Microsemi Corporation A2F200M3F-1CS288I
- Part Number:
- A2F200M3F-1CS288I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 5037452-A2F200M3F-1CS288I
- Description:
- IC FPGA 200K GATES 256KB 288-CSP
- Datasheet:
- A2F200M3F-1CS288I
Microsemi Corporation A2F200M3F-1CS288I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-1CS288I.
- Factory Lead Time12 Weeks
- Package / Case288-TFBGA, CSPBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2013
- SeriesSmartFusion®
- JESD-609 Codee0
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations288
- Terminal FinishTIN LEAD SILVER
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)235
- Supply Voltage1.5V
- Terminal Pitch0.5mm
- Frequency100MHz
- Reflow Temperature-Max (s)20
- Base Part NumberA2F200
- JESD-30 CodeS-PBGA-B288
- Number of Outputs78
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.575V
- Power Supplies1.51.82.53.3V
- Supply Voltage-Min (Vsup)1.425V
- InterfaceEBI/EMI, Ethernet, I2C, SPI, UART, USART
- Number of I/OMCU - 31, FPGA - 78
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDMA, POR, WDT
- ConnectivityEBI/EMI, Ethernet, I2C, SPI, UART/USART
- ArchitectureMCU, FPGA
- Number of Inputs78
- Organization4608 CLBS, 200000 GATES
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Core ArchitectureARM
- Primary AttributesProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
- Number of Equivalent Gates200000
- Flash Size256KB
- Height Seated (Max)1.05mm
- Length11mm
- Width11mm
- RoHS StatusNon-RoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The Microsemi Corporation is a well-known brand in the electronics industry, specializing in the production of high-quality Embedded-System On Chip (SoC) chips. This particular chip falls under the category of Embedded-System On Chip (SoC), which is a type of integrated circuit that combines multiple components into a single chip. This makes it a highly efficient and compact solution for various electronic devices. One of the key features of this chip is its surface mount capability, which allows for easy installation on a circuit board. This greatly simplifies the manufacturing process and reduces production costs. Additionally, the chip is packaged in a tray, providing protection and organization during shipping and storage. In terms of technical specifications, the Moisture Sensitivity Level (MSL) of this chip is 3, meaning it can withstand exposure to a relative humidity of 30-60% for up to 168 hours. The Peak Reflow Temperature (Cel) is 235, indicating the maximum temperature at which the chip can be exposed during the soldering process. The frequency of this chip is 100MHz, making it suitable for a wide range of applications. It also has multiple power supplies, including 1.5V, 1.8V, 2.5V, and 3.3V, providing flexibility for different power requirements. The minimum supply voltage (Vsup) is 1.425V, ensuring stable performance even at lower voltages. Connectivity is another important aspect of this chip, with options for EBI/EMI, Ethernet, I2C, SPI, and UART/USART. This allows for seamless communication with other devices and systems. Furthermore, this chip utilizes Field Programmable Gate Array (FPGA) technology, which allows for customization and reprogramming of the chip's logic functions. This makes it a versatile solution for a variety of applications. Finally, the chip has a width of 11mm, making it compact and suitable for use in smaller devices. In conclusion, the Microsemi Corporation's Embedded-System On Chip (SoC) chip offers a wide range of features and capabilities that make it a highly desirable component for electronic devices. Its high performance, flexibility, and compact design make it a top choice for manufacturers and engineers alike.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-1CS288I System On Chip (SoC) applications.
Robotics
Avionics
Communication interfaces ( I2C, SPI )
Digital Signal Processing
Wireless sensor networks
Wireless networking
Networked sensors
Three phase UPS
Functional safety for critical applications in the automotive
Servo drive control module
The Microsemi Corporation is a well-known brand in the electronics industry, specializing in the production of high-quality Embedded-System On Chip (SoC) chips. This particular chip falls under the category of Embedded-System On Chip (SoC), which is a type of integrated circuit that combines multiple components into a single chip. This makes it a highly efficient and compact solution for various electronic devices. One of the key features of this chip is its surface mount capability, which allows for easy installation on a circuit board. This greatly simplifies the manufacturing process and reduces production costs. Additionally, the chip is packaged in a tray, providing protection and organization during shipping and storage. In terms of technical specifications, the Moisture Sensitivity Level (MSL) of this chip is 3, meaning it can withstand exposure to a relative humidity of 30-60% for up to 168 hours. The Peak Reflow Temperature (Cel) is 235, indicating the maximum temperature at which the chip can be exposed during the soldering process. The frequency of this chip is 100MHz, making it suitable for a wide range of applications. It also has multiple power supplies, including 1.5V, 1.8V, 2.5V, and 3.3V, providing flexibility for different power requirements. The minimum supply voltage (Vsup) is 1.425V, ensuring stable performance even at lower voltages. Connectivity is another important aspect of this chip, with options for EBI/EMI, Ethernet, I2C, SPI, and UART/USART. This allows for seamless communication with other devices and systems. Furthermore, this chip utilizes Field Programmable Gate Array (FPGA) technology, which allows for customization and reprogramming of the chip's logic functions. This makes it a versatile solution for a variety of applications. Finally, the chip has a width of 11mm, making it compact and suitable for use in smaller devices. In conclusion, the Microsemi Corporation's Embedded-System On Chip (SoC) chip offers a wide range of features and capabilities that make it a highly desirable component for electronic devices. Its high performance, flexibility, and compact design make it a top choice for manufacturers and engineers alike.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-1CS288I System On Chip (SoC) applications.
