Vishay Siliconix SI7840BDP-T1-GE3
- Part Number:
- SI7840BDP-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Ventron No:
- 3070717-SI7840BDP-T1-GE3
- Description:
- MOSFET N-CH 30V 11A PPAK SO-8
- Datasheet:
- SI7840BDP-T1-GE3
Vishay Siliconix SI7840BDP-T1-GE3 technical specifications, attributes, parameters and parts with similar specifications to Vishay Siliconix SI7840BDP-T1-GE3.
- Factory Lead Time15 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / CasePowerPAK® SO-8
- Weight506.605978mg
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~150°C TJ
- PackagingTape & Reel (TR)
- SeriesTrenchFET®
- Published2009
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations5
- ECCN CodeEAR99
- Terminal FinishPURE MATTE TIN
- SubcategoryFET General Purpose Powers
- TechnologyMOSFET (Metal Oxide)
- Terminal PositionDUAL
- Terminal FormC BEND
- Peak Reflow Temperature (Cel)260
- Time@Peak Reflow Temperature-Max (s)30
- JESD-30 CodeR-PDSO-C5
- Number of Elements1
- Number of Channels1
- Power Dissipation-Max1.8W Ta
- Element ConfigurationSingle
- Operating ModeENHANCEMENT MODE
- Case ConnectionDRAIN
- Turn On Delay Time17 ns
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs8.5m Ω @ 16.5A, 10V
- Vgs(th) (Max) @ Id3V @ 250μA
- Current - Continuous Drain (Id) @ 25°C11A Ta
- Gate Charge (Qg) (Max) @ Vgs21nC @ 4.5V
- Rise Time14ns
- Drain to Source Voltage (Vdss)30V
- Drive Voltage (Max Rds On,Min Rds On)4.5V 10V
- Vgs (Max)±20V
- Fall Time (Typ)14 ns
- Turn-Off Delay Time39 ns
- Continuous Drain Current (ID)11A
- Gate to Source Voltage (Vgs)20V
- Drain-source On Resistance-Max0.0085Ohm
- Pulsed Drain Current-Max (IDM)50A
- DS Breakdown Voltage-Min30V
- Avalanche Energy Rating (Eas)20 mJ
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
SI7840BDP-T1-GE3 Overview
When a voltage exceeds breakdown voltage of a MOSFET, breakdown phenomena occurs and current flows. It's called “Avalanche break down”, and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 20 mJ.The drain current is the maximum continuous current the device can conduct, and the continuous drain current (ID) of this device is 11A. Turn-Off delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its turn-off delay time is 39 ns.IDM is the maximum rated peak drain current for a power MOSFET, and its maximal pulsed drain current is 50A.Turn-on delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its delay time is 17 ns.The gate-source voltage, VGS, of a FET transistor is the voltage that falls across the gate-source terminal of the transistor and its voltage can be 20V.Single MOSFETs transistor is recommended that the DS breakdown voltage be kept above 30V in order to maintain normal operation.Operating this transistor requires a 30V drain to source voltage (Vdss).By using drive voltage (4.5V 10V), this device helps reduce its overall power consumption.
SI7840BDP-T1-GE3 Features
the avalanche energy rating (Eas) is 20 mJ
a continuous drain current (ID) of 11A
the turn-off delay time is 39 ns
based on its rated peak drain current 50A.
a 30V drain to source voltage (Vdss)
SI7840BDP-T1-GE3 Applications
There are a lot of Vishay Siliconix
SI7840BDP-T1-GE3 applications of single MOSFETs transistors.
LCD/LED TV
Consumer Appliances
Lighting
Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
When a voltage exceeds breakdown voltage of a MOSFET, breakdown phenomena occurs and current flows. It's called “Avalanche break down”, and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 20 mJ.The drain current is the maximum continuous current the device can conduct, and the continuous drain current (ID) of this device is 11A. Turn-Off delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its turn-off delay time is 39 ns.IDM is the maximum rated peak drain current for a power MOSFET, and its maximal pulsed drain current is 50A.Turn-on delay time is the time taken to charge the input capacitance of the device before drain current conduction can start, and its delay time is 17 ns.The gate-source voltage, VGS, of a FET transistor is the voltage that falls across the gate-source terminal of the transistor and its voltage can be 20V.Single MOSFETs transistor is recommended that the DS breakdown voltage be kept above 30V in order to maintain normal operation.Operating this transistor requires a 30V drain to source voltage (Vdss).By using drive voltage (4.5V 10V), this device helps reduce its overall power consumption.
SI7840BDP-T1-GE3 Features
the avalanche energy rating (Eas) is 20 mJ
a continuous drain current (ID) of 11A
the turn-off delay time is 39 ns
based on its rated peak drain current 50A.
a 30V drain to source voltage (Vdss)
SI7840BDP-T1-GE3 Applications
There are a lot of Vishay Siliconix
SI7840BDP-T1-GE3 applications of single MOSFETs transistors.
