IXFX66N50Q2

IXYS IXFX66N50Q2

Part Number:
IXFX66N50Q2
Manufacturer:
IXYS
Ventron No:
2852400-IXFX66N50Q2
Description:
MOSFET N-CH 500V 66A PLUS247
ECAD Model:
Datasheet:
IXF(K,X)66N50Q2

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Specifications
IXYS IXFX66N50Q2 technical specifications, attributes, parameters and parts with similar specifications to IXYS IXFX66N50Q2.
  • Mount
    Through Hole
  • Mounting Type
    Through Hole
  • Package / Case
    TO-247-3
  • Number of Pins
    3
  • Transistor Element Material
    SILICON
  • Operating Temperature
    -55°C~150°C TJ
  • Packaging
    Tube
  • Series
    HiPerFET™
  • Published
    2004
  • JESD-609 Code
    e1
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    3
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Additional Feature
    AVALANCHE RATED
  • Subcategory
    FET General Purpose Power
  • Technology
    MOSFET (Metal Oxide)
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Pin Count
    3
  • Qualification Status
    Not Qualified
  • Number of Elements
    1
  • Power Dissipation-Max
    735W Tc
  • Element Configuration
    Single
  • Operating Mode
    ENHANCEMENT MODE
  • Power Dissipation
    735W
  • Case Connection
    DRAIN
  • FET Type
    N-Channel
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    80m Ω @ 500mA, 10V
  • Vgs(th) (Max) @ Id
    4.5V @ 8mA
  • Input Capacitance (Ciss) (Max) @ Vds
    9125pF @ 25V
  • Current - Continuous Drain (Id) @ 25°C
    66A Tc
  • Gate Charge (Qg) (Max) @ Vgs
    200nC @ 10V
  • Rise Time
    16ns
  • Drive Voltage (Max Rds On,Min Rds On)
    10V
  • Vgs (Max)
    ±30V
  • Fall Time (Typ)
    10 ns
  • Turn-Off Delay Time
    60 ns
  • Continuous Drain Current (ID)
    66A
  • Gate to Source Voltage (Vgs)
    30V
  • Drain-source On Resistance-Max
    0.08Ohm
  • Drain to Source Breakdown Voltage
    500V
  • Pulsed Drain Current-Max (IDM)
    264A
  • Avalanche Energy Rating (Eas)
    4000 mJ
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free
Description
IXFX66N50Q2 Overview
Avalanche breakdown occurs when energy is applied to the MOSFET, and the avalanche energy ratings (Eas) are 4000 mJ.A device's maximal input capacitance is 9125pF @ 25V, which is defined as the capacitance between its input terminals with either input grounded.This device's continuous drain current (ID) is 66A, which represents the maximum continuous current it can conduct.In this device, the drain-source breakdown voltage is 500V and the drain-source breakdown voltage is the VDS at which a specified value of ID flows.Its turn-off delay time is 60 ns, which is the time to charge the device's input capacitance before drain current conduction begins.In terms of pulsed drain current, it has a maximum of 264A, which is its maximum rated peak drain current.Gate-source voltage, or VGS, is the voltage across a FET transistor's gate-source terminal, and can be 30V volts.This device reduces its overall power consumption by using drive voltage (10V).

IXFX66N50Q2 Features
the avalanche energy rating (Eas) is 4000 mJ
a continuous drain current (ID) of 66A
a drain-to-source breakdown voltage of 500V voltage
the turn-off delay time is 60 ns
based on its rated peak drain current 264A.


IXFX66N50Q2 Applications
There are a lot of IXYS
IXFX66N50Q2 applications of single MOSFETs transistors.


