A2F500M3G-1FGG484

Microsemi Corporation A2F500M3G-1FGG484

Part Number:
A2F500M3G-1FGG484
Manufacturer:
Microsemi Corporation
Ventron No:
3668954-A2F500M3G-1FGG484
Description:
IC FPGA 512K FLASH 484FBGA
ECAD Model:
Datasheet:
A2F500M3G-1FGG484

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Specifications
Microsemi Corporation A2F500M3G-1FGG484 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F500M3G-1FGG484.
  • Factory Lead Time
    12 Weeks
  • Mount
    Surface Mount
  • Package / Case
    484-BGA
  • Number of Pins
    484
  • Supplier Device Package
    484-FPBGA (23x23)
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2011
  • Series
    SmartFusion®
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    0°C
  • Frequency
    100MHz
  • Base Part Number
    A2F500M3G
  • Operating Supply Voltage
    1.5V
  • Interface
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
  • Max Supply Voltage
    1.575V
  • Min Supply Voltage
    1.425V
  • Memory Size
    13.5kB
  • Operating Supply Current
    16.5mA
  • Number of I/O
    MCU - 41, FPGA - 128
  • Speed
    100MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DMA, POR, WDT
  • Connectivity
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Data Rate
    400 kbps
  • Architecture
    MCU, FPGA
  • Number of Logic Elements/Cells
    5500
  • Core Architecture
    ARM
  • Number of Gates
    500000
  • Max Frequency
    120MHz
  • Speed Grade
    1
  • Primary Attributes
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Number of Registers
    11520
  • Flash Size
    512KB
  • Radiation Hardening
    No
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 484-BGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion? is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.One important thing to mark down is that this SoC meaning combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.This SoC system on a chip has been designed in a state-of-the-art Tray package.MCU - 41, FPGA - 128 I/Os in total are included in this SoC part.This flash has a size of 512KB.You can get system on chips with similar specs and purposes by searching A2F500M3G.100MHz is the wireless SoC's frequency.In terms of core architecture, the SoC meaning relies on ARM.This is the version with 484 pins.It just takes 0°C for the SoC computing to start up, and that is all it needs.This SoC system on chip operates at a maximum design temperature of 85°C.The maximum supply voltage is rated as 1.575V.It is supplied with at least 1.425V power.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F500M3G-1FGG484 System On Chip (SoC) applications.

Temperature
Industrial transport
Samsung galaxy gear
Networked sensors
ARM support modules
Apple smart watch
Remote control
Functional safety for critical applications in the aerospace
Medical
Sensor network-on-chip (sNoC)
A2F500M3G-1FGG484 More Descriptions
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 484-Pin FBGA Tray
A2F500M3G-1Fgg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip A2F500M3G-1FGG484
FPGA - Field Programmable Gate Array SmartFusion
IC SOC CORTEX-M3 100MHZ 484FBGA
IC SOC CORTEX-A9 667MHZ 225BGA
French Electronic Distributor since 1988
Product Comparison
The three parts on the right have similar specifications to A2F500M3G-1FGG484.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Package / Case
    Number of Pins
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Operating Supply Voltage
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Memory Size
    Operating Supply Current
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Data Rate
    Architecture
    Number of Logic Elements/Cells
    Core Architecture
    Number of Gates
    Max Frequency
    Speed Grade
    Primary Attributes
    Number of Registers
    Flash Size
    Radiation Hardening
    RoHS Status
    Reach Compliance Code
    Surface Mount
    Number of Terminations
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Organization
    Programmable Logic Type
    Number of Equivalent Gates
    Height Seated (Max)
    Length
    Width
    View Compare
  • A2F500M3G-1FGG484
    A2F500M3G-1FGG484
    12 Weeks
    Surface Mount
    484-BGA
    484
    484-FPBGA (23x23)
    0°C~85°C TJ
    Tray
    2011
    SmartFusion®
    Active
    3 (168 Hours)
    85°C
    0°C
    100MHz
    A2F500M3G
    1.5V
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    1.575V
    1.425V
    13.5kB
    16.5mA
    MCU - 41, FPGA - 128
    100MHz
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    400 kbps
    MCU, FPGA
    5500
    ARM
    500000
    120MHz
    1
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    11520
    512KB
    No
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F500M3G-1FG484M
    12 Weeks
    -
    484-BGA
    484
    -
    -55°C~125°C TJ
    Tray
    -
    SmartFusion®
    Active
    3 (168 Hours)
    -
    -
    100MHz
    A2F500M3G
    1.5V
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    -
    -
    -
    -
    MCU - 41, FPGA - 128
    -
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    -
    MCU, FPGA
    -
    ARM
    -
    -
    1
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    11520
    512KB
    -
    Non-RoHS Compliant
    unknown
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F500M3G-FGG256M
    12 Weeks
    -
    256-LBGA
    256
    -
    -55°C~125°C TJ
    Tray
    -
    SmartFusion®
    Active
    3 (168 Hours)
    -
    -
    80MHz
    A2F500M3G
    -
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    -
    -
    -
    -
    MCU - 25, FPGA - 66
    -
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    -
    MCU, FPGA
    -
    ARM
    -
    -
    -
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    -
    512KB
    -
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F500M3G-1PQG208
    12 Weeks
    -
    208-BFQFP
    208
    -
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®
    Active
    3 (168 Hours)
    -
    -
    100MHz
    A2F500M3G
    1.5V
    Ethernet, I2C, SPI, UART, USART
    1.575V
    1.425V
    -
    -
    MCU - 22, FPGA - 66
    -
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    Ethernet, I2C, SPI, UART/USART
    -
    MCU, FPGA
    -
    ARM
    -
    -
    -
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    -
    512KB
    -
    RoHS Compliant
    -
    YES
    208
    Pure Matte Tin (Sn)
    8542.39.00.01
    CMOS
    QUAD
    GULL WING
    245
    1.5V
    0.5mm
    30
    11520 CLBS, 500000 GATES
    FIELD PROGRAMMABLE GATE ARRAY
    500000
    4.1mm
    28mm
    28mm
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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