Microsemi Corporation A2F500M3G-FG484M

Name: A2F500M3G-FG484M
Brand: Microsemi Corporation
SKU: 3669379-A2F500M3G-FG484M
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F500M3G-FG484M

Manufacturer:: Microsemi Corporation

Ventron No:: 3669379-A2F500M3G-FG484M

Description:: IC FPGA 500K GATES 512KB 484FBGA

ECAD Model:

Datasheet:: A2F500M3G-FG484M

Specifications

Microsemi Corporation A2F500M3G-FG484M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F500M3G-FG484M.

Factory Lead Time
12 Weeks
Package / Case
484-BGA
Surface Mount
YES
Operating Temperature
-55°C~125°C TJ
Packaging
Tray
Series
SmartFusion®
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
484
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1.5V
Terminal Pitch
1mm
Frequency
80MHz
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
A2F500M3G
JESD-30 Code
S-PBGA-B484
Supply Voltage-Max (Vsup)
1.575V
Supply Voltage-Min (Vsup)
1.425V
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O
MCU - 41, FPGA - 128
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Organization
11520 CLBS, 500000 GATES
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Core Architecture
ARM
Primary Attributes
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Equivalent Gates
500000
Flash Size
512KB
Height Seated (Max)
2.44mm
Length
23mm
Width
23mm
RoHS Status
Non-RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
The SmartFusion® series, with a base part number of A2F500M3G, is a highly advanced product that utilizes CMOS technology. It is classified under ECCN Code 3A001.A.2.C, making it suitable for a wide range of applications. This product features a powerful ARM® Cortex®-M3 core processor, along with various peripherals such as DMA, POR, and WDT. The programmable logic type is a FIELD PROGRAMMABLE GATE ARRAY, providing flexibility and versatility in its functionality. The reflow temperature-max (s) is not specified, giving users the freedom to customize it according to their specific needs. With a supply voltage-min (Vsup) of 1.425V and a height seated (max) of 2.44mm, this product offers excellent performance and reliability.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F500M3G-FG484M System On Chip (SoC) applications.

Flow Sensors
Special Issue Editors
Print Special Issue Flyer
AC-input BLDC motor drive
Digital Signal Processing
Smart appliances
Automotive
sequence controllers
Level
Automotive gateway

A2F500M3G-FG484M More Descriptions

FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 484-Pin FBGA
A2F500M3G-Fg484M 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip A2F500M3G-FG484M
Field Programmable Gate Array, 11520 CLBs, 500000 Gates, CMOS, PBGA484
IC FPGA 500K GATES 512KB 484FBGA
IC SOC CORTEX-M3 80MHZ 484FBGA
SMARTFUSION INTELLIGENT MIXED-SIGNAL FPGA

Product Comparison

The three parts on the right have similar specifications to A2F500M3G-FG484M.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Series

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

Base Part Number

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Interface

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Organization

Programmable Logic Type

Core Architecture

Primary Attributes

Number of Equivalent Gates

Flash Size

Height Seated (Max)

Length

Width

RoHS Status

Number of Pins

Supplier Device Package

Published

Max Operating Temperature

Min Operating Temperature

Operating Supply Voltage

Speed

Number of Gates

Max Frequency

Number of Logic Blocks (LABs)

Speed Grade

Number of Registers

Radiation Hardening

Reach Compliance Code

Mount

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Data Rate

Number of Logic Elements/Cells

View Compare
A2F500M3G-FG484M

Microsemi Corporation

12 Weeks

484-BGA

YES

-55°C~125°C TJ

Tray

SmartFusion®

Active

3 (168 Hours)

484

3A001.A.2.C

8542.39.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

1.5V

1mm

80MHz

NOT SPECIFIED

A2F500M3G

S-PBGA-B484

1.575V

1.425V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 41, FPGA - 128

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

11520 CLBS, 500000 GATES

FIELD PROGRAMMABLE GATE ARRAY

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

500000

512KB

2.44mm

23mm

23mm

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
A2F500M3G-1FG256

Microsemi Corporation

12 Weeks

256-LBGA

-

0°C~85°C TJ

Tray

SmartFusion®

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

100MHz

-

A2F500M3G

-

-

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 25, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

-

-

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

-

512KB

-

-

-

Non-RoHS Compliant

256

256-FPBGA (17x17)

2009

85°C

0°C

1.5V

100MHz

500000

120MHz

24

1

11520

No

-

-

-

-

-

-

-

-

A2F500M3G-FG484M vs A2F500M3G-1FG256
A2F500M3G-1FG484M

Microsemi Corporation

12 Weeks

484-BGA

-

-55°C~125°C TJ

Tray

SmartFusion®

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

100MHz

-

A2F500M3G

-

-

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 41, FPGA - 128

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

-

-

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

-

512KB

-

-

-

Non-RoHS Compliant

484

-

-

-

-

1.5V

-

-

-

-

1

11520

-

unknown

-

-

-

-

-

-

-

A2F500M3G-FG484M vs A2F500M3G-1FG484M
A2F500M3G-1FGG484

Microsemi Corporation

12 Weeks

484-BGA

-

0°C~85°C TJ

Tray

SmartFusion®

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

100MHz

-

A2F500M3G

-

-

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 41, FPGA - 128

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

-

-

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

-

512KB

-

-

-

RoHS Compliant

484

484-FPBGA (23x23)

2011

85°C

0°C

1.5V

100MHz

500000

120MHz

-

1

11520

No

-

Surface Mount

1.575V

1.425V

13.5kB

16.5mA

400 kbps

5500

A2F500M3G-FG484M vs A2F500M3G-1FGG484