Consumer Appliances
Lighting
Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
IXFX66N50Q2 More Descriptions
MOSFET N-CH 500V 66A PLUS247
new, original packaged
Contact for details
Product Comparison
The three parts on the right have similar specifications to IXFX66N50Q2.
  • Image
    Part Number
    Manufacturer
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Transistor Element Material
    Operating Temperature
    Packaging
    Series
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    Subcategory
    Technology
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    Qualification Status
    Number of Elements
    Power Dissipation-Max
    Element Configuration
    Operating Mode
    Power Dissipation
    Case Connection
    FET Type
    Transistor Application
    Rds On (Max) @ Id, Vgs
    Vgs(th) (Max) @ Id
    Input Capacitance (Ciss) (Max) @ Vds
    Current - Continuous Drain (Id) @ 25°C
    Gate Charge (Qg) (Max) @ Vgs
    Rise Time
    Drive Voltage (Max Rds On,Min Rds On)
    Vgs (Max)
    Fall Time (Typ)
    Turn-Off Delay Time
    Continuous Drain Current (ID)
    Gate to Source Voltage (Vgs)
    Drain-source On Resistance-Max
    Drain to Source Breakdown Voltage
    Pulsed Drain Current-Max (IDM)
    Avalanche Energy Rating (Eas)
    RoHS Status
    Lead Free
    Pbfree Code
    Factory Lead Time
    ECCN Code
    Resistance
    View Compare
  • IXFX66N50Q2
    IXFX66N50Q2
    Through Hole
    Through Hole
    TO-247-3
    3
    SILICON
    -55°C~150°C TJ
    Tube
    HiPerFET™
    2004
    e1
    Obsolete
    1 (Unlimited)
    3
    Tin/Silver/Copper (Sn/Ag/Cu)
    AVALANCHE RATED
    FET General Purpose Power
    MOSFET (Metal Oxide)
    NOT SPECIFIED
    NOT SPECIFIED
    3
    Not Qualified
    1
    735W Tc
    Single
    ENHANCEMENT MODE
    735W
    DRAIN
    N-Channel
    SWITCHING
    80m Ω @ 500mA, 10V
    4.5V @ 8mA
    9125pF @ 25V
    66A Tc
    200nC @ 10V
    16ns
    10V
    ±30V
    10 ns
    60 ns
    66A
    30V
    0.08Ohm
    500V
    264A
    4000 mJ
    RoHS Compliant
    Lead Free
    -
    -
    -
    -
    -
  • IXFX30N50Q
    Through Hole
    Through Hole
    TO-247-3
    3
    SILICON
    -55°C~150°C TJ
    Tube
    HiPerFET™
    2002
    e1
    Obsolete
    1 (Unlimited)
    3
    Tin/Silver/Copper (Sn/Ag/Cu)
    AVALANCHE RATED
    -
    MOSFET (Metal Oxide)
    NOT SPECIFIED
    NOT SPECIFIED
    3
    Not Qualified
    1
    416W Tc
    Single
    ENHANCEMENT MODE
    416W
    DRAIN
    N-Channel
    SWITCHING
    160m Ω @ 15A, 10V
    4.5V @ 4mA
    3950pF @ 25V
    30A Tc
    150nC @ 10V
    42ns
    10V
    ±20V
    20 ns
    75 ns
    30A
    20V
    0.16Ohm
    500V
    120A
    1500 mJ
    RoHS Compliant
    -
    yes
    -
    -
    -
  • IXFX120N25P
    Through Hole
    Through Hole
    TO-247-3
    3
    SILICON
    -55°C~175°C TJ
    Tube
    PolarHT™ HiPerFET™
    2006
    e1
    Active
    1 (Unlimited)
    3
    Tin/Silver/Copper (Sn/Ag/Cu)
    AVALANCHE RATED
    FET General Purpose Power
    MOSFET (Metal Oxide)
    NOT SPECIFIED
    NOT SPECIFIED
    3
    Not Qualified
    1
    700W Tc
    Single
    ENHANCEMENT MODE
    700W
    DRAIN
    N-Channel
    SWITCHING
    24m Ω @ 60A, 10V
    5V @ 4mA
    8000pF @ 25V
    120A Tc
    185nC @ 10V
    33ns
    10V
    ±20V
    33 ns
    130 ns
    120A
    20V
    -
    250V
    -
    2500 mJ
    ROHS3 Compliant
    Lead Free
    yes
    30 Weeks
    EAR99
    24MOhm
  • IXFX73N30Q
    Through Hole
    Through Hole
    TO-247-3
    3
    SILICON
    -55°C~150°C TJ
    Tube
    HiPerFET™
    2004
    e1
    Active
    1 (Unlimited)
    3
    Tin/Silver/Copper (Sn/Ag/Cu)
    AVALANCHE RATED
    -
    MOSFET (Metal Oxide)
    NOT SPECIFIED
    NOT SPECIFIED
    3
    Not Qualified
    1
    500W Tc
    Single
    ENHANCEMENT MODE
    500W
    DRAIN
    N-Channel
    SWITCHING
    45m Ω @ 500mA, 10V
    4V @ 4mA
    5400pF @ 25V
    73A Tc
    195nC @ 10V
    36ns
    10V
    ±30V
    12 ns
    82 ns
    73A
    30V
    0.045Ohm
    300V
    292A
    2500 mJ
    ROHS3 Compliant
    -
    yes
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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