Fairchild/ON Semiconductor FDD6680
- Part Number:
- FDD6680
- Manufacturer:
- Fairchild/ON Semiconductor
- Ventron No:
- 3071288-FDD6680
- Description:
- MOSFET N-CH 30V 12A DPAK
- Datasheet:
- FDD6680, FDU6680
Fairchild/ON Semiconductor FDD6680 technical specifications, attributes, parameters and parts with similar specifications to Fairchild/ON Semiconductor FDD6680.
- Mounting TypeSurface Mount
- Package / CaseTO-252-3, DPak (2 Leads Tab), SC-63
- Surface MountYES
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~175°C TJ
- PackagingTape & Reel (TR)
- SeriesPowerTrench®
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations2
- Terminal FinishMATTE TIN
- Additional FeatureLOGIC LEVEL COMPATIBLE
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionSINGLE
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)260
- Reach Compliance Codeunknown
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- Pin Count3
- JESD-30 CodeR-PSSO-G2
- Qualification StatusCOMMERCIAL
- Number of Elements1
- ConfigurationSINGLE WITH BUILT-IN DIODE
- Power Dissipation-Max3.3W Ta 56W Tc
- Operating ModeENHANCEMENT MODE
- Case ConnectionDRAIN
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs10m Ω @ 12A, 10V
- Vgs(th) (Max) @ Id3V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds1.23pF @ 15V
- Current - Continuous Drain (Id) @ 25°C12A Ta 46A Tc
- Gate Charge (Qg) (Max) @ Vgs18nC @ 5V
- Drain to Source Voltage (Vdss)30V
- Drive Voltage (Max Rds On,Min Rds On)4.5V 10V
- Vgs (Max)±20V
- Drain Current-Max (Abs) (ID)12A
- Drain-source On Resistance-Max0.01Ohm
- Pulsed Drain Current-Max (IDM)100A
- DS Breakdown Voltage-Min30V
- Avalanche Energy Rating (Eas)180 mJ
- RoHS StatusROHS3 Compliant
FDD6680 Overview
When a voltage exceeds breakdown voltage of a MOSFET, breakdown phenomena occurs and current flows. It's called “Avalanche break down”, and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 180 mJ.The input capacitance parameter, CI, is defined as the capacitance between the input terminals of an op amp with either input grounded, and this device's maximal input capacitance is 1.23pF @ 15V.The drain current is the maximum continuous current the device can conduct, and the drain current of this device is 12A.IDM is the maximum rated peak drain current for a power MOSFET, and its maximal pulsed drain current is 100A.Single MOSFETs transistor is recommended that the DS breakdown voltage be kept above 30V in order to maintain normal operation.Operating this transistor requires a 30V drain to source voltage (Vdss).By using drive voltage (4.5V 10V), this device helps reduce its overall power consumption.
FDD6680 Features
the avalanche energy rating (Eas) is 180 mJ
based on its rated peak drain current 100A.
a 30V drain to source voltage (Vdss)
FDD6680 Applications
There are a lot of Rochester Electronics, LLC
FDD6680 applications of single MOSFETs transistors.
LCD/LED TV
Consumer Appliances
Lighting
Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
When a voltage exceeds breakdown voltage of a MOSFET, breakdown phenomena occurs and current flows. It's called “Avalanche break down”, and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 180 mJ.The input capacitance parameter, CI, is defined as the capacitance between the input terminals of an op amp with either input grounded, and this device's maximal input capacitance is 1.23pF @ 15V.The drain current is the maximum continuous current the device can conduct, and the drain current of this device is 12A.IDM is the maximum rated peak drain current for a power MOSFET, and its maximal pulsed drain current is 100A.Single MOSFETs transistor is recommended that the DS breakdown voltage be kept above 30V in order to maintain normal operation.Operating this transistor requires a 30V drain to source voltage (Vdss).By using drive voltage (4.5V 10V), this device helps reduce its overall power consumption.
FDD6680 Features
the avalanche energy rating (Eas) is 180 mJ
based on its rated peak drain current 100A.
a 30V drain to source voltage (Vdss)
FDD6680 Applications
There are a lot of Rochester Electronics, LLC
FDD6680 applications of single MOSFETs transistors.