LCD/LED TV
Consumer Appliances
Lighting
Uninterruptible Power Supply
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
SI7840BDP-T1-GE3 More Descriptions
Trans MOSFET N-CH 30V 11A 8-Pin PowerPAK SO T/R
N-CH 30V (D-S) FAST SWITCHING MOSFET
MOSFET 30V 16.5A 4.1W 8.5mohm @ 10V
N-CH 30V (D-S) FAST SWITCHING MOSFET
MOSFET 30V 16.5A 4.1W 8.5mohm @ 10V
The three parts on the right have similar specifications to SI7840BDP-T1-GE3.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseWeightTransistor Element MaterialOperating TemperaturePackagingSeriesPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)JESD-30 CodeNumber of ElementsNumber of ChannelsPower Dissipation-MaxElement ConfigurationOperating ModeCase ConnectionTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrain to Source Voltage (Vdss)Drive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)Gate to Source Voltage (Vgs)Drain-source On Resistance-MaxPulsed Drain Current-Max (IDM)DS Breakdown Voltage-MinAvalanche Energy Rating (Eas)Radiation HardeningRoHS StatusNumber of PinsResistancePin CountPower DissipationInput Capacitance (Ciss) (Max) @ VdsThreshold VoltageDrain to Source Breakdown VoltageNominal VgsHeightLengthWidthREACH SVHCLead FreeTerminationAdditional FeatureDual Supply VoltageSupplier Device PackageMax Operating TemperatureMin Operating TemperatureDrain to Source ResistanceRds On MaxView Compare
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SI7840BDP-T1-GE315 WeeksSurface MountSurface MountPowerPAK® SO-8506.605978mgSILICON-55°C~150°C TJTape & Reel (TR)TrenchFET®2009e3yesObsolete1 (Unlimited)5EAR99PURE MATTE TINFET General Purpose PowersMOSFET (Metal Oxide)DUALC BEND26030R-PDSO-C5111.8W TaSingleENHANCEMENT MODEDRAIN17 nsN-ChannelSWITCHING8.5m Ω @ 16.5A, 10V3V @ 250μA11A Ta21nC @ 4.5V14ns30V4.5V 10V±20V14 ns39 ns11A20V0.0085Ohm50A30V20 mJNoROHS3 Compliant----------------------
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14 WeeksSurface Mount, Through HoleSurface MountPowerPAK® SO-8506.605978mgSILICON-55°C~150°C TJTape & Reel (TR)TrenchFET®2009e3yesActive1 (Unlimited)5EAR99Matte Tin (Sn)FET General Purpose PowersMOSFET (Metal Oxide)DUALC BEND26030R-XDSO-C5115.4W Ta 83W TcSingleENHANCEMENT MODEDRAIN20 nsN-ChannelSWITCHING3m Ω @ 20A, 10V3V @ 250μA40A Tc125nC @ 10V14ns-4.5V 10V±20V30 ns96 ns40A20V-70A--NoROHS3 Compliant83mOhm85.4W5600pF @ 15V1V30V1 V1.04mm4.9mm5.89mmUnknownLead Free--------
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-Surface MountSurface MountPowerPAK® SO-8506.605978mgSILICON-55°C~150°C TJTape & Reel (TR)TrenchFET®2009e3yesObsolete1 (Unlimited)5EAR99Matte Tin (Sn)FET General Purpose PowerMOSFET (Metal Oxide)DUALC BEND26040R-PDSO-C5111.9W TaSingleENHANCEMENT MODEDRAIN28 nsN-ChannelSWITCHING5.5m Ω @ 17A, 4.5V1.4V @ 250μA13A Ta30nC @ 4.5V32ns-2.5V 4.5V±8V32 ns82 ns13A8V-50A-7.2 mJNoROHS3 Compliant85.5mOhm85W-1.4V-1.4 V1.04mm4.9mm5.89mmNo SVHCLead FreeSMD/SMTFAST SWITCHING12V-----
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14 WeeksSurface MountSurface MountPowerPAK® 1212-8---55°C~150°C TJTape & Reel (TR)TrenchFET®2017--Active1 (Unlimited)----MOSFET (Metal Oxide)------11.5W TaSingle--8 nsN-Channel-18.5mOhm @ 10A, 10V1.8V @ 250μA6.5A Ta13nC @ 5V12ns30V4.5V 10V±20V12 ns32 ns10A20V----NoROHS3 Compliant818.5mOhm------1.04mm3.05mm3.05mm-Lead Free---PowerPAK® 1212-8150°C-55°C18.5mOhm18.5 mΩ
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