Microsemi Corporation A2F500M3G-1CSG288

Name: A2F500M3G-1CSG288
Brand: Microsemi Corporation
SKU: 4544155-A2F500M3G-1CSG288
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F500M3G-1CSG288

Manufacturer:: Microsemi Corporation

Ventron No:: 4544155-A2F500M3G-1CSG288

Description:: IC FPGA 500K GATES 512KB 288-CSP

ECAD Model:

Datasheet:: A2F500M3G-1CSG288

Specifications

Microsemi Corporation A2F500M3G-1CSG288 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F500M3G-1CSG288.

Factory Lead Time
12 Weeks
Package / Case
288-TFBGA, CSPBGA
Supplier Device Package
288-CSP (11x11)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2015
Series
SmartFusion®
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Frequency
100MHz
Base Part Number
A2F500M3G
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O
MCU - 31, FPGA - 78
Speed
100MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Primary Attributes
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size
512KB
RoHS Status
RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
The SmartFusion® series, published in 2015, features the A2F500M3G base part number. It has a moisture sensitivity level (MSL) of 3, meaning it can withstand 168 hours of exposure to moisture. With a minimum operating temperature of 0°C, this product is suitable for a variety of environments. It offers a range of connectivity options, including EBI/EMI, Ethernet, I2C, SPI, and UART/USART. The core architecture is ARM, and it has a flash size of 512KB. This product is also RoHS compliant.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F500M3G-1CSG288 System On Chip (SoC) applications.

Robotics
Personal Computers
Transmitters
Central inverter
Functional safety for critical applications in the industrial sectors
Mobile market
Automated sorting equipment
RISC-V
Networked sensors
Efficient hardware for inference of neural networks

A2F500M3G-1CSG288 More Descriptions

A2F500M3G-1Csg288 288 Tfbga 11X11X1.05Mm Tray Rohs Compliant: Yes |Microchip A2F500M3G-1CSG288
FPGA 11520 CLBS 500000 GATES PBGA288
IC SOC CORTEX-M3 100MHZ 484FBGA
IC FPGA 500K GATES 512KB 288-CSP

Product Comparison

The three parts on the right have similar specifications to A2F500M3G-1CSG288.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Supplier Device Package

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Interface

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Primary Attributes

Flash Size

RoHS Status

Number of Pins

Reach Compliance Code

Operating Supply Voltage

Speed Grade

Number of Registers

HTS Code

Mount

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Data Rate

Number of Logic Elements/Cells

Number of Gates

Max Frequency

Radiation Hardening

View Compare
A2F500M3G-1CSG288

Microsemi Corporation

12 Weeks

288-TFBGA, CSPBGA

288-CSP (11x11)

0°C~85°C TJ

Tray

2015

SmartFusion®

Active

3 (168 Hours)

85°C

0°C

100MHz

A2F500M3G

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 31, FPGA - 78

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
A2F500M3G-1FG484M

Microsemi Corporation

12 Weeks

484-BGA

-

-55°C~125°C TJ

Tray

-

SmartFusion®

Active

3 (168 Hours)

-

-

100MHz

A2F500M3G

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 41, FPGA - 128

-

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

Non-RoHS Compliant

484

unknown

1.5V

1

11520

-

-

-

-

-

-

-

-

-

-

-

A2F500M3G-1CSG288 vs A2F500M3G-1FG484M
A2F500M3G-1FGG256M

Microsemi Corporation

12 Weeks

256-LBGA

-

-55°C~125°C TJ

Tray

-

SmartFusion®

Active

3 (168 Hours)

-

-

100MHz

A2F500M3G

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 25, FPGA - 66

-

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

RoHS Compliant

256

-

-

-

-

8542.39.00.01

-

-

-

-

-

-

-

-

-

-

A2F500M3G-1CSG288 vs A2F500M3G-1FGG256M
A2F500M3G-1FGG484

Microsemi Corporation

12 Weeks

484-BGA

484-FPBGA (23x23)

0°C~85°C TJ

Tray

2011

SmartFusion®

Active

3 (168 Hours)

85°C

0°C

100MHz

A2F500M3G

EBI/EMI, Ethernet, I2C, SPI, UART, USART

MCU - 41, FPGA - 128

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

RoHS Compliant

484

-

1.5V

1

11520

-

Surface Mount

1.575V

1.425V

13.5kB

16.5mA

400 kbps

5500

500000

120MHz

No

A2F500M3G-1CSG288 vs A2F500M3G-1FGG484