Microsemi Corporation A2F200M3F-FG484

Name: A2F200M3F-FG484
Brand: Microsemi Corporation
SKU: 3668577-A2F200M3F-FG484
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F200M3F-FG484

Manufacturer:: Microsemi Corporation

Ventron No:: 3668577-A2F200M3F-FG484

Description:: IC FPGA 200K GATES 256KB 484-BGA

ECAD Model:

Datasheet:: A2F200M3F-FG484

Specifications

Microsemi Corporation A2F200M3F-FG484 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-FG484.

Factory Lead Time
12 Weeks
Package / Case
484-BGA
Surface Mount
YES
Number of Pins
484
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
SmartFusion®
JESD-609 Code
e0
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
484
Terminal Finish
Tin/Lead (Sn/Pb)
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Supply Voltage
1.5V
Terminal Pitch
1mm
Frequency
80MHz
Reflow Temperature-Max (s)
30
Base Part Number
A2F200
Number of Outputs
94
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.575V
Supply Voltage-Min (Vsup)
1.425V
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Operating Supply Current
2mA
Number of I/O
MCU - 41, FPGA - 94
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Core Architecture
ARM
Number of Gates
200000
Number of Logic Blocks (LABs)
8
Primary Attributes
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size
256KB
Height Seated (Max)
2.44mm
Length
23mm
Width
23mm
RoHS Status
Non-RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
The Microsemi Corporation is a well-known brand in the technology industry. Their Embedded - System On Chip (SoC) chip is highly regarded and falls under the Embedded - System On Chip (SoC) category. The chip comes in a 484-BGA package and has 484 pins. It is packaged in a tray and has a terminal form of BALL. With a peak reflow temperature of 225 degrees Celsius, this chip can withstand high temperatures. It also has 94 outputs and a maximum supply voltage of 1.575V. The chip boasts 8 logic blocks (LABs) and a flash size of 256KB. Its height seated (max) is 2.44mm, making it a compact and efficient choice for embedded systems.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F200M3F-FG484 System On Chip (SoC) applications.

Automotive
Personal Computers
AC drive control module
Cyber security for critical applications in the aerospace
Apple smart watch
Multiprocessor system-on-chips (MPSoCs)
Level
RISC-V
Industrial automation devices
Communication interfaces ( I2C, SPI )

A2F200M3F-FG484 More Descriptions

FPGA SmartFusion 200K Gates 2000 Cells 100MHz 130nm (CMOS) Technology 1.5V 484-Pin FBGA
A2F200M3F-Fg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip A2F200M3F-FG484
IC SOC CORTEX-M3 80MHZ 484FBGA
FPGA - Field Programmable Gate Array SmartFusion
IC FPGA 200K GATES 256KB 484-BGA

Product Comparison

The three parts on the right have similar specifications to A2F200M3F-FG484.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Number of Pins

Operating Temperature

Packaging

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

Base Part Number

Number of Outputs

Qualification Status

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Interface

Operating Supply Current

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Programmable Logic Type

Core Architecture

Number of Gates

Number of Logic Blocks (LABs)

Primary Attributes

Flash Size

Height Seated (Max)

Length

Width

RoHS Status

Supplier Device Package

Published

Max Operating Temperature

Min Operating Temperature

Operating Supply Voltage

Max Supply Voltage

Min Supply Voltage

Memory Size

Speed

Data Rate

Number of Logic Elements/Cells

Max Frequency

View Compare
A2F200M3F-FG484

Microsemi Corporation

12 Weeks

484-BGA

YES

484

0°C~85°C TJ

Tray

SmartFusion®

e0

Active

3 (168 Hours)

484

Tin/Lead (Sn/Pb)

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1.5V

1mm

80MHz

30

A2F200

94

Not Qualified

1.575V

1.425V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

2mA

MCU - 41, FPGA - 94

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

FIELD PROGRAMMABLE GATE ARRAY

ARM

200000

8

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

2.44mm

23mm

23mm

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-
A2F200M3F-FGG256I

Microsemi Corporation

16 Weeks

256-LBGA

-

256

-40°C~100°C TJ

Tray

SmartFusion®

-

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

80MHz

-

A2F200

-

-

-

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

7mA

MCU - 25, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

-

ARM

200000

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

-

-

-

RoHS Compliant

256-FPBGA (17x17)

1997

100°C

-40°C

1.5V

1.575V

1.425V

4.5kB

80MHz

400 kbps

2500

100MHz

A2F200M3F-FG484 vs A2F200M3F-FGG256I
A2F200M3F-1FGG484I

Microsemi Corporation

12 Weeks

484-BGA

YES

484

-40°C~100°C TJ

Tray

SmartFusion®

e1

Active

3 (168 Hours)

484

Tin/Silver/Copper (Sn/Ag/Cu)

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

250

1.5V

1mm

100MHz

30

A2F200

94

Not Qualified

-

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1mA

MCU - 41, FPGA - 94

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

FIELD PROGRAMMABLE GATE ARRAY

ARM

200000

8

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

2.44mm

23mm

23mm

RoHS Compliant

-

2015

-

-

1.5V

1.575V

1.425V

-

-

-

-

-

A2F200M3F-FG484 vs A2F200M3F-1FGG484I
A2F200M3F-1FGG256I

Microsemi Corporation

12 Weeks

256-LBGA

-

-

-40°C~100°C TJ

Tray

SmartFusion®

-

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

A2F200

-

-

-

-

-

-

MCU - 25, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

-

-

-

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

-

-

-

RoHS Compliant

256-FPBGA (17x17)

2015

-

-

-

-

-

-

100MHz

-

-

-

A2F200M3F-FG484 vs A2F200M3F-1FGG256I