XCZU7CG-2FFVC1156E

Xilinx Inc. XCZU7CG-2FFVC1156E

Part Number:
XCZU7CG-2FFVC1156E
Manufacturer:
Xilinx Inc.
Ventron No:
5037379-XCZU7CG-2FFVC1156E
Description:
IC FPGA 360 I/O 1156FCBGA
ECAD Model:
Datasheet:
XCZU7CG-2FFVC1156E

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Specifications
Xilinx Inc. XCZU7CG-2FFVC1156E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU7CG-2FFVC1156E.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    1156-BBGA, FCBGA
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC CG
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    360
  • Speed
    533MHz, 1.3GHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The product is packaged in a 1156-BBGA, FCBGA case, ensuring enhanced durability and protection. With a Moisture Sensitivity Level (MSL) of 4 (72 Hours), it guarantees optimal performance even in humid conditions. The product falls under the HTS Code 8542.31.00.01, ensuring its compliance with international trade regulations. It boasts a high number of I/O, with 360 inputs and outputs, enabling seamless connectivity. The product operates at impressive speeds ranging from 533MHz to 1.3GHz, providing efficient and fast processing capabilities. With a RAM size of 256KB, it offers ample storage for data processing. The product also features essential peripherals such as DMA and WDT, enhancing functionality. Its architecture incorporates both MCU and FPGA, allowing for versatile application. The primary attribute of this product is its Zynq®UltraScale ™ FPGA, which boasts an impressive 504K Logic Cells, enabling complex computations and data processing. Lastly, the product is ROHS3 compliant, ensuring its adherence to environmental regulations.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU7CG-2FFVC1156E System On Chip (SoC) applications.

Central alarm system
Industrial automation devices
Defense
Efficient hardware for inference of neural networks
Servo drive control module
AC-input BLDC motor drive
Level
Automotive
POS Terminals
Published Paper
XCZU7CG-2FFVC1156E More Descriptions
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 504K, C1156, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
Xilinx Commercial Zynq UltraScale FPGA 504000 System Logic Cells 460800 CLB Flip-Flops 11Mb RAM 360 I/O Surface Mount 1156-Ball FPBGA Extended Temperature Tray
Product Comparison
The three parts on the right have similar specifications to XCZU7CG-2FFVC1156E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    View Compare
  • XCZU7CG-2FFVC1156E
    XCZU7CG-2FFVC1156E
    11 Weeks
    1156-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC CG
    yes
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    360
    533MHz, 1.3GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
  • XCZU9CG-2FFVB1156E
    11 Weeks
    1156-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC CG
    yes
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    328
    533MHz, 1.3GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
  • XCZU9EG-1FFVC900I
    11 Weeks
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC EG
    -
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    -
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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