IRF1018ESLPBF

Infineon Technologies IRF1018ESLPBF

Part Number:
IRF1018ESLPBF
Manufacturer:
Infineon Technologies
Ventron No:
3071751-IRF1018ESLPBF
Description:
MOSFET N-CH 60V 79A TO-262
ECAD Model:
Datasheet:
IRF1018ESLPBF

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Specifications
Infineon Technologies IRF1018ESLPBF technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IRF1018ESLPBF.
  • Mount
    Through Hole
  • Mounting Type
    Through Hole
  • Package / Case
    TO-262-3 Long Leads, I2Pak, TO-262AA
  • Number of Pins
    3
  • Transistor Element Material
    SILICON
  • Operating Temperature
    -55°C~175°C TJ
  • Packaging
    Tube
  • Series
    HEXFET®
  • Published
    2004
  • JESD-609 Code
    e3
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    3
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn) - with Nickel (Ni) barrier
  • Subcategory
    FET General Purpose Power
  • Technology
    MOSFET (Metal Oxide)
  • Terminal Position
    SINGLE
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    40
  • Number of Elements
    1
  • Configuration
    SINGLE WITH BUILT-IN DIODE
  • Power Dissipation-Max
    110W Tc
  • Operating Mode
    ENHANCEMENT MODE
  • Power Dissipation
    110W
  • Case Connection
    DRAIN
  • Turn On Delay Time
    13 ns
  • FET Type
    N-Channel
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    8.4m Ω @ 47A, 10V
  • Vgs(th) (Max) @ Id
    4V @ 100μA
  • Input Capacitance (Ciss) (Max) @ Vds
    2290pF @ 50V
  • Current - Continuous Drain (Id) @ 25°C
    79A Tc
  • Gate Charge (Qg) (Max) @ Vgs
    69nC @ 10V
  • Rise Time
    35ns
  • Drive Voltage (Max Rds On,Min Rds On)
    10V
  • Vgs (Max)
    ±20V
  • Fall Time (Typ)
    46 ns
  • Turn-Off Delay Time
    55 ns
  • Continuous Drain Current (ID)
    79A
  • Threshold Voltage
    4V
  • Gate to Source Voltage (Vgs)
    20V
  • Drain-source On Resistance-Max
    0.0084Ohm
  • Drain to Source Breakdown Voltage
    60V
  • Avalanche Energy Rating (Eas)
    88 mJ
  • Recovery Time
    39 ns
  • Height
    9.65mm
  • Length
    10.668mm
  • Width
    4.826mm
  • REACH SVHC
    No SVHC
  • Radiation Hardening
    No
  • RoHS Status
    RoHS Compliant
Description
IRF1018ESLPBF Overview
There is a phenomenon known as "avalanche break down", where avalanche energy is applied to the MOSFET and avalanche energy rating (Eas) is 88 mJ.Input capacitance, CI, is defined as the capacitance between two input terminals of an op amp with one input grounded, and the input capacitance of this device is 2290pF @ 50V.This device has a continuous drain current (ID) of [79A], which is its maximum continuous current.At a given drain-source breakdown voltage, a specified value of ID will flow. With VGS=60V, the drain-source breakdown voltage is 60V.The turn-off delay time of a device is the time it takes to charge its input capacitance before drain current can flow. The turn-off delay time of a device is 55 ns.During turn-on, the input capacitance of the device is charged before drain current conduction starts, so its delay time is 13 ns.Gate-source voltage, or VGS, is the voltage across a FET transistor's gate-source terminal, and can be 20V volts.Electrical devices have threshold voltages at which their operations become active, and this transistor has a threshold voltage of 4V.Its overall power consumption can be reduced by using drive voltage (10V).

IRF1018ESLPBF Features
the avalanche energy rating (Eas) is 88 mJ
a continuous drain current (ID) of 79A
a drain-to-source breakdown voltage of 60V voltage
the turn-off delay time is 55 ns
a threshold voltage of 4V


IRF1018ESLPBF Applications
There are a lot of Infineon Technologies
IRF1018ESLPBF applications of single MOSFETs transistors.


Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
IRF1018ESLPBF More Descriptions
Trans MOSFET N-CH 60V 79A 3-Pin(3 Tab) TO-262 Tube / MOSFET N-CH 60V 79A TO-262
60V Single N-Channel HEXFET Power MOSFET in a TO-262 package, TO262-3, RoHSInfineon SCT
MOSFET, N, TO-262; Transistor Polarity:N Channel; Continuous Drain Current Id:79A; Drain Source Voltage Vds:60V; On Resistance Rds(on):7.1mohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs Typ:4V; Power Dissipation Pd:110W; Operating Temperature Range:-55°C to 175°C; Transistor Case Style:TO-262; No. of Pins:3; SVHC:No SVHC (19-Dec-2011); Current Id Max:79A; Package / Case:TO-262; Power Dissipation Pd:110W; Pulse Current Idm:315A; Termination Type:Through Hole; Voltage Vds Typ:60V; Voltage Vgs Max:20V; Voltage Vgs Rds on Measurement:10V
Product Comparison
The three parts on the right have similar specifications to IRF1018ESLPBF.
  • Image
    Part Number
    Manufacturer
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Transistor Element Material
    Operating Temperature
    Packaging
    Series
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Subcategory
    Technology
    Terminal Position
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Number of Elements
    Configuration
    Power Dissipation-Max
    Operating Mode
    Power Dissipation
    Case Connection
    Turn On Delay Time
    FET Type
    Transistor Application
    Rds On (Max) @ Id, Vgs
    Vgs(th) (Max) @ Id
    Input Capacitance (Ciss) (Max) @ Vds
    Current - Continuous Drain (Id) @ 25°C
    Gate Charge (Qg) (Max) @ Vgs
    Rise Time
    Drive Voltage (Max Rds On,Min Rds On)
    Vgs (Max)
    Fall Time (Typ)
    Turn-Off Delay Time
    Continuous Drain Current (ID)
    Threshold Voltage
    Gate to Source Voltage (Vgs)
    Drain-source On Resistance-Max
    Drain to Source Breakdown Voltage
    Avalanche Energy Rating (Eas)
    Recovery Time
    Height
    Length
    Width
    REACH SVHC
    Radiation Hardening
    RoHS Status
    Max Operating Temperature
    Min Operating Temperature
    Additional Feature
    Terminal Form
    JESD-30 Code
    Element Configuration
    Surface Mount
    Qualification Status
    Drain to Source Voltage (Vdss)
    Drain Current-Max (Abs) (ID)
    Pulsed Drain Current-Max (IDM)
    DS Breakdown Voltage-Min
    View Compare
  • IRF1018ESLPBF
    IRF1018ESLPBF
    Through Hole
    Through Hole
    TO-262-3 Long Leads, I2Pak, TO-262AA
    3
    SILICON
    -55°C~175°C TJ
    Tube
    HEXFET®
    2004
    e3
    Obsolete
    1 (Unlimited)
    3
    EAR99
    Matte Tin (Sn) - with Nickel (Ni) barrier
    FET General Purpose Power
    MOSFET (Metal Oxide)
    SINGLE
    260
    40
    1
    SINGLE WITH BUILT-IN DIODE
    110W Tc
    ENHANCEMENT MODE
    110W
    DRAIN
    13 ns
    N-Channel
    SWITCHING
    8.4m Ω @ 47A, 10V
    4V @ 100μA
    2290pF @ 50V
    79A Tc
    69nC @ 10V
    35ns
    10V
    ±20V
    46 ns
    55 ns
    79A
    4V
    20V
    0.0084Ohm
    60V
    88 mJ
    39 ns
    9.65mm
    10.668mm
    4.826mm
    No SVHC
    No
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IRF1310NSTRRPBF
    Surface Mount
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    3
    -
    -
    Tape & Reel (TR)
    HEXFET®
    2004
    e3
    Discontinued
    1 (Unlimited)
    2
    EAR99
    Matte Tin (Sn) - with Nickel (Ni) barrier
    FET General Purpose Power
    MOSFET (Metal Oxide)
    -
    260
    30
    1
    -
    3.8W Ta 160W Tc
    ENHANCEMENT MODE
    3.8W
    DRAIN
    11 ns
    N-Channel
    SWITCHING
    36m Ω @ 22A, 10V
    4V @ 250μA
    1900pF @ 25V
    42A Tc
    110nC @ 10V
    56ns
    10V
    ±20V
    40 ns
    45 ns
    42A
    -
    20V
    -
    100V
    420 mJ
    -
    4.826mm
    10.668mm
    9.65mm
    -
    No
    ROHS3 Compliant
    175°C
    -55°C
    AVALANCHE RATED, HIGH RELIABILITY
    GULL WING
    R-PSSO-G2
    Single
    -
    -
    -
    -
    -
    -
  • IRF1310NSTRR
    -
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    -
    SILICON
    -55°C~175°C TJ
    Tape & Reel (TR)
    HEXFET®
    1998
    e3
    Obsolete
    1 (Unlimited)
    2
    EAR99
    Matte Tin (Sn) - with Nickel (Ni) barrier
    FET General Purpose Power
    MOSFET (Metal Oxide)
    SINGLE
    260
    30
    1
    SINGLE WITH BUILT-IN DIODE
    3.8W Ta 160W Tc
    ENHANCEMENT MODE
    -
    DRAIN
    -
    N-Channel
    SWITCHING
    36m Ω @ 22A, 10V
    4V @ 250μA
    1900pF @ 25V
    42A Tc
    110nC @ 10V
    -
    10V
    ±20V
    -
    -
    -
    -
    -
    0.036Ohm
    -
    420 mJ
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    -
    AVALANCHE RATED, HIGH RELIABILITY
    GULL WING
    R-PSSO-G2
    -
    YES
    Not Qualified
    100V
    42A
    140A
    100V
  • IRF1010NSTRR
    -
    Surface Mount
    TO-263-3, D2Pak (2 Leads Tab), TO-263AB
    -
    SILICON
    -55°C~175°C TJ
    Tape & Reel (TR)
    HEXFET®
    2002
    e3
    Obsolete
    1 (Unlimited)
    2
    EAR99
    Matte Tin (Sn) - with Nickel (Ni) barrier
    FET General Purpose Power
    MOSFET (Metal Oxide)
    SINGLE
    260
    30
    1
    SINGLE WITH BUILT-IN DIODE
    180W Tc
    ENHANCEMENT MODE
    -
    DRAIN
    -
    N-Channel
    SWITCHING
    11m Ω @ 43A, 10V
    4V @ 250μA
    3210pF @ 25V
    85A Tc
    120nC @ 10V
    -
    10V
    ±20V
    -
    -
    -
    -
    -
    0.011Ohm
    -
    250 mJ
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    -
    AVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCE
    GULL WING
    R-PSSO-G2
    -
    YES
    Not Qualified
    55V
    75A
    290A
    55V
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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