Microsemi Corporation A2F200M3F-FGG484I
- Part Number:
- A2F200M3F-FGG484I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3668558-A2F200M3F-FGG484I
- Description:
- IC FPGA 200K GATES 256KB 256-BGA
- Datasheet:
- A2F200M3F-FGG484I
Microsemi Corporation A2F200M3F-FGG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-FGG484I.
- Factory Lead Time12 Weeks
- MountSurface Mount
- Package / Case484-BGA
- Number of Pins484
- Supplier Device Package484-FPBGA (23x23)
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2013
- SeriesSmartFusion®
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature100°C
- Min Operating Temperature-40°C
- Frequency100MHz
- Base Part NumberA2F200
- Operating Supply Voltage1.5V
- InterfaceEBI/EMI, Ethernet, I2C, SPI, UART, USART
- Max Supply Voltage1.575V
- Min Supply Voltage1.425V
- Memory Size4.5kB
- Operating Supply Current7mA
- Number of I/OMCU - 41, FPGA - 94
- Speed80MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDMA, POR, WDT
- ConnectivityEBI/EMI, Ethernet, I2C, SPI, UART/USART
- Data Rate400 kbps
- ArchitectureMCU, FPGA
- Number of Logic Elements/Cells2500
- Core ArchitectureARM
- Number of Gates200000
- Max Frequency100MHz
- Primary AttributesProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
- Flash Size256KB
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
- Lead FreeLead Free
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion? is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops and that is something to note.Tray package houses this SoC system on a chip.MCU - 41, FPGA - 94 I/Os in total are included in this SoC part.This flash has a size of 256KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F200.A frequency of 100MHz is used by the wireless SoC to operate.In terms of core architecture, the SoC meaning relies on ARM.The computer SoC has 484 pins.Just -40°C will start the SoC computing.There is an operating temperature limit of 100°C which is the maximum operating temperature designed for this SoC system on chip.Supply voltage is rated at 1.575V.The SoC security is powered at least by 1.425V.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-FGG484I System On Chip (SoC) applications.
Video Imaging
Medical
Microcontroller
Medical
Cyberphysical system-on-chip
Networked sensors
Temperature
ARM Cortex M4 microcontroller
Body control module
Central inverter
This SoC is built on ARM? Cortex?-M3 core processor(s).Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion? is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops and that is something to note.Tray package houses this SoC system on a chip.MCU - 41, FPGA - 94 I/Os in total are included in this SoC part.This flash has a size of 256KB.It is possible to find system on chips that are similar in specs and purpose by searching for A2F200.A frequency of 100MHz is used by the wireless SoC to operate.In terms of core architecture, the SoC meaning relies on ARM.The computer SoC has 484 pins.Just -40°C will start the SoC computing.There is an operating temperature limit of 100°C which is the maximum operating temperature designed for this SoC system on chip.Supply voltage is rated at 1.575V.The SoC security is powered at least by 1.425V.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-FGG484I System On Chip (SoC) applications.
Video Imaging
Medical
Microcontroller
Medical
Cyberphysical system-on-chip
Networked sensors
Temperature
ARM Cortex M4 microcontroller
Body control module
Central inverter
A2F200M3F-FGG484I More Descriptions
FPGA SmartFusion 200K Gates 2000 Cells 100MHz 130nm (CMOS) Technology 1.5V 484-Pin FBGA
A2F Series 200000 LUTs 161 I/O 256 kb SmartFusion (cSoC) - FPBGA-484
IC FPGA 200K GATES 256KB 256-BGA
IC SOC CORTEX-M3 100MHZ 484FBGA
SMARTFUSION CUSTOMIZABLE SYSTEM-ON-CHIP
A2F Series 200000 LUTs 161 I/O 256 kb SmartFusion (cSoC) - FPBGA-484
IC FPGA 200K GATES 256KB 256-BGA
IC SOC CORTEX-M3 100MHZ 484FBGA
SMARTFUSION CUSTOMIZABLE SYSTEM-ON-CHIP
The three parts on the right have similar specifications to A2F200M3F-FGG484I.
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ImagePart NumberManufacturerFactory Lead TimeMountPackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberOperating Supply VoltageInterfaceMax Supply VoltageMin Supply VoltageMemory SizeOperating Supply CurrentNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityData RateArchitectureNumber of Logic Elements/CellsCore ArchitectureNumber of GatesMax FrequencyPrimary AttributesFlash SizeRadiation HardeningRoHS StatusLead FreeSurface MountJESD-609 CodeNumber of TerminationsTerminal FinishSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Number of OutputsQualification StatusProgrammable Logic TypeNumber of Logic Blocks (LABs)Height Seated (Max)LengthWidthSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)View Compare
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A2F200M3F-FGG484I12 WeeksSurface Mount484-BGA484484-FPBGA (23x23)-40°C~100°C TJTray2013SmartFusion®Active3 (168 Hours)100°C-40°C100MHzA2F2001.5VEBI/EMI, Ethernet, I2C, SPI, UART, USART1.575V1.425V4.5kB7mAMCU - 41, FPGA - 9480MHz64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART400 kbpsMCU, FPGA2500ARM200000100MHzProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KBNoRoHS CompliantLead Free----------------------
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12 Weeks-484-BGA484--40°C~100°C TJTray2015SmartFusion®Active3 (168 Hours)--100MHzA2F2001.5VEBI/EMI, Ethernet, I2C, SPI, UART, USART1.575V1.425V-1mAMCU - 41, FPGA - 94-64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART-MCU, FPGA-ARM200000-ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KB-RoHS Compliant-YESe1484Tin/Silver/Copper (Sn/Ag/Cu)Field Programmable Gate ArraysCMOSBOTTOMBALL2501.5V1mm3094Not QualifiedFIELD PROGRAMMABLE GATE ARRAY82.44mm23mm23mm--
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12 Weeks-256-LBGA256-0°C~85°C TJTray2009SmartFusion®Active3 (168 Hours)--100MHzA2F200-EBI/EMI, Ethernet, I2C, SPI, UART, USART---3mAMCU - 25, FPGA - 66-64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART-MCU, FPGA-ARM200000-ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KBNoNon-RoHS Compliant-YES-256TIN LEAD/TIN LEAD SILVERField Programmable Gate ArraysCMOSBOTTOMBALL2251.5V1mm3066-FIELD PROGRAMMABLE GATE ARRAY81.7mm17mm17mm1.575V1.425V
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12 Weeks-256-LBGA256--40°C~100°C TJTray2009SmartFusion®Active3 (168 Hours)--100MHzA2F200-EBI/EMI, Ethernet, I2C, SPI, UART, USART---3mAMCU - 25, FPGA - 66-64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART-MCU, FPGA-ARM200000-ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KBNoNon-RoHS Compliant-YESe0256Tin/Lead (Sn/Pb)Field Programmable Gate ArraysCMOSBOTTOMBALL2251.5V1mm2066-FIELD PROGRAMMABLE GATE ARRAY81.7mm17mm17mm1.575V1.425V
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