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Altera 10AS027E2F27E1HG
- Part Number:
- 10AS027E2F27E1HG
- Manufacturer:
- Altera
- Ventron No:
- 4544375-10AS027E2F27E1HG
- Description:
- IC SOC FPGA 240 I/O 672FBGA
- ECAD Model:
-
- Datasheet:
- Arria 10 Device Datasheet
Altera 10AS027E2F27E1HG technical specifications, attributes, parameters and parts with similar specifications to Altera 10AS027E2F27E1HG.
- Package / Case672-BBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- SeriesArria 10 SX
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of I/O240
- Speed1.5GHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA, POR, WDT
- ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesFPGA - 270K Logic Elements
- RoHS StatusRoHS Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).According to the manufacturer, this system on a chip has a package of 672-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Arria 10 SX is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.Taking note of the fact that this SoC security combines FPGA - 270K Logic Elements is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 240 I/Os.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
10AS027E2F27E1HG System On Chip (SoC) applications.
Keyboard
Smart appliances
Communication interfaces ( I2C, SPI )
Networked sensors
Networked Media Encode/Decode
Remote control
Functional safety for critical applications in the aerospace
Keywords
External USB hard disk/SSD
Cyberphysical system-on-chip
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).According to the manufacturer, this system on a chip has a package of 672-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Arria 10 SX is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.Taking note of the fact that this SoC security combines FPGA - 270K Logic Elements is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 240 I/Os.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
10AS027E2F27E1HG System On Chip (SoC) applications.
Keyboard
Smart appliances
Communication interfaces ( I2C, SPI )
Networked sensors
Networked Media Encode/Decode
Remote control
Functional safety for critical applications in the aerospace
Keywords
External USB hard disk/SSD
Cyberphysical system-on-chip
10AS027E2F27E1HG More Descriptions
IC SOC FPGA 240 I/O 672FBGA Arria 10 SX
0°C~100°C TJ System On ChipArria 10 SX Series 240 I/O
IC SOC CORTEX-A9 1.5GHZ 672FBGA
0°C~100°C TJ System On ChipArria 10 SX Series 240 I/O
IC SOC CORTEX-A9 1.5GHZ 672FBGA
The three parts on the right have similar specifications to 10AS027E2F27E1HG.
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ImagePart NumberManufacturerPackage / CaseOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusFactory Lead TimeSurface MountNumber of TerminationsHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of InputsProgrammable Logic TypeNumber of Logic CellsHeight Seated (Max)LengthWidthView Compare
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10AS027E2F27E1HG672-BBGA, FCBGA0°C~100°C TJTrayArria 10 SXActive3 (168 Hours)2401.5GHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA, POR, WDTEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAFPGA - 270K Logic ElementsRoHS Compliant------------------------- -
780-BBGA, FCBGA-40°C~100°C TJTrayArria 10 SXActive3 (168 Hours)2881.5GHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA, POR, WDTEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAFPGA - 220K Logic ElementsRoHS Compliant8 Weeks-----------------------
-
780-BBGA, FCBGA0°C~100°C TJTrayArria 10 SXDiscontinued3 (168 Hours)2881.5GHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA, POR, WDTEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAFPGA - 160K Logic ElementsRoHS Compliant-YES7808542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED0.9V1mmNOT SPECIFIEDS-PBGA-B780288Not Qualified0.93V0.9V0.87V288FIELD PROGRAMMABLE GATE ARRAY1600003.35mm29mm29mm
-
672-BBGA, FCBGA-40°C~100°C TJTrayArria 10 SXActive3 (168 Hours)2401.5GHz256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA, POR, WDTEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAFPGA - 270K Logic ElementsRoHS Compliant------------------------
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