Robotics
Avionics
Communication interfaces ( I2C, SPI )
Digital Signal Processing
Wireless sensor networks
Wireless networking
Networked sensors
Three phase UPS
Functional safety for critical applications in the automotive
Servo drive control module
A2F200M3F-1CS288I More Descriptions
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 100MHz, 4608-Cell, CMOS, PBGA288
A2F200M3F-1Cs288I 288 Tfbga 11X11X1.05Mm Tray Rohs Compliant: Yes |Microchip A2F200M3F-1CS288I
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
IC FPGA 200K GATES 256KB 288-CSP
IC SOC CORTEX-M3 100MHZ 288CSP
A2F200M3F-1Cs288I 288 Tfbga 11X11X1.05Mm Tray Rohs Compliant: Yes |Microchip A2F200M3F-1CS288I
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
IC FPGA 200K GATES 256KB 288-CSP
IC SOC CORTEX-M3 100MHZ 288CSP
The three parts on the right have similar specifications to A2F200M3F-1CS288I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsOrganizationProgrammable Logic TypeCore ArchitecturePrimary AttributesNumber of Equivalent GatesFlash SizeHeight Seated (Max)LengthWidthRoHS StatusNumber of PinsSupplier Device PackageMax Operating TemperatureMin Operating TemperatureOperating Supply VoltageMax Supply VoltageMin Supply VoltageMemory SizeOperating Supply CurrentSpeedData RateNumber of Logic Elements/CellsNumber of GatesMax FrequencyNumber of Logic Blocks (LABs)Radiation HardeningView Compare
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A2F200M3F-1CS288I12 Weeks288-TFBGA, CSPBGAYES-40°C~100°C TJTray2013SmartFusion®e0Active3 (168 Hours)288TIN LEAD SILVER8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALL2351.5V0.5mm100MHz20A2F200S-PBGA-B28878Not Qualified1.575V1.51.82.53.3V1.425VEBI/EMI, Ethernet, I2C, SPI, UART, USARTMCU - 31, FPGA - 7864KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USARTMCU, FPGA784608 CLBS, 200000 GATESFIELD PROGRAMMABLE GATE ARRAYARMProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops200000256KB1.05mm11mm11mmNon-RoHS Compliant-----------------
-
16 Weeks256-LBGA--40°C~100°C TJTray1997SmartFusion®-Active3 (168 Hours)----------80MHz-A2F200------EBI/EMI, Ethernet, I2C, SPI, UART, USARTMCU - 25, FPGA - 6664KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USARTMCU, FPGA---ARMProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops-256KB---RoHS Compliant256256-FPBGA (17x17)100°C-40°C1.5V1.575V1.425V4.5kB7mA80MHz400 kbps2500200000100MHz--
-
12 Weeks256-LBGA--40°C~100°C TJTray2015SmartFusion®-Active3 (168 Hours)------------A2F200-------MCU - 25, FPGA - 6664KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USARTMCU, FPGA----ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops-256KB---RoHS Compliant-256-FPBGA (17x17)-------100MHz------
-
12 Weeks256-LBGAYES-40°C~100°C TJTray2009SmartFusion®e0Active3 (168 Hours)256Tin/Lead (Sn/Pb)-Field Programmable Gate ArraysCMOSBOTTOMBALL2251.5V1mm100MHz20A2F200-66-1.575V-1.425VEBI/EMI, Ethernet, I2C, SPI, UART, USARTMCU - 25, FPGA - 6664KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USARTMCU, FPGA--FIELD PROGRAMMABLE GATE ARRAYARMProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops-256KB1.7mm17mm17mmNon-RoHS Compliant256-------3mA---200000-8No
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