IRF1503SPBF

Infineon Technologies IRF1503SPBF

Part Number:
IRF1503SPBF
Manufacturer:
Infineon Technologies
Ventron No:
3586701-IRF1503SPBF
Description:
MOSFET N-CH 30V 75A D2PAK
ECAD Model:
Datasheet:
IRF1503SPbF, IRF1503LPbF

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Specifications
Infineon Technologies IRF1503SPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF1503SPBF.
  • Factory Lead Time
    14 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
  • Number of Pins
    3
  • Operating Temperature
    -55°C~175°C TJ
  • Packaging
    Tube
  • Series
    HEXFET®
  • Published
    2010
  • Part Status
    Discontinued
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • ECCN Code
    EAR99
  • Resistance
    3.3MOhm
  • Voltage - Rated DC
    30V
  • Technology
    MOSFET (Metal Oxide)
  • Current Rating
    75A
  • Number of Elements
    1
  • Power Dissipation-Max
    200W Tc
  • Element Configuration
    Single
  • Power Dissipation
    200W
  • Turn On Delay Time
    17 ns
  • FET Type
    N-Channel
  • Rds On (Max) @ Id, Vgs
    3.3m Ω @ 140A, 10V
  • Vgs(th) (Max) @ Id
    4V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds
    5730pF @ 25V
  • Current - Continuous Drain (Id) @ 25°C
    75A Tc
  • Gate Charge (Qg) (Max) @ Vgs
    200nC @ 10V
  • Rise Time
    130ns
  • Drive Voltage (Max Rds On,Min Rds On)
    10V
  • Vgs (Max)
    ±20V
  • Forward Voltage
    1.3V
  • Fall Time (Typ)
    48 ns
  • Turn-Off Delay Time
    59 ns
  • Continuous Drain Current (ID)
    75A
  • Gate to Source Voltage (Vgs)
    20V
  • Drain to Source Breakdown Voltage
    30V
  • Nominal Vgs
    4 V
  • Height
    4.826mm
  • Length
    10.668mm
  • Width
    9.65mm
  • REACH SVHC
    No SVHC
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
IRF1503SPBF Overview
The input capacitance parameter, CI, is defined as the capacitance between the input terminals of an op amp with either input grounded, and this device's maximal input capacitance is 5730pF @ 25V.The drain current is the maximum continuous current the device can conduct, and the continuous drain current (ID) of this device is 75A. Drain-source breakdown voltage is the VDS at which a specified value of ID flows, with VGS=30V. And this device has 30V drain to source breakdown voltage.Turn-Off delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its turn-off delay time is 59 ns.Turn-on delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its delay time is 17 ns.The gate-source voltage, VGS, of a FET transistor is the voltage that falls across the gate-source terminal of the transistor and its voltage can be 20V.By using drive voltage (10V), this device helps reduce its overall power consumption.

IRF1503SPBF Features
a continuous drain current (ID) of 75A
a drain-to-source breakdown voltage of 30V voltage
the turn-off delay time is 59 ns


IRF1503SPBF Applications
There are a lot of Infineon Technologies
IRF1503SPBF applications of single MOSFETs transistors.


