6A, 10V
- Vgs(th) (Max) @ Id5.5V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds560pF @ 25V
- Current - Continuous Drain (Id) @ 25°C9.4A Tc
- Gate Charge (Qg) (Max) @ Vgs27nC @ 10V
- Drain to Source Voltage (Vdss)200V
- Drive Voltage (Max Rds On,Min Rds On)10V
- Vgs (Max)±30V
- JEDEC-95 CodeTO-252AA
- Drain Current-Max (Abs) (ID)9.4A
- Drain-source On Resistance-Max0.38Ohm
- Pulsed Drain Current-Max (IDM)38A
- DS Breakdown Voltage-Min200V
- Avalanche Energy Rating (Eas)100 mJ
- RoHS StatusROHS3 Compliant
IRFR9N20DTRLPBF Overview
As a result of avalanche breakdown, energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating is 100 mJ.CI refers to the capacitance between two input terminals on an op amp with either input grounded, and this device's maximum input capacitance is 560pF @ 25V.There is no drain current on this device since the maximum continuous current it can conduct is 9.4A.There is a peak drain current of 38A, its maximum pulsed drain current.In order for DS breakdown voltage to remain above 200V, it should remain above the 200V level.The transistor must receive a 200V drain to source voltage (Vdss) in order to function.In addition to reducing power consumption, this device uses drive voltage (10V).
IRFR9N20DTRLPBF Features
the avalanche energy rating (Eas) is 100 mJ
based on its rated peak drain current 38A.
a 200V drain to source voltage (Vdss)
IRFR9N20DTRLPBF Applications
There are a lot of Infineon Technologies
IRFR9N20DTRLPBF applications of single MOSFETs transistors.
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV,
Lighting, Server, Telecom and UPS.
As a result of avalanche breakdown, energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating is 100 mJ.CI refers to the capacitance between two input terminals on an op amp with either input grounded, and this device's maximum input capacitance is 560pF @ 25V.There is no drain current on this device since the maximum continuous current it can conduct is 9.4A.There is a peak drain current of 38A, its maximum pulsed drain current.In order for DS breakdown voltage to remain above 200V, it should remain above the 200V level.The transistor must receive a 200V drain to source voltage (Vdss) in order to function.In addition to reducing power consumption, this device uses drive voltage (10V).
IRFR9N20DTRLPBF Features
the avalanche energy rating (Eas) is 100 mJ
based on its rated peak drain current 38A.
a 200V drain to source voltage (Vdss)
IRFR9N20DTRLPBF Applications
There are a lot of Infineon Technologies
IRFR9N20DTRLPBF applications of single MOSFETs transistors.
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
Industrial Power Supplies
PFC stages, hard switching PWM stages and resonant switching
PWM stages for e.g. PC Silverbox, Adapter, LCD & PDP TV,
Lighting, Server, Telecom and UPS.
IRFR9N20DTRLPBF More Descriptions
Single N-Channel 200 V 0.38 Ohm 18 nC HEXFET® Power Mosfet - TO-252AA
200V Single N-Channel HEXFET Power MOSFET in a D-Pak package, DPAK-3, RoHSInfineon SCT
MOSFET; Transistor Type:MOSFET; Transistor Polarity:N Channel; Drain Source Voltage, Vds:200V; Continuous Drain Current, Id:9.4A; On Resistance, Rds(on):380mohm; Rds(on) Test Voltage, Vgs:10V; Package/Case:DPAK ;RoHS Compliant: Yes
Benefits: RoHS Compliant; Industry-leading quality; Fully Characterized Avalanche Voltage and Current; Low Gate-to-Drain Charge to Reduce Switching Losses; Fully Characterized Capacitance Including Effective Coss to Simplify Design
200V Single N-Channel HEXFET Power MOSFET in a D-Pak package, DPAK-3, RoHSInfineon SCT
MOSFET; Transistor Type:MOSFET; Transistor Polarity:N Channel; Drain Source Voltage, Vds:200V; Continuous Drain Current, Id:9.4A; On Resistance, Rds(on):380mohm; Rds(on) Test Voltage, Vgs:10V; Package/Case:DPAK ;RoHS Compliant: Yes
Benefits: RoHS Compliant; Industry-leading quality; Fully Characterized Avalanche Voltage and Current; Low Gate-to-Drain Charge to Reduce Switching Losses; Fully Characterized Capacitance Including Effective Coss to Simplify Design
The three parts on the right have similar specifications to IRFR9N20DTRLPBF.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountTransistor Element MaterialOperating TemperaturePackagingSeriesPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Reach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeQualification StatusNumber of ElementsConfigurationPower Dissipation-MaxOperating ModeCase ConnectionFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsDrain to Source Voltage (Vdss)Drive Voltage (Max Rds On,Min Rds On)Vgs (Max)JEDEC-95 CodeDrain Current-Max (Abs) (ID)Drain-source On Resistance-MaxPulsed Drain Current-Max (IDM)DS Breakdown Voltage-MinAvalanche Energy Rating (Eas)RoHS StatusMountContinuous Drain Current (ID)View Compare
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IRFR9N20DTRLPBF12 WeeksSurface MountTO-252-3, DPak (2 Leads Tab), SC-63YESSILICON-55°C~175°C TJTape & Reel (TR)HEXFET®2000e3Not For New Designs1 (Unlimited)2EAR99Matte Tin (Sn) - with Nickel (Ni) barrierMOSFET (Metal Oxide)SINGLEGULL WING260not_compliant30R-PSSO-G2Not Qualified1SINGLE WITH BUILT-IN DIODE86W TcENHANCEMENT MODEDRAINN-ChannelSWITCHING380m Ω @ 5.6A, 10V5.5V @ 250μA560pF @ 25V9.4A Tc27nC @ 10V200V10V±30VTO-252AA9.4A0.38Ohm38A200V100 mJROHS3 Compliant---
-
-Surface MountTO-252-3, DPak (2 Leads Tab), SC-63---55°C~175°C TJTape & Reel (TR)HEXFET®2004-Obsolete1 (Unlimited)---MOSFET (Metal Oxide)---------48W Tc--N-Channel-210m Ω @ 5.6A, 10V4V @ 250μA330pF @ 25V9.4A Ta25nC @ 10V100V10V±20V---------
-
-Surface MountTO-252-3, DPak (2 Leads Tab), SC-63---55°C~175°C TJTape & Reel (TR)HEXFET®2004-Obsolete1 (Unlimited)---MOSFET (Metal Oxide)---------144W Tc--N-Channel-260m Ω @ 8.4A, 10V5V @ 250μA810pF @ 25V14A Tc35nC @ 10V250V10V±30V---------
-
-Surface MountTO-252-3, DPak (2 Leads Tab), SC-63---55°C~150°C TJTape & Reel (TR)-2016-Active1 (Unlimited)---MOSFET (Metal Oxide)---------25W Tc--N-Channel-200m Ω @ 4.6A, 10V4V @ 250μA250pF @ 25V8.2A Tc10nC @ 10V50V10V±20V------Non-RoHS CompliantSurface Mount8.2A
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