LCD/LED TV
Consumer Appliances
Lighting
Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
FDD6680 More Descriptions
MOSFET N-CH 30V 12A DPAK
Banana and Tip Connectors - Binding Posts Smooth, Spring Loaded Threaded and Turret Black Standard Brass Nickel Not Applicable 0.500 OD 12.70mm 2 Weeks CONN BIND POST SPRING-LOAD BLACK
MOSFET; Transistor Type:MOSFET; Transistor Polarity:N Channel; Continuous Drain Current, Id:56A; On Resistance, Rds(on):0.0095ohm; Package/Case:TO-252; Power Dissipation, Pd:60W; Drain Source On Resistance @ 10V:17ohm ;RoHS Compliant: No
Banana and Tip Connectors - Binding Posts Smooth, Spring Loaded Threaded and Turret Black Standard Brass Nickel Not Applicable 0.500 OD 12.70mm 2 Weeks CONN BIND POST SPRING-LOAD BLACK
MOSFET; Transistor Type:MOSFET; Transistor Polarity:N Channel; Continuous Drain Current, Id:56A; On Resistance, Rds(on):0.0095ohm; Package/Case:TO-252; Power Dissipation, Pd:60W; Drain Source On Resistance @ 10V:17ohm ;RoHS Compliant: No
The three parts on the right have similar specifications to FDD6680.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountTransistor Element MaterialOperating TemperaturePackagingSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishAdditional FeatureTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Reach Compliance CodeTime@Peak Reflow Temperature-Max (s)Pin CountJESD-30 CodeQualification StatusNumber of ElementsConfigurationPower Dissipation-MaxOperating ModeCase ConnectionFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsDrain to Source Voltage (Vdss)Drive Voltage (Max Rds On,Min Rds On)Vgs (Max)Drain Current-Max (Abs) (ID)Drain-source On Resistance-MaxPulsed Drain Current-Max (IDM)DS Breakdown Voltage-MinAvalanche Energy Rating (Eas)RoHS StatusSupplier Device PackageView Compare
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FDD6680Surface MountTO-252-3, DPak (2 Leads Tab), SC-63YESSILICON-55°C~175°C TJTape & Reel (TR)PowerTrench®e3yesObsolete1 (Unlimited)2MATTE TINLOGIC LEVEL COMPATIBLEMOSFET (Metal Oxide)SINGLEGULL WING260unknownNOT SPECIFIED3R-PSSO-G2COMMERCIAL1SINGLE WITH BUILT-IN DIODE3.3W Ta 56W TcENHANCEMENT MODEDRAINN-ChannelSWITCHING10m Ω @ 12A, 10V3V @ 250μA1.23pF @ 15V12A Ta 46A Tc18nC @ 5V30V4.5V 10V±20V12A0.01Ohm100A30V180 mJROHS3 Compliant--
-
Surface MountTO-252-3, DPak (2 Leads Tab), SC-63YESSILICON-55°C~175°C TJTape & Reel (TR)PowerTrench®--Obsolete1 (Unlimited)2--MOSFET (Metal Oxide)SINGLEGULL WING-unknown-3R-PSSO-G2COMMERCIAL1SINGLE WITH BUILT-IN DIODE3.7W Ta 31W TcENHANCEMENT MODEDRAINN-ChannelSWITCHING10.5m Ω @ 14.9A, 10V3V @ 250μA1.065pF @ 13V20A Ta27nC @ 10V25V4.5V 10V±20V20A0.0105Ohm100A25V12 mJROHS3 Compliant-
-
Surface MountTO-252-3, DPak (2 Leads Tab), SC-63---55°C~175°C TJTape & Reel (TR)PowerTrench®--Obsolete1 (Unlimited)---MOSFET (Metal Oxide)----------3.8W Ta 52W Tc--N-Channel-8mOhm @ 13A, 10V3V @ 250μA1.715pF @ 15V13A Ta 50A Tc24nC @ 5V30V4.5V 10V±16V-----ROHS3 CompliantD-PAK (TO-252)
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Surface MountTO-252-3, DPak (2 Leads Tab), SC-63YESSILICON-55°C~175°C TJTape & Reel (TR)PowerTrench®-yesObsolete1 (Unlimited)2NOT SPECIFIED-MOSFET (Metal Oxide)SINGLEGULL WINGNOT SPECIFIEDunknownNOT SPECIFIED3R-PSSO-G2COMMERCIAL1SINGLE WITH BUILT-IN DIODE71W TcENHANCEMENT MODEDRAINN-ChannelSWITCHING6m Ω @ 17A, 10V3V @ 250μA2.4pF @ 15V75A Ta31nC @ 5V30V4.5V 10V±20V75A0.006Ohm100A30V240 mJROHS3 Compliant-
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