A2F200M3F-1CS288I

Microsemi Corporation A2F200M3F-1CS288I

Part Number:
A2F200M3F-1CS288I
Manufacturer:
Microsemi Corporation
Ventron No:
5037452-A2F200M3F-1CS288I
Description:
IC FPGA 200K GATES 256KB 288-CSP
ECAD Model:
Datasheet:
A2F200M3F-1CS288I

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Specifications
Microsemi Corporation A2F200M3F-1CS288I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-1CS288I.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    288-TFBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2013
  • Series
    SmartFusion®
  • JESD-609 Code
    e0
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    288
  • Terminal Finish
    TIN LEAD SILVER
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    235
  • Supply Voltage
    1.5V
  • Terminal Pitch
    0.5mm
  • Frequency
    100MHz
  • Reflow Temperature-Max (s)
    20
  • Base Part Number
    A2F200
  • JESD-30 Code
    S-PBGA-B288
  • Number of Outputs
    78
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.575V
  • Power Supplies
    1.51.82.53.3V
  • Supply Voltage-Min (Vsup)
    1.425V
  • Interface
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
  • Number of I/O
    MCU - 31, FPGA - 78
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DMA, POR, WDT
  • Connectivity
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Architecture
    MCU, FPGA
  • Number of Inputs
    78
  • Organization
    4608 CLBS, 200000 GATES
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Core Architecture
    ARM
  • Primary Attributes
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
  • Number of Equivalent Gates
    200000
  • Flash Size
    256KB
  • Height Seated (Max)
    1.05mm
  • Length
    11mm
  • Width
    11mm
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The Microsemi Corporation is a well-known brand in the electronics industry, specializing in the production of high-quality Embedded-System On Chip (SoC) chips. This particular chip falls under the category of Embedded-System On Chip (SoC), which is a type of integrated circuit that combines multiple components into a single chip. This makes it a highly efficient and compact solution for various electronic devices. One of the key features of this chip is its surface mount capability, which allows for easy installation on a circuit board. This greatly simplifies the manufacturing process and reduces production costs. Additionally, the chip is packaged in a tray, providing protection and organization during shipping and storage. In terms of technical specifications, the Moisture Sensitivity Level (MSL) of this chip is 3, meaning it can withstand exposure to a relative humidity of 30-60% for up to 168 hours. The Peak Reflow Temperature (Cel) is 235, indicating the maximum temperature at which the chip can be exposed during the soldering process. The frequency of this chip is 100MHz, making it suitable for a wide range of applications. It also has multiple power supplies, including 1.5V, 1.8V, 2.5V, and 3.3V, providing flexibility for different power requirements. The minimum supply voltage (Vsup) is 1.425V, ensuring stable performance even at lower voltages. Connectivity is another important aspect of this chip, with options for EBI/EMI, Ethernet, I2C, SPI, and UART/USART. This allows for seamless communication with other devices and systems. Furthermore, this chip utilizes Field Programmable Gate Array (FPGA) technology, which allows for customization and reprogramming of the chip's logic functions. This makes it a versatile solution for a variety of applications. Finally, the chip has a width of 11mm, making it compact and suitable for use in smaller devices. In conclusion, the Microsemi Corporation's Embedded-System On Chip (SoC) chip offers a wide range of features and capabilities that make it a highly desirable component for electronic devices. Its high performance, flexibility, and compact design make it a top choice for manufacturers and engineers alike.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F200M3F-1CS288I System On Chip (SoC) applications.

Robotics
Avionics
Communication interfaces ( I2C, SPI )
Digital Signal Processing
Wireless sensor networks
Wireless networking
Networked sensors
Three phase UPS
Functional safety for critical applications in the automotive
Servo drive control module
A2F200M3F-1CS288I More Descriptions
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 100MHz, 4608-Cell, CMOS, PBGA288
A2F200M3F-1Cs288I 288 Tfbga 11X11X1.05Mm Tray Rohs Compliant: Yes |Microchip A2F200M3F-1CS288I
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
IC FPGA 200K GATES 256KB 288-CSP
IC SOC CORTEX-M3 100MHZ 288CSP
Product Comparison
The three parts on the right have similar specifications to A2F200M3F-1CS288I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Organization
    Programmable Logic Type
    Core Architecture
    Primary Attributes
    Number of Equivalent Gates
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Number of Pins
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Operating Supply Voltage
    Max Supply Voltage
    Min Supply Voltage
    Memory Size
    Operating Supply Current
    Speed
    Data Rate
    Number of Logic Elements/Cells
    Number of Gates
    Max Frequency
    Number of Logic Blocks (LABs)
    Radiation Hardening
    View Compare
  • A2F200M3F-1CS288I
    A2F200M3F-1CS288I
    12 Weeks
    288-TFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2013
    SmartFusion®
    e0
    Active
    3 (168 Hours)
    288
    TIN LEAD SILVER
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    235
    1.5V
    0.5mm
    100MHz
    20
    A2F200
    S-PBGA-B288
    78
    Not Qualified
    1.575V
    1.51.82.53.3V
    1.425V
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    MCU - 31, FPGA - 78
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    MCU, FPGA
    78
    4608 CLBS, 200000 GATES
    FIELD PROGRAMMABLE GATE ARRAY
    ARM
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
    200000
    256KB
    1.05mm
    11mm
    11mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F200M3F-FGG256I
    16 Weeks
    256-LBGA
    -
    -40°C~100°C TJ
    Tray
    1997
    SmartFusion®
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    80MHz
    -
    A2F200
    -
    -
    -
    -
    -
    -
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    MCU - 25, FPGA - 66
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    MCU, FPGA
    -
    -
    -
    ARM
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
    -
    256KB
    -
    -
    -
    RoHS Compliant
    256
    256-FPBGA (17x17)
    100°C
    -40°C
    1.5V
    1.575V
    1.425V
    4.5kB
    7mA
    80MHz
    400 kbps
    2500
    200000
    100MHz
    -
    -
  • A2F200M3F-1FGG256I
    12 Weeks
    256-LBGA
    -
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    A2F200
    -
    -
    -
    -
    -
    -
    -
    MCU - 25, FPGA - 66
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    MCU, FPGA
    -
    -
    -
    -
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
    -
    256KB
    -
    -
    -
    RoHS Compliant
    -
    256-FPBGA (17x17)
    -
    -
    -
    -
    -
    -
    -
    100MHz
    -
    -
    -
    -
    -
    -
  • A2F200M3F-1FG256I
    12 Weeks
    256-LBGA
    YES
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®
    e0
    Active
    3 (168 Hours)
    256
    Tin/Lead (Sn/Pb)
    -
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    225
    1.5V
    1mm
    100MHz
    20
    A2F200
    -
    66
    -
    1.575V
    -
    1.425V
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    MCU - 25, FPGA - 66
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    MCU, FPGA
    -
    -
    FIELD PROGRAMMABLE GATE ARRAY
    ARM
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
    -
    256KB
    1.7mm
    17mm
    17mm
    Non-RoHS Compliant
    256
    -
    -
    -
    -
    -
    -
    -
    3mA
    -
    -
    -
    200000
    -
    8
    No
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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