Microsemi Corporation A2F500M3G-1FGG256M

Name: A2F500M3G-1FGG256M
Brand: Microsemi Corporation
SKU: 3669308-A2F500M3G-1FGG256M
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F500M3G-1FGG256M

Manufacturer:: Microsemi Corporation

Ventron No:: 3669308-A2F500M3G-1FGG256M

Description:: IC FPGA 500K GATES 512KB 256FBGA

ECAD Model:

Datasheet:: A2F500M3G-1FGG256M

Specifications

Microsemi Corporation A2F500M3G-1FGG256M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F500M3G-1FGG256M.

Factory Lead Time
12 Weeks
Package / Case
256-LBGA
Number of Pins
256
Operating Temperature
-55°C~125°C TJ
Packaging
Tray
Series
SmartFusion®
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
HTS Code
8542.39.00.01
Frequency
100MHz
Base Part Number
A2F500M3G
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O
MCU - 25, FPGA - 66
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Primary Attributes
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size
512KB
RoHS Status
RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
The package or case for this product is a 256-LBGA, which is designed to withstand a wide range of operating temperatures from -55°C to 125°C TJ. It has a moisture sensitivity level (MSL) of 3, meaning it can be exposed to moisture for up to 168 hours without any negative effects. The base part number for this product is A2F500M3G, and it has a total of 25 I/O for the MCU and 66 for the FPGA. The connectivity options for this product include EBI/EMI, Ethernet, I2C, SPI, and UART/USART. The architecture of this product is a combination of both MCU and FPGA, with the core architecture being ARM. The primary attributes of this product include a ProASIC®3 FPGA with 500K gates and 11520 D-Flip-Flops. Additionally, this product is RoHS compliant, ensuring its environmental friendliness.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F500M3G-1FGG256M System On Chip (SoC) applications.

Measurement tools
External USB hard disk/SSD
AC-input BLDC motor drive
Sensor network-on-chip (sNoC)
DC-input BLDC motor drive
Efficient hardware for training of neural networks
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sequence controllers
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Flow Sensors

A2F500M3G-1FGG256M More Descriptions

FPGA SmartFusion 500K Gates 6000 Cells 100MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA
A2F500M3G-1Fgg256M 256 Lfbga 17X17X1.7Mm Tray Rohs Compliant: Yes |Microchip A2F500M3G-1FGG256M
IC SOC CORTEX-M3 100MHZ 256FBGA
IC FPGA 500K GATES 512KB 256FBGA

Product Comparison

The three parts on the right have similar specifications to A2F500M3G-1FGG256M.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Number of Pins

Operating Temperature

Packaging

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Frequency

Base Part Number

Interface

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Primary Attributes

Flash Size

RoHS Status

Mount

Supplier Device Package

Published

Max Operating Temperature

Min Operating Temperature

Operating Supply Voltage

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Speed

Data Rate

Number of Logic Elements/Cells

Number of Gates

Max Frequency

Speed Grade

Number of Registers

Radiation Hardening

Number of Logic Blocks (LABs)

Lead Free

View Compare
A2F500M3G-1FGG256M

Microsemi Corporation

12 Weeks

256-LBGA

256

-55°C~125°C TJ

Tray

SmartFusion®

Active

3 (168 Hours)

8542.39.00.01

100MHz

A2F500M3G

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 25, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
A2F500M3G-FGG256M

Microsemi Corporation

12 Weeks

256-LBGA

256

-55°C~125°C TJ

Tray

SmartFusion®

Active

3 (168 Hours)

-

80MHz

A2F500M3G

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 25, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

A2F500M3G-1FGG256M vs A2F500M3G-FGG256M
A2F500M3G-1FGG484

Microsemi Corporation

12 Weeks

484-BGA

484

0°C~85°C TJ

Tray

SmartFusion®

Active

3 (168 Hours)

-

100MHz

A2F500M3G

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 41, FPGA - 128

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

RoHS Compliant

Surface Mount

484-FPBGA (23x23)

2011

85°C

0°C

1.5V

1.575V

1.425V

13.5kB

16.5mA

100MHz

400 kbps

5500

500000

120MHz

1

11520

No

-

-

A2F500M3G-1FGG256M vs A2F500M3G-1FGG484
A2F500M3G-FG484

Microsemi Corporation

16 Weeks

484-BGA

484

0°C~85°C TJ

Tray

SmartFusion®

Active

3 (168 Hours)

-

80MHz

A2F500M3G

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 41, FPGA - 128

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

Non-RoHS Compliant

-

484-FPBGA (23x23)

2015

85°C

0°C

1.5V

1.575V

1.425V

-

2mA

80MHz

-

-

500000

100MHz

-

-

-

24

Lead Free

A2F500M3G-1FGG256M vs A2F500M3G-FG484