A2F200M3F-1FGG256I

Microsemi Corporation A2F200M3F-1FGG256I

Part Number:
A2F200M3F-1FGG256I
Manufacturer:
Microsemi Corporation
Ventron No:
3669208-A2F200M3F-1FGG256I
Description:
IC FPGA 200K GATES 256KB 256-BGA
ECAD Model:
Datasheet:
A2F200M3F-1FGG256I

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Specifications
Microsemi Corporation A2F200M3F-1FGG256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-1FGG256I.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    256-LBGA
  • Supplier Device Package
    256-FPBGA (17x17)
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Base Part Number
    A2F200
  • Number of I/O
    MCU - 25, FPGA - 66
  • Speed
    100MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DMA, POR, WDT
  • Connectivity
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Architecture
    MCU, FPGA
  • Primary Attributes
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
  • Flash Size
    256KB
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).According to the manufacturer, this system on a chip has a package of 256-LBGA.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 25, FPGA - 66 I/Os are available in this SoC part.There is a flash of 256KB on it.Search A2F200 for system on chips with similar specs and purposes.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation
A2F