Infineon Technologies IRF1405PBF
- Part Number:
- IRF1405PBF
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 2483251-IRF1405PBF
- Description:
- MOSFET N-CH 55V 169A TO-220AB
- Datasheet:
- IRF1405PBF
Infineon Technologies IRF1405PBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF1405PBF.
- Factory Lead Time12 Weeks
- MountThrough Hole
- Mounting TypeThrough Hole
- Package / CaseTO-220-3
- Number of Pins3
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~175°C TJ
- PackagingTube
- SeriesHEXFET®
- Published2004
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations3
- TerminationThrough Hole
- ECCN CodeEAR99
- Resistance5.3mOhm
- Additional FeatureAVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCE
- SubcategoryFET General Purpose Power
- Voltage - Rated DC55V
- TechnologyMOSFET (Metal Oxide)
- Current Rating169A
- Lead Pitch2.54mm
- Number of Elements1
- Number of Channels1
- Power Dissipation-Max330W Tc
- Element ConfigurationSingle
- Operating ModeENHANCEMENT MODE
- Power Dissipation330W
- Case ConnectionDRAIN
- Turn On Delay Time13 ns
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs5.3m Ω @ 101A, 10V
- Vgs(th) (Max) @ Id4V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds5480pF @ 25V
- Current - Continuous Drain (Id) @ 25°C169A Tc
- Gate Charge (Qg) (Max) @ Vgs260nC @ 10V
- Rise Time190ns
- Drive Voltage (Max Rds On,Min Rds On)10V
- Vgs (Max)±20V
- Fall Time (Typ)110 ns
- Turn-Off Delay Time130 ns
- Continuous Drain Current (ID)169A
- Threshold Voltage4V
- JEDEC-95 CodeTO-220AB
- Gate to Source Voltage (Vgs)20V
- Drain Current-Max (Abs) (ID)75A
- Drain to Source Breakdown Voltage55V
- Pulsed Drain Current-Max (IDM)680A
- Dual Supply Voltage55V
- Avalanche Energy Rating (Eas)560 mJ
- Recovery Time130 ns
- Max Junction Temperature (Tj)175°C
- Nominal Vgs4 V
- Height19.8mm
- Length10.668mm
- Width4.826mm
- REACH SVHCNo SVHC
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
IRF1405PBF Description
Modern processing methods are used in this Stripe Planar design of HEXFET? Power MOSFETs to produce extraordinarily low on-resistance per silicon area. This HEXFET power MOSFET also has increased repeating avalanche rating, a rapid switching speed, and a junction operating temperature of 175??C. These advantages work together to make this design a very effective and dependable tool for usage in a range of applications.
IRF1405PBF Features
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175??C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
IRF1405PBF Applications
Power Management
Consumer Electronics
Portable Devices
Industrial
Modern processing methods are used in this Stripe Planar design of HEXFET? Power MOSFETs to produce extraordinarily low on-resistance per silicon area. This HEXFET power MOSFET also has increased repeating avalanche rating, a rapid switching speed, and a junction operating temperature of 175??C. These advantages work together to make this design a very effective and dependable tool for usage in a range of applications.
IRF1405PBF Features
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175??C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
IRF1405PBF Applications
Power Management
Consumer Electronics
Portable Devices
Industrial
The three parts on the right have similar specifications to IRF1405PBF.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsTransistor Element MaterialOperating TemperaturePackagingSeriesPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminationECCN CodeResistanceAdditional FeatureSubcategoryVoltage - Rated DCTechnologyCurrent RatingLead PitchNumber of ElementsNumber of ChannelsPower Dissipation-MaxElement ConfigurationOperating ModePower DissipationCase ConnectionTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Threshold VoltageJEDEC-95 CodeGate to Source Voltage (Vgs)Drain Current-Max (Abs) (ID)Drain to Source Breakdown VoltagePulsed Drain Current-Max (IDM)Dual Supply VoltageAvalanche Energy Rating (Eas)Recovery TimeMax Junction Temperature (Tj)Nominal VgsHeightLengthWidthREACH SVHCRadiation HardeningRoHS StatusLead FreeSupplier Device PackageDrain to Source Voltage (Vdss)Surface MountJESD-609 CodeTerminal FinishTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)JESD-30 CodeQualification StatusConfigurationDrain-source On Resistance-MaxDS Breakdown Voltage-MinView Compare
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IRF1405PBF12 WeeksThrough HoleThrough HoleTO-220-33SILICON-55°C~175°C TJTubeHEXFET®2004Active1 (Unlimited)3Through HoleEAR995.3mOhmAVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCEFET General Purpose Power55VMOSFET (Metal Oxide)169A2.54mm11330W TcSingleENHANCEMENT MODE330WDRAIN13 nsN-ChannelSWITCHING5.3m Ω @ 101A, 10V4V @ 250μA5480pF @ 25V169A Tc260nC @ 10V190ns10V±20V110 ns130 ns169A4VTO-220AB20V75A55V680A55V560 mJ130 ns175°C4 V19.8mm10.668mm4.826mmNo SVHCNoROHS3 CompliantLead Free---------------
-
--Surface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB---55°C~175°C TJTape & Reel (TR)HEXFET®2002Obsolete1 (Unlimited)-------MOSFET (Metal Oxide)----200W Tc-----N-Channel-12mOhm @ 50A, 10V4V @ 250μA3210pF @ 25V84A Tc130nC @ 10V-10V±20V-------------------Non-RoHS Compliant-D2PAK60V------------
-
--Surface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB-SILICON-55°C~175°C TJTape & Reel (TR)HEXFET®1998Obsolete1 (Unlimited)2-EAR99-AVALANCHE RATED, HIGH RELIABILITYFET General Purpose Power-MOSFET (Metal Oxide)--1-3.8W Ta 160W Tc-ENHANCEMENT MODE-DRAIN-N-ChannelSWITCHING36m Ω @ 22A, 10V4V @ 250μA1900pF @ 25V42A Tc110nC @ 10V-10V±20V------42A-140A-420 mJ--------Non-RoHS Compliant--100VYESe3Matte Tin (Sn) - with Nickel (Ni) barrierSINGLEGULL WING26030R-PSSO-G2Not QualifiedSINGLE WITH BUILT-IN DIODE0.036Ohm100V
-
--Surface MountTO-263-3, D2Pak (2 Leads Tab), TO-263AB-SILICON-55°C~175°C TJTape & Reel (TR)HEXFET®2002Obsolete1 (Unlimited)2-EAR99-AVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCEFET General Purpose Power-MOSFET (Metal Oxide)--1-180W Tc-ENHANCEMENT MODE-DRAIN-N-ChannelSWITCHING11m Ω @ 43A, 10V4V @ 250μA3210pF @ 25V85A Tc120nC @ 10V-10V±20V------75A-290A-250 mJ--------Non-RoHS Compliant--55VYESe3Matte Tin (Sn) - with Nickel (Ni) barrierSINGLEGULL WING26030R-PSSO-G2Not QualifiedSINGLE WITH BUILT-IN DIODE0.011Ohm55V
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