Microsemi Corporation A2F200M3F-1FG256I
- Part Number:
- A2F200M3F-1FG256I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3668611-A2F200M3F-1FG256I
- Description:
- IC FPGA 200K GATES 256KB 256-BGA
- ECAD Model:
-
- Datasheet:
- A2F200M3F-1FG256I
Microsemi Corporation A2F200M3F-1FG256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-1FG256I.
- Factory Lead Time12 Weeks
- Package / Case256-LBGA
- Surface MountYES
- Number of Pins256
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesSmartFusion®
- JESD-609 Codee0
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- Terminal FinishTin/Lead (Sn/Pb)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)225
- Supply Voltage1.5V
- Terminal Pitch1mm
- Frequency100MHz
- Reflow Temperature-Max (s)20
- Base Part NumberA2F200
- Number of Outputs66
- Supply Voltage-Max (Vsup)1.575V
- Supply Voltage-Min (Vsup)1.425V
- InterfaceEBI/EMI, Ethernet, I2C, SPI, UART, USART
- Operating Supply Current3mA
- Number of I/OMCU - 25, FPGA - 66
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDMA, POR, WDT
- ConnectivityEBI/EMI, Ethernet, I2C, SPI, UART/USART
- ArchitectureMCU, FPGA
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Core ArchitectureARM
- Number of Gates200000
- Number of Logic Blocks (LABs)8
- Primary AttributesProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
- Flash Size256KB
- Height Seated (Max)1.7mm
- Length17mm
- Width17mm
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
This product features a surface mount design, with 256 terminations in a ball form and a terminal pitch of 1mm. The reflow temperature-max is 20 seconds, and the maximum supply voltage is 1.575V. It operates with a low supply current of 3mA and is powered by an ARM® Cortex®-M3 core processor. The length of the product is 17mm and it is not compliant with RoHS regulations.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-1FG256I System On Chip (SoC) applications.
Robotics
Measurement tools
AC-input BLDC motor drive
Transmitters
Vending machines
Special Issue Information
Industrial Pressure
Microcontroller
ARM Cortex M4 microcontroller
Mobile market
This product features a surface mount design, with 256 terminations in a ball form and a terminal pitch of 1mm. The reflow temperature-max is 20 seconds, and the maximum supply voltage is 1.575V. It operates with a low supply current of 3mA and is powered by an ARM® Cortex®-M3 core processor. The length of the product is 17mm and it is not compliant with RoHS regulations.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-1FG256I System On Chip (SoC) applications.
Robotics
Measurement tools
AC-input BLDC motor drive
Transmitters
Vending machines
Special Issue Information
Industrial Pressure
Microcontroller
ARM Cortex M4 microcontroller
Mobile market
A2F200M3F-1FG256I More Descriptions
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA
MILITARY GRADE SMARTFUSION CUSTOMIZABLE SYSTEM-ON-CHIP (CSOC)
IC FPGA 200K GATES 256KB 256-BGA
IC SOC CORTEX-M3 100MHZ 256FBGA
MILITARY GRADE SMARTFUSION CUSTOMIZABLE SYSTEM-ON-CHIP (CSOC)
IC FPGA 200K GATES 256KB 256-BGA
IC SOC CORTEX-M3 100MHZ 256FBGA
The three parts on the right have similar specifications to A2F200M3F-1FG256I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberNumber of OutputsSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)InterfaceOperating Supply CurrentNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureProgrammable Logic TypeCore ArchitectureNumber of GatesNumber of Logic Blocks (LABs)Primary AttributesFlash SizeHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusMountQualification StatusOperating Supply VoltageMax Supply VoltageMin Supply VoltageSupplier Device PackageMax Operating TemperatureMin Operating TemperatureMemory SizeSpeedData RateNumber of Logic Elements/CellsMax FrequencyView Compare
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A2F200M3F-1FG256I12 Weeks256-LBGAYES256-40°C~100°C TJTray2009SmartFusion®e0Active3 (168 Hours)256Tin/Lead (Sn/Pb)Field Programmable Gate ArraysCMOSBOTTOMBALL2251.5V1mm100MHz20A2F200661.575V1.425VEBI/EMI, Ethernet, I2C, SPI, UART, USART3mAMCU - 25, FPGA - 6664KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USARTMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYARM2000008ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KB1.7mm17mm17mmNoNon-RoHS Compliant-------------- -
12 Weeks256-LBGA-2560°C~85°C TJTray2012SmartFusion®-Active3 (168 Hours)256TIN LEAD/TIN LEAD SILVERField Programmable Gate ArraysCMOSBOTTOMBALL2251.5V1mm80MHz30A2F20066--EBI/EMI, Ethernet, I2C, SPI, UART, USART2mAMCU - 25, FPGA - 6664KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USARTMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYARM2000008ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KB1.7mm17mm17mm-Non-RoHS CompliantSurface MountNot Qualified1.5V1.575V1.425V--------
-
16 Weeks256-LBGA-256-40°C~100°C TJTray1997SmartFusion®-Active3 (168 Hours)---------80MHz-A2F200---EBI/EMI, Ethernet, I2C, SPI, UART, USART7mAMCU - 25, FPGA - 6664KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USARTMCU, FPGA-ARM200000-ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KB----RoHS Compliant--1.5V1.575V1.425V256-FPBGA (17x17)100°C-40°C4.5kB80MHz400 kbps2500100MHz
-
12 Weeks256-LBGAYES2560°C~85°C TJTray2009SmartFusion®-Active3 (168 Hours)256TIN LEAD/TIN LEAD SILVERField Programmable Gate ArraysCMOSBOTTOMBALL2251.5V1mm100MHz30A2F200661.575V1.425VEBI/EMI, Ethernet, I2C, SPI, UART, USART3mAMCU - 25, FPGA - 6664KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USARTMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYARM2000008ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KB1.7mm17mm17mmNoNon-RoHS Compliant-------------
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