Xilinx Inc. XCZU6CG-L2FFVB1156E

Name: XCZU6CG-L2FFVB1156E
Brand: Xilinx Inc.
SKU: 5037755-XCZU6CG-L2FFVB1156E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU6CG-L2FFVB1156E

Manufacturer:: Xilinx Inc.

Ventron No:: 5037755-XCZU6CG-L2FFVB1156E

Description:: IC FPGA 328 I/O 1156FCBGA

ECAD Model:

Datasheet:: XCZU6CG-L2FFVB1156E

Specifications

Xilinx Inc. XCZU6CG-L2FFVB1156E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU6CG-L2FFVB1156E.

Factory Lead Time
11 Weeks
Package / Case
1156-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC CG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.72V
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B1156
Supply Voltage-Max (Vsup)
0.742V
Supply Voltage-Min (Vsup)
0.698V
Number of I/O
328
Speed
533MHz, 1.3GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 469K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Xilinx Inc. is the brand of this part, which falls into the Embedded - System On Chip (SoC) category. It was published in 2016 and has an HTS Code of 8542.31.00.01. The technology used is CMOS and the packaging is Tray. The Reflow Temperature-Max (s) is NOT SPECIFIED and the Supply Voltage-Min (Vsup) is 0.698V. It has a RAM Size of 256KB and an Architecture of MCU, FPGA. The primary attributes of this chip include Zynq®UltraScale ™ FPGA with 469K Logic Cells. Additionally, it is ROHS3 Compliant.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.
XCZU6CG-L2FFVB1156E System On Chip (SoC) applications.

Healthcare
Deep learning hardware
Microcontroller based SoC ( RISC-V, ARM)
Microcontroller
Industrial sectors
External USB hard disk/SSD
Avionics
Automotive
High-end PLC
Networked sensors

XCZU6CG-L2FFVB1156E More Descriptions

Zynq UltraScale RFSoC, Speed Grade-L2, Logic Cells 469K, B1156, RoHSXilinx SCT
IC SOC CORTEX-A53 1156FCBGA
FPGA - Field Programmable Gate Array
IC FPGA 328 I/O 1156FCBGA

Product Comparison

The three parts on the right have similar specifications to XCZU6CG-L2FFVB1156E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Number of I/O

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

View Compare
XCZU6CG-L2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

YES

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.72V

NOT SPECIFIED

R-PBGA-B1156

0.742V

0.698V

328

533MHz, 1.3GHz

256KB

MICROPROCESSOR CIRCUIT

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 469K Logic Cells

ROHS3 Compliant

-
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

204

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

XCZU6CG-L2FFVB1156E vs XCZU9EG-1FFVC900I
XCZU19EG-1FFVD1760E

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

308

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 1143K Logic Cells

ROHS3 Compliant

XCZU6CG-L2FFVB1156E vs XCZU19EG-1FFVD1760E
XCZU7EV-2FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

464

533MHz, 600MHz, 1.3GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

XCZU6CG-L2FFVB1156E vs XCZU7EV-2FFVF1517I