A2F200M3F-FGG484I

Microsemi Corporation A2F200M3F-FGG484I

Part Number:
A2F200M3F-FGG484I
Manufacturer:
Microsemi Corporation
Ventron No:
3668558-A2F200M3F-FGG484I
Description:
IC FPGA 200K GATES 256KB 256-BGA
ECAD Model:
Datasheet:
A2F200M3F-FGG484I

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Specifications
Microsemi Corporation A2F200M3F-FGG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-FGG484I.
  • Factory Lead Time
    12 Weeks
  • Mount
    Surface Mount
  • Package / Case
    484-BGA
  • Number of Pins
    484
  • Supplier Device Package
    484-FPBGA (23x23)
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2013
  • Series
    SmartFusion®
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature
    100°C
  • Min Operating Temperature
    -40°C
  • Frequency
    100MHz
  • Base Part Number
    A2F200
  • Operating Supply Voltage
    1.5V
  • Interface
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
  • Max Supply Voltage
    1.575V
  • Min Supply Voltage
    1.425V
  • Memory Size
    4.5kB
  • Operating Supply Current
    7mA
  • Number of I/O
    MCU - 41, FPGA - 94
  • Speed
    80MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DMA, POR, WDT
  • Connectivity
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Data Rate
    400 kbps
  • Architecture
    MCU, FPGA
  • Number of Logic Elements/Cells
    2500
  • Core Architecture
    ARM
  • Number of Gates
    200000
  • Max Frequency
    100MHz
  • Primary Attributes
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
  • Flash Size
    256KB
  • Radiation Hardening
    No
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion? is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops and that is something to note.Tray package houses this SoC system on a chip.MCU - 41, FPGA - 94 I/Os in total are included in this SoC part.This flash has a size of 256KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F200.A frequency of 100MHz is used by the wireless SoC to operate.In terms of core architecture, the SoC meaning relies on ARM.The computer SoC has 484 pins.Just -40°C will start the SoC computing.There is an operating temperature limit of 100°C which is the maximum operating temperature designed for this SoC system on chip.Supply voltage is rated at 1.575V.The SoC security is powered at least by 1.425V.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F200M3F-FGG484I System On Chip (SoC) applications.

Video Imaging
Medical
Microcontroller
Medical
Cyberphysical system-on-chip
Networked sensors
Temperature
ARM Cortex M4 microcontroller
Body control module
Central inverter
A2F200M3F-FGG484I More Descriptions
FPGA SmartFusion 200K Gates 2000 Cells 100MHz 130nm (CMOS) Technology 1.5V 484-Pin FBGA
A2F Series 200000 LUTs 161 I/O 256 kb SmartFusion (cSoC) - FPBGA-484
IC FPGA 200K GATES 256KB 256-BGA
IC SOC CORTEX-M3 100MHZ 484FBGA
SMARTFUSION CUSTOMIZABLE SYSTEM-ON-CHIP
Product Comparison
The three parts on the right have similar specifications to A2F200M3F-FGG484I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Package / Case
    Number of Pins
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Operating Supply Voltage
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Memory Size
    Operating Supply Current
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Data Rate
    Architecture
    Number of Logic Elements/Cells
    Core Architecture
    Number of Gates
    Max Frequency
    Primary Attributes
    Flash Size
    Radiation Hardening
    RoHS Status
    Lead Free
    Surface Mount
    JESD-609 Code
    Number of Terminations
    Terminal Finish
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Number of Outputs
    Qualification Status
    Programmable Logic Type
    Number of Logic Blocks (LABs)
    Height Seated (Max)
    Length
    Width
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    View Compare
  • A2F200M3F-FGG484I
    A2F200M3F-FGG484I
    12 Weeks
    Surface Mount
    484-BGA
    484
    484-FPBGA (23x23)
    -40°C~100°C TJ
    Tray
    2013
    SmartFusion®
    Active
    3 (168 Hours)
    100°C
    -40°C
    100MHz
    A2F200
    1.5V
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    1.575V
    1.425V
    4.5kB
    7mA
    MCU - 41, FPGA - 94
    80MHz
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    400 kbps
    MCU, FPGA
    2500
    ARM
    200000
    100MHz
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
    256KB
    No
    RoHS Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F200M3F-1FGG484I
    12 Weeks
    -
    484-BGA
    484
    -
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®
    Active
    3 (168 Hours)
    -
    -
    100MHz
    A2F200
    1.5V
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    1.575V
    1.425V
    -
    1mA
    MCU - 41, FPGA - 94
    -
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    -
    MCU, FPGA
    -
    ARM
    200000
    -
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
    256KB
    -
    RoHS Compliant
    -
    YES
    e1
    484
    Tin/Silver/Copper (Sn/Ag/Cu)
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    250
    1.5V
    1mm
    30
    94
    Not Qualified
    FIELD PROGRAMMABLE GATE ARRAY
    8
    2.44mm
    23mm
    23mm
    -
    -
  • A2F200M3F-1FG256
    12 Weeks
    -
    256-LBGA
    256
    -
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®
    Active
    3 (168 Hours)
    -
    -
    100MHz
    A2F200
    -
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    -
    -
    -
    3mA
    MCU - 25, FPGA - 66
    -
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    -
    MCU, FPGA
    -
    ARM
    200000
    -
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
    256KB
    No
    Non-RoHS Compliant
    -
    YES
    -
    256
    TIN LEAD/TIN LEAD SILVER
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    225
    1.5V
    1mm
    30
    66
    -
    FIELD PROGRAMMABLE GATE ARRAY
    8
    1.7mm
    17mm
    17mm
    1.575V
    1.425V
  • A2F200M3F-1FG256I
    12 Weeks
    -
    256-LBGA
    256
    -
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®
    Active
    3 (168 Hours)
    -
    -
    100MHz
    A2F200
    -
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    -
    -
    -
    3mA
    MCU - 25, FPGA - 66
    -
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    -
    MCU, FPGA
    -
    ARM
    200000
    -
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
    256KB
    No
    Non-RoHS Compliant
    -
    YES
    e0
    256
    Tin/Lead (Sn/Pb)
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    225
    1.5V
    1mm
    20
    66
    -
    FIELD PROGRAMMABLE GATE ARRAY
    8
    1.7mm
    17mm
    17mm
    1.575V
    1.425V
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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