Microsemi Corporation A2F500M3G-1FGG484I
- Part Number:
- A2F500M3G-1FGG484I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3827998-A2F500M3G-1FGG484I
- Description:
- IC FPGA 500K GATES 512KB 484-BGA
- Datasheet:
- A2F500M3G-1FGG484I
Microsemi Corporation A2F500M3G-1FGG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F500M3G-1FGG484I.
- Factory Lead Time12 Weeks
- MountSurface Mount
- Package / Case484-BGA
- Number of Pins484
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1.5V
- Terminal Pitch1mm
- Frequency100MHz
- Reflow Temperature-Max (s)30
- Base Part NumberA2F500M3G
- Number of Outputs128
- Qualification StatusNot Qualified
- Operating Supply Voltage1.5V
- Power Supplies1.51.82.53.3V
- InterfaceEBI/EMI, Ethernet, I2C, SPI, UART, USART
- Max Supply Voltage1.575V
- Min Supply Voltage1.425V
- Memory Size13.5kB
- Operating Supply Current16.5mA
- Number of I/OMCU - 41, FPGA - 128
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDMA, POR, WDT
- ConnectivityEBI/EMI, Ethernet, I2C, SPI, UART/USART
- Data Rate400 kbps
- ArchitectureMCU, FPGA
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells5500
- Core ArchitectureARM
- Number of Gates500000
- Primary AttributesProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
- Flash Size512KB
- Height Seated (Max)2.44mm
- Length23mm
- Width23mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 484-BGA by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion? is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops, an important feature to keep in mind.It is packaged in a state-of-the-art Tray package.This SoC part contains a total of MCU - 41, FPGA - 128 I/Os in total.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.There are 484 terminations in total and that really benefits system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.Using this SoC chip, you have the option of having 128 outputs.You will need to provide 1.51.82.53.3V power supplies in order to run system on chip.It has a 512KB flash.A search for A2F500M3G will result in system on chips that have similar specs and purposes.A wireless SoC that operates at a frequency of 100MHz is what the wireless SoC does.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 484-pin version.This power supply is rated with a maximum voltage of 1.575V.A minimum of 1.425V are supplied to it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F500M3G-1FGG484I System On Chip (SoC) applications.
Functional safety for critical applications in the automotive
Functional safety for critical applications in the industrial sectors
Apple smart watch
ARM processors
DC-input BLDC motor drive
Personal Computers
PC peripherals
ARM support modules
POS Terminals
Digital Signal Processing
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 484-BGA by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion? is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops, an important feature to keep in mind.It is packaged in a state-of-the-art Tray package.This SoC part contains a total of MCU - 41, FPGA - 128 I/Os in total.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.There are 484 terminations in total and that really benefits system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.Using this SoC chip, you have the option of having 128 outputs.You will need to provide 1.51.82.53.3V power supplies in order to run system on chip.It has a 512KB flash.A search for A2F500M3G will result in system on chips that have similar specs and purposes.A wireless SoC that operates at a frequency of 100MHz is what the wireless SoC does.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 484-pin version.This power supply is rated with a maximum voltage of 1.575V.A minimum of 1.425V are supplied to it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F500M3G-1FGG484I System On Chip (SoC) applications.
Functional safety for critical applications in the automotive
Functional safety for critical applications in the industrial sectors
Apple smart watch
ARM processors
DC-input BLDC motor drive
Personal Computers
PC peripherals
ARM support modules
POS Terminals
Digital Signal Processing
A2F500M3G-1FGG484I More Descriptions
FPGA SmartFusion 500K Gates 100MHz 130nm (CMOS) Technology 1.5V 484-Pin FPBGA
A2F500M3G-1Fgg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip A2F500M3G-1FGG484I
IC SOC CORTEX-M3 100MHZ 484FBGA
IC FPGA 500K GATES 512KB 484-BGA
A2F500M3G-1Fgg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip A2F500M3G-1FGG484I
IC SOC CORTEX-M3 100MHZ 484FBGA
IC FPGA 500K GATES 512KB 484-BGA
The three parts on the right have similar specifications to A2F500M3G-1FGG484I.
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ImagePart NumberManufacturerFactory Lead TimeMountPackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberNumber of OutputsQualification StatusOperating Supply VoltagePower SuppliesInterfaceMax Supply VoltageMin Supply VoltageMemory SizeOperating Supply CurrentNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityData RateArchitectureProgrammable Logic TypeNumber of Logic Elements/CellsCore ArchitectureNumber of GatesPrimary AttributesFlash SizeHeight Seated (Max)LengthWidthRoHS StatusReach Compliance CodeSpeed GradeNumber of RegistersSupplier Device PackageMax Operating TemperatureMin Operating TemperatureSpeedMax FrequencyNumber of Logic Blocks (LABs)Lead FreeView Compare
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A2F500M3G-1FGG484I12 WeeksSurface Mount484-BGA484-40°C~100°C TJTray2015SmartFusion®e1Active3 (168 Hours)484Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALL2501.5V1mm100MHz30A2F500M3G128Not Qualified1.5V1.51.82.53.3VEBI/EMI, Ethernet, I2C, SPI, UART, USART1.575V1.425V13.5kB16.5mAMCU - 41, FPGA - 12864KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART400 kbpsMCU, FPGAFIELD PROGRAMMABLE GATE ARRAY5500ARM500000ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops512KB2.44mm23mm23mmRoHS Compliant-----------
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12 Weeks-484-BGA484-55°C~125°C TJTray-SmartFusion®-Active3 (168 Hours)----------100MHz-A2F500M3G--1.5V-EBI/EMI, Ethernet, I2C, SPI, UART, USART----MCU - 41, FPGA - 12864KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART-MCU, FPGA--ARM-ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops512KB---Non-RoHS Compliantunknown111520-------
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12 Weeks-256-LBGA256-55°C~125°C TJTray-SmartFusion®-Active3 (168 Hours)----------80MHz-A2F500M3G----EBI/EMI, Ethernet, I2C, SPI, UART, USART----MCU - 25, FPGA - 6664KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART-MCU, FPGA--ARM-ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops512KB---RoHS Compliant----------
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16 Weeks-484-BGA4840°C~85°C TJTray2015SmartFusion®-Active3 (168 Hours)----------80MHz-A2F500M3G--1.5V-EBI/EMI, Ethernet, I2C, SPI, UART, USART1.575V1.425V-2mAMCU - 41, FPGA - 12864KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART-MCU, FPGA--ARM500000ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops512KB---Non-RoHS Compliant---484-FPBGA (23x23)85°C0°C80MHz100MHz24Lead Free
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