A2F500M3G-1FG484M

Microsemi Corporation A2F500M3G-1FG484M

Part Number:
A2F500M3G-1FG484M
Manufacturer:
Microsemi Corporation
Ventron No:
3669388-A2F500M3G-1FG484M
Description:
IC FPGA 500K GATES 512KB 484FBGA
ECAD Model:
Datasheet:
A2F500M3G-1FG484M

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Specifications
Microsemi Corporation A2F500M3G-1FG484M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F500M3G-1FG484M.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    484-BGA
  • Number of Pins
    484
  • Operating Temperature
    -55°C~125°C TJ
  • Packaging
    Tray
  • Series
    SmartFusion®
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Reach Compliance Code
    unknown
  • Frequency
    100MHz
  • Base Part Number
    A2F500M3G
  • Operating Supply Voltage
    1.5V
  • Interface
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
  • Number of I/O
    MCU - 41, FPGA - 128
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DMA, POR, WDT
  • Connectivity
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Architecture
    MCU, FPGA
  • Core Architecture
    ARM
  • Speed Grade
    1
  • Primary Attributes
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Number of Registers
    11520
  • Flash Size
    512KB
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The Moisture Sensitivity Level (MSL) of this particular product is rated at level 3 for a duration of 168 hours. The Reach Compliance Code for this product is currently unknown. The frequency at which this product operates is 100MHz. The base part number for this product is A2F500M3G. The operating supply voltage for this product is 1.5V. The interface for this product includes EBI/EMI, Ethernet, I2C, SPI, UART, and USART. The core processor for this product is the ARM® Cortex®-M3, and the core architecture is ARM. This product has a total of 11520 registers. Additionally, the flash size for this product is 512KB. Overall, this product is equipped with advanced technology and specifications to ensure optimal performance.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F500M3G-1FG484M System On Chip (SoC) applications.

Industrial sectors
Industrial automation devices
Industrial AC-DC
String inverter
Wireless networking
Temperature
DC-input BLDC motor drive
Vending machines
Automotive gateway
POS Terminals
A2F500M3G-1FG484M More Descriptions
FPGA SmartFusion 500K Gates 100MHz 130nm (CMOS) Technology 1.5V 484-Pin FPBGA
A2F500M3G-1Fg484M 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip A2F500M3G-1FG484M
FPGA - Field Programmable Gate Array SmartFusion
IC FPGA 500K GATES 512KB 484FBGA
IC SOC CORTEX-M3 100MHZ 484FBGA
Product Comparison
The three parts on the right have similar specifications to A2F500M3G-1FG484M.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Reach Compliance Code
    Frequency
    Base Part Number
    Operating Supply Voltage
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Core Architecture
    Speed Grade
    Primary Attributes
    Number of Registers
    Flash Size
    RoHS Status
    Mount
    Published
    JESD-609 Code
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Number of Outputs
    Qualification Status
    Power Supplies
    Max Supply Voltage
    Min Supply Voltage
    Memory Size
    Operating Supply Current
    Data Rate
    Programmable Logic Type
    Number of Logic Elements/Cells
    Number of Gates
    Height Seated (Max)
    Length
    Width
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Speed
    Max Frequency
    Radiation Hardening
    View Compare
  • A2F500M3G-1FG484M
    A2F500M3G-1FG484M
    12 Weeks
    484-BGA
    484
    -55°C~125°C TJ
    Tray
    SmartFusion®
    Active
    3 (168 Hours)
    unknown
    100MHz
    A2F500M3G
    1.5V
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    MCU - 41, FPGA - 128
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    MCU, FPGA
    ARM
    1
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    11520
    512KB
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F500M3G-1FGG484I
    12 Weeks
    484-BGA
    484
    -40°C~100°C TJ
    Tray
    SmartFusion®
    Active
    3 (168 Hours)
    -
    100MHz
    A2F500M3G
    1.5V
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    MCU - 41, FPGA - 128
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    MCU, FPGA
    ARM
    -
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    -
    512KB
    RoHS Compliant
    Surface Mount
    2015
    e1
    484
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    250
    1.5V
    1mm
    30
    128
    Not Qualified
    1.51.82.53.3V
    1.575V
    1.425V
    13.5kB
    16.5mA
    400 kbps
    FIELD PROGRAMMABLE GATE ARRAY
    5500
    500000
    2.44mm
    23mm
    23mm
    -
    -
    -
    -
    -
    -
  • A2F500M3G-1FGG256M
    12 Weeks
    256-LBGA
    256
    -55°C~125°C TJ
    Tray
    SmartFusion®
    Active
    3 (168 Hours)
    -
    100MHz
    A2F500M3G
    -
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    MCU - 25, FPGA - 66
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    MCU, FPGA
    ARM
    -
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    -
    512KB
    RoHS Compliant
    -
    -
    -
    -
    -
    8542.39.00.01
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F500M3G-1FGG484
    12 Weeks
    484-BGA
    484
    0°C~85°C TJ
    Tray
    SmartFusion®
    Active
    3 (168 Hours)
    -
    100MHz
    A2F500M3G
    1.5V
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    MCU - 41, FPGA - 128
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    MCU, FPGA
    ARM
    1
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    11520
    512KB
    RoHS Compliant
    Surface Mount
    2011
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1.575V
    1.425V
    13.5kB
    16.5mA
    400 kbps
    -
    5500
    500000
    -
    -
    -
    484-FPBGA (23x23)
    85°C
    0°C
    100MHz
    120MHz
    No
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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