Microsemi Corporation A2F500M3G-1FG256

Name: A2F500M3G-1FG256
Brand: Microsemi Corporation
SKU: 4544088-A2F500M3G-1FG256
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F500M3G-1FG256

Manufacturer:: Microsemi Corporation

Ventron No:: 4544088-A2F500M3G-1FG256

Description:: IC FPGA 500K GATES 512KB 256-BGA

ECAD Model:

Datasheet:: A2F500M3G-1FG256

Specifications

Microsemi Corporation A2F500M3G-1FG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F500M3G-1FG256.

Factory Lead Time
12 Weeks
Package / Case
256-LBGA
Number of Pins
256
Supplier Device Package
256-FPBGA (17x17)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
SmartFusion®
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Frequency
100MHz
Base Part Number
A2F500M3G
Operating Supply Voltage
1.5V
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O
MCU - 25, FPGA - 66
Speed
100MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Number of Gates
500000
Max Frequency
120MHz
Number of Logic Blocks (LABs)
24
Speed Grade
1
Primary Attributes
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Registers
11520
Flash Size
512KB
Radiation Hardening
No
RoHS Status
Non-RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
The device in question boasts an impressive number of features and specifications. With a total of 256 pins and a 256-FPBGA supplier device package measuring 17x17, it offers a wide range of capabilities. Its part status is active, indicating that it is readily available for use. Additionally, it has a moisture sensitivity level (MSL) of 3, meaning it can withstand up to 168 hours of exposure to moisture. With a maximum operating temperature of 85°C, it can handle demanding environments. Its interface includes EBI/EMI, Ethernet, I2C, SPI, UART, and USART, providing flexibility in connectivity. The device also boasts a speed of 100MHz and a speed grade of 1, ensuring efficient performance. With a flash size of 512KB, it offers ample storage for data and programs.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F500M3G-1FG256 System On Chip (SoC) applications.

AC-input BLDC motor drive
Embedded systems
External USB hard disk/SSD
ARM Cortex M4 microcontroller
sequence controllers
Robotics
RISC-V
Industrial transport
Video Imaging
Central alarm system

A2F500M3G-1FG256 More Descriptions

FPGA SmartFusion Family 500K Gates 100MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA
A2F500M3G-1Fg256 256 Lfbga 17X17X1.7Mm Tray Rohs Compliant: Yes |Microchip A2F500M3G-1FG256
IC FPGA 500K GATES 512KB 256-BGA
IC SOC CORTEX-M3 100MHZ 256FBGA

Product Comparison

The three parts on the right have similar specifications to A2F500M3G-1FG256.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Number of Pins

Supplier Device Package

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Operating Supply Voltage

Interface

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Number of Gates

Max Frequency

Number of Logic Blocks (LABs)

Speed Grade

Primary Attributes

Number of Registers

Flash Size

Radiation Hardening

RoHS Status

HTS Code

Mount

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Data Rate

Number of Logic Elements/Cells

Lead Free

View Compare
A2F500M3G-1FG256

Microsemi Corporation

12 Weeks

256-LBGA

256

256-FPBGA (17x17)

0°C~85°C TJ

Tray

2009

SmartFusion®

Active

3 (168 Hours)

85°C

0°C

100MHz

A2F500M3G

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 25, FPGA - 66

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

ARM

500000

120MHz

24

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

512KB

No

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-
A2F500M3G-1FGG256M

Microsemi Corporation

12 Weeks

256-LBGA

256

-

-55°C~125°C TJ

Tray

-

SmartFusion®

Active

3 (168 Hours)

-

-

100MHz

A2F500M3G

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 25, FPGA - 66

-

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

ARM

-

-

-

-

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

-

512KB

-

RoHS Compliant

8542.39.00.01

-

-

-

-

-

-

-

-

A2F500M3G-1FG256 vs A2F500M3G-1FGG256M
A2F500M3G-1FGG484

Microsemi Corporation

12 Weeks

484-BGA

484

484-FPBGA (23x23)

0°C~85°C TJ

Tray

2011

SmartFusion®

Active

3 (168 Hours)

85°C

0°C

100MHz

A2F500M3G

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 41, FPGA - 128

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

ARM

500000

120MHz

-

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

512KB

No

RoHS Compliant

-

Surface Mount

1.575V

1.425V

13.5kB

16.5mA

400 kbps

5500

-

A2F500M3G-1FG256 vs A2F500M3G-1FGG484
A2F500M3G-FG484

Microsemi Corporation

16 Weeks

484-BGA

484

484-FPBGA (23x23)

0°C~85°C TJ

Tray

2015

SmartFusion®

Active

3 (168 Hours)

85°C

0°C

80MHz

A2F500M3G

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 41, FPGA - 128

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

ARM

500000

100MHz

24

-

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

-

512KB

-

Non-RoHS Compliant

-

-

1.575V

1.425V

-

2mA

-

-

Lead Free

A2F500M3G-1FG256 vs A2F500M3G-FG484