LCD/LED TV
Consumer Appliances
Lighting
Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
IRF1503SPBF More Descriptions
MOSFET, Power;N-Ch;VDSS 30V;RDS(ON) 2.6Milliohms;ID 75A;D2Pak;PD 200W;VGS /-20
Single N-Channel 30 V 3.3 mOhm 200 nC HEXFET® Power Mosfet - D2PAK
30V Single N-Channel HEXFET Power MOSFET in a D2-Pak package, D2PAK-3, RoHSInfineon SCT
Power Field-Effect Transistor, 75A I(D), 30V, 0.0033ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB
Benefits: RoHS Compliant; Low RDS(on); Industry-leading quality; Dynamic dv/dt Rating; Fast Switching; Fully Avalanche Rated; 175C Operating Temperature
MOSFET, N, 30V, 190A, D2-PAK; Transistor Type:MOSFET; Transistor Polarity:N; Voltage, Vds Typ:30V; Current, Id Cont:190A; Resistance, Rds On:0.0033ohm; Voltage, Vgs Rds on Measurement:10V; Voltage, Vgs th Typ:4V; Case Style:D2-PAK; Termination Type:SMD; Alternate Case Style:D2-PAK; Current, Idm Pulse:960A; Power Dissipation:200W; Power, Pd:200W; Resistance, Rds on @ Vgs = 10V:0.0033ohm; Thermal Resistance, Junction to Case A:0.75°C/W; Voltage, Vds:30V; Voltage, Vds Max:30V; Voltage, Vgs th Max:4V
Product Comparison
The three parts on the right have similar specifications to IRF1503SPBF.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Series
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    ECCN Code
    Resistance
    Voltage - Rated DC
    Technology
    Current Rating
    Number of Elements
    Power Dissipation-Max
    Element Configuration
    Power Dissipation
    Turn On Delay Time
    FET Type
    Rds On (Max) @ Id, Vgs
    Vgs(th) (Max) @ Id
    Input Capacitance (Ciss) (Max) @ Vds
    Current - Continuous Drain (Id) @ 25°C
    Gate Charge (Qg) (Max) @ Vgs
    Rise Time
    Drive Voltage (Max Rds On,Min Rds On)
    Vgs (Max)
    Forward Voltage
    Fall Time (Typ)
    Turn-Off Delay Time
    Continuous Drain Current (ID)
    Gate to Source Voltage (Vgs)
    Drain to Source Breakdown Voltage
    Nominal Vgs
    Height
    Length
    Width
    REACH SVHC
    Radiation Hardening
    RoHS Status
    Lead Free
    JESD-609 Code
    Number of Terminations
    Terminal Finish
    Max Operating Temperature
    Min Operating Temperature
    Additional Feature
    Subcategory
    Terminal Form
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Mode
    Case Connection
    Transistor Application
    Avalanche Energy Rating (Eas)
    Supplier Device Package
    Drain to Source Voltage (Vdss)
    Surface Mount
    Transistor Element Material
    Terminal Position
    Qualification Status
    Configuration
    Drain Current-Max (Abs) (ID)
    Drain-source On Resistance-Max
    Pulsed Drain Current-Max (IDM)
    DS Breakdown Voltage-Min
    View Compare
  • IRF1503SPBF
    IRF1503SPBF
    14 Weeks
    Surface Mount
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    3
    -55°C~175°C TJ
    Tube
    HEXFET®
    2010
    Discontinued
    1 (Unlimited)
    EAR99
    3.3MOhm
    30V
    MOSFET (Metal Oxide)
    75A
    1
    200W Tc
    Single
    200W
    17 ns
    N-Channel
    3.3m Ω @ 140A, 10V
    4V @ 250μA
    5730pF @ 25V
    75A Tc
    200nC @ 10V
    130ns
    10V
    ±20V
    1.3V
    48 ns
    59 ns
    75A
    20V
    30V
    4 V
    4.826mm
    10.668mm
    9.65mm
    No SVHC
    No
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IRF1310NSTRRPBF
    -
    Surface Mount
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    3
    -
    Tape & Reel (TR)
    HEXFET®
    2004
    Discontinued
    1 (Unlimited)
    EAR99
    -
    -
    MOSFET (Metal Oxide)
    -
    1
    3.8W Ta 160W Tc
    Single
    3.8W
    11 ns
    N-Channel
    36m Ω @ 22A, 10V
    4V @ 250μA
    1900pF @ 25V
    42A Tc
    110nC @ 10V
    56ns
    10V
    ±20V
    -
    40 ns
    45 ns
    42A
    20V
    100V
    -
    4.826mm
    10.668mm
    9.65mm
    -
    No
    ROHS3 Compliant
    -
    e3
    2
    Matte Tin (Sn) - with Nickel (Ni) barrier
    175°C
    -55°C
    AVALANCHE RATED, HIGH RELIABILITY
    FET General Purpose Power
    GULL WING
    260
    30
    R-PSSO-G2
    ENHANCEMENT MODE
    DRAIN
    SWITCHING
    420 mJ
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IRF1010ESTRR
    -
    -
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    -
    -55°C~175°C TJ
    Tape & Reel (TR)
    HEXFET®
    2002
    Obsolete
    1 (Unlimited)
    -
    -
    -
    MOSFET (Metal Oxide)
    -
    -
    200W Tc
    -
    -
    -
    N-Channel
    12mOhm @ 50A, 10V
    4V @ 250μA
    3210pF @ 25V
    84A Tc
    130nC @ 10V
    -
    10V
    ±20V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    D2PAK
    60V
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IRF1310NSTRR
    -
    -
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    -
    -55°C~175°C TJ
    Tape & Reel (TR)
    HEXFET®
    1998
    Obsolete
    1 (Unlimited)
    EAR99
    -
    -
    MOSFET (Metal Oxide)
    -
    1
    3.8W Ta 160W Tc
    -
    -
    -
    N-Channel
    36m Ω @ 22A, 10V
    4V @ 250μA
    1900pF @ 25V
    42A Tc
    110nC @ 10V
    -
    10V
    ±20V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    e3
    2
    Matte Tin (Sn) - with Nickel (Ni) barrier
    -
    -
    AVALANCHE RATED, HIGH RELIABILITY
    FET General Purpose Power
    GULL WING
    260
    30
    R-PSSO-G2
    ENHANCEMENT MODE
    DRAIN
    SWITCHING
    420 mJ
    -
    100V
    YES
    SILICON
    SINGLE
    Not Qualified
    SINGLE WITH BUILT-IN DIODE
    42A
    0.036Ohm
    140A
    100V
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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