A2F500M3G-1FGG484I

Microsemi Corporation A2F500M3G-1FGG484I

Part Number:
A2F500M3G-1FGG484I
Manufacturer:
Microsemi Corporation
Ventron No:
3827998-A2F500M3G-1FGG484I
Description:
IC FPGA 500K GATES 512KB 484-BGA
ECAD Model:
Datasheet:
A2F500M3G-1FGG484I

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Specifications
Microsemi Corporation A2F500M3G-1FGG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F500M3G-1FGG484I.
  • Factory Lead Time
    12 Weeks
  • Mount
    Surface Mount
  • Package / Case
    484-BGA
  • Number of Pins
    484
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    484
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1.5V
  • Terminal Pitch
    1mm
  • Frequency
    100MHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    A2F500M3G
  • Number of Outputs
    128
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.5V
  • Power Supplies
    1.51.82.53.3V
  • Interface
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
  • Max Supply Voltage
    1.575V
  • Min Supply Voltage
    1.425V
  • Memory Size
    13.5kB
  • Operating Supply Current
    16.5mA
  • Number of I/O
    MCU - 41, FPGA - 128
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DMA, POR, WDT
  • Connectivity
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Data Rate
    400 kbps
  • Architecture
    MCU, FPGA
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    5500
  • Core Architecture
    ARM
  • Number of Gates
    500000
  • Primary Attributes
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Flash Size
    512KB
  • Height Seated (Max)
    2.44mm
  • Length
    23mm
  • Width
    23mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 484-BGA by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion? is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops, an important feature to keep in mind.It is packaged in a state-of-the-art Tray package.This SoC part contains a total of MCU - 41, FPGA - 128 I/Os in total.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.There are 484 terminations in total and that really benefits system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.Using this SoC chip, you have the option of having 128 outputs.You will need to provide 1.51.82.53.3V power supplies in order to run system on chip.It has a 512KB flash.A search for A2F500M3G will result in system on chips that have similar specs and purposes.A wireless SoC that operates at a frequency of 100MHz is what the wireless SoC does.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 484-pin version.This power supply is rated with a maximum voltage of 1.575V.A minimum of 1.425V are supplied to it.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F500M3G-1FGG484I System On Chip (SoC) applications.

Functional safety for critical applications in the automotive
Functional safety for critical applications in the industrial sectors
Apple smart watch
ARM processors
DC-input BLDC motor drive
Personal Computers
PC peripherals
ARM support modules
POS Terminals
Digital Signal Processing
A2F500M3G-1FGG484I More Descriptions
FPGA SmartFusion 500K Gates 100MHz 130nm (CMOS) Technology 1.5V 484-Pin FPBGA
A2F500M3G-1Fgg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip A2F500M3G-1FGG484I
IC SOC CORTEX-M3 100MHZ 484FBGA
IC FPGA 500K GATES 512KB 484-BGA
Product Comparison
The three parts on the right have similar specifications to A2F500M3G-1FGG484I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    Number of Outputs
    Qualification Status
    Operating Supply Voltage
    Power Supplies
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Memory Size
    Operating Supply Current
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Data Rate
    Architecture
    Programmable Logic Type
    Number of Logic Elements/Cells
    Core Architecture
    Number of Gates
    Primary Attributes
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Reach Compliance Code
    Speed Grade
    Number of Registers
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Speed
    Max Frequency
    Number of Logic Blocks (LABs)
    Lead Free
    View Compare
  • A2F500M3G-1FGG484I
    A2F500M3G-1FGG484I
    12 Weeks
    Surface Mount
    484-BGA
    484
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®
    e1
    Active
    3 (168 Hours)
    484
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    250
    1.5V
    1mm
    100MHz
    30
    A2F500M3G
    128
    Not Qualified
    1.5V
    1.51.82.53.3V
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    1.575V
    1.425V
    13.5kB
    16.5mA
    MCU - 41, FPGA - 128
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    400 kbps
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    5500
    ARM
    500000
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    512KB
    2.44mm
    23mm
    23mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F500M3G-1FG484M
    12 Weeks
    -
    484-BGA
    484
    -55°C~125°C TJ
    Tray
    -
    SmartFusion®
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    100MHz
    -
    A2F500M3G
    -
    -
    1.5V
    -
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    -
    -
    -
    -
    MCU - 41, FPGA - 128
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    -
    MCU, FPGA
    -
    -
    ARM
    -
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    512KB
    -
    -
    -
    Non-RoHS Compliant
    unknown
    1
    11520
    -
    -
    -
    -
    -
    -
    -
  • A2F500M3G-FGG256M
    12 Weeks
    -
    256-LBGA
    256
    -55°C~125°C TJ
    Tray
    -
    SmartFusion®
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    80MHz
    -
    A2F500M3G
    -
    -
    -
    -
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    -
    -
    -
    -
    MCU - 25, FPGA - 66
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    -
    MCU, FPGA
    -
    -
    ARM
    -
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    512KB
    -
    -
    -
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F500M3G-FG484
    16 Weeks
    -
    484-BGA
    484
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    80MHz
    -
    A2F500M3G
    -
    -
    1.5V
    -
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    1.575V
    1.425V
    -
    2mA
    MCU - 41, FPGA - 128
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    -
    MCU, FPGA
    -
    -
    ARM
    500000
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
    512KB
    -
    -
    -
    Non-RoHS Compliant
    -
    -
    -
    484-FPBGA (23x23)
    85°C
    0°C
    80MHz
    100MHz
    24
    Lead Free
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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