Microsemi Corporation A2F500M3G-1FGG484
- Part Number:
- A2F500M3G-1FGG484
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3668954-A2F500M3G-1FGG484
- Description:
- IC FPGA 512K FLASH 484FBGA
- Datasheet:
- A2F500M3G-1FGG484
Microsemi Corporation A2F500M3G-1FGG484 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F500M3G-1FGG484.
- Factory Lead Time12 Weeks
- MountSurface Mount
- Package / Case484-BGA
- Number of Pins484
- Supplier Device Package484-FPBGA (23x23)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2011
- SeriesSmartFusion®
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Frequency100MHz
- Base Part NumberA2F500M3G
- Operating Supply Voltage1.5V
- InterfaceEBI/EMI, Ethernet, I2C, SPI, UART, USART
- Max Supply Voltage1.575V
- Min Supply Voltage1.425V
- Memory Size13.5kB
- Operating Supply Current16.5mA
- Number of I/OMCU - 41, FPGA - 128
- Speed100MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDMA, POR, WDT
- ConnectivityEBI/EMI, Ethernet, I2C, SPI, UART/USART
- Data Rate400 kbps
- ArchitectureMCU, FPGA
- Number of Logic Elements/Cells5500
- Core ArchitectureARM
- Number of Gates500000
- Max Frequency120MHz
- Speed Grade1
- Primary AttributesProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
- Number of Registers11520
- Flash Size512KB
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 484-BGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion? is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.One important thing to mark down is that this SoC meaning combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.This SoC system on a chip has been designed in a state-of-the-art Tray package.MCU - 41, FPGA - 128 I/Os in total are included in this SoC part.This flash has a size of 512KB.You can get system on chips with similar specs and purposes by searching A2F500M3G.100MHz is the wireless SoC's frequency.In terms of core architecture, the SoC meaning relies on ARM.This is the version with 484 pins.It just takes 0°C for the SoC computing to start up, and that is all it needs.This SoC system on chip operates at a maximum design temperature of 85°C.The maximum supply voltage is rated as 1.575V.It is supplied with at least 1.425V power.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F500M3G-1FGG484 System On Chip (SoC) applications.
Temperature
Industrial transport
Samsung galaxy gear
Networked sensors
ARM support modules
Apple smart watch
Remote control
Functional safety for critical applications in the aerospace
Medical
Sensor network-on-chip (sNoC)
A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 484-BGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion? is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.One important thing to mark down is that this SoC meaning combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.This SoC system on a chip has been designed in a state-of-the-art Tray package.MCU - 41, FPGA - 128 I/Os in total are included in this SoC part.This flash has a size of 512KB.You can get system on chips with similar specs and purposes by searching A2F500M3G.100MHz is the wireless SoC's frequency.In terms of core architecture, the SoC meaning relies on ARM.This is the version with 484 pins.It just takes 0°C for the SoC computing to start up, and that is all it needs.This SoC system on chip operates at a maximum design temperature of 85°C.The maximum supply voltage is rated as 1.575V.It is supplied with at least 1.425V power.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F500M3G-1FGG484 System On Chip (SoC) applications.
Temperature
Industrial transport
Samsung galaxy gear
Networked sensors
ARM support modules
Apple smart watch
Remote control
Functional safety for critical applications in the aerospace
Medical
Sensor network-on-chip (sNoC)
A2F500M3G-1FGG484 More Descriptions
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 484-Pin FBGA Tray
A2F500M3G-1Fgg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip A2F500M3G-1FGG484
FPGA - Field Programmable Gate Array SmartFusion
IC SOC CORTEX-M3 100MHZ 484FBGA
IC SOC CORTEX-A9 667MHZ 225BGA
French Electronic Distributor since 1988
A2F500M3G-1Fgg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip A2F500M3G-1FGG484
FPGA - Field Programmable Gate Array SmartFusion
IC SOC CORTEX-M3 100MHZ 484FBGA
IC SOC CORTEX-A9 667MHZ 225BGA
French Electronic Distributor since 1988
The three parts on the right have similar specifications to A2F500M3G-1FGG484.
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ImagePart NumberManufacturerFactory Lead TimeMountPackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberOperating Supply VoltageInterfaceMax Supply VoltageMin Supply VoltageMemory SizeOperating Supply CurrentNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityData RateArchitectureNumber of Logic Elements/CellsCore ArchitectureNumber of GatesMax FrequencySpeed GradePrimary AttributesNumber of RegistersFlash SizeRadiation HardeningRoHS StatusReach Compliance CodeSurface MountNumber of TerminationsTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)OrganizationProgrammable Logic TypeNumber of Equivalent GatesHeight Seated (Max)LengthWidthView Compare
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A2F500M3G-1FGG48412 WeeksSurface Mount484-BGA484484-FPBGA (23x23)0°C~85°C TJTray2011SmartFusion®Active3 (168 Hours)85°C0°C100MHzA2F500M3G1.5VEBI/EMI, Ethernet, I2C, SPI, UART, USART1.575V1.425V13.5kB16.5mAMCU - 41, FPGA - 128100MHz64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART400 kbpsMCU, FPGA5500ARM500000120MHz1ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops11520512KBNoRoHS Compliant-------------------
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12 Weeks-484-BGA484--55°C~125°C TJTray-SmartFusion®Active3 (168 Hours)--100MHzA2F500M3G1.5VEBI/EMI, Ethernet, I2C, SPI, UART, USART----MCU - 41, FPGA - 128-64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART-MCU, FPGA-ARM--1ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops11520512KB-Non-RoHS Compliantunknown-----------------
-
12 Weeks-256-LBGA256--55°C~125°C TJTray-SmartFusion®Active3 (168 Hours)--80MHzA2F500M3G-EBI/EMI, Ethernet, I2C, SPI, UART, USART----MCU - 25, FPGA - 66-64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART-MCU, FPGA-ARM---ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops-512KB-RoHS Compliant------------------
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12 Weeks-208-BFQFP208-0°C~85°C TJTray2015SmartFusion®Active3 (168 Hours)--100MHzA2F500M3G1.5VEthernet, I2C, SPI, UART, USART1.575V1.425V--MCU - 22, FPGA - 66-64KBARM® Cortex®-M3DMA, POR, WDTEthernet, I2C, SPI, UART/USART-MCU, FPGA-ARM---ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops-512KB-RoHS Compliant-YES208Pure Matte Tin (Sn)8542.39.00.01CMOSQUADGULL WING2451.5V0.5mm3011520 CLBS, 500000 GATESFIELD PROGRAMMABLE GATE ARRAY5000004.1mm28mm28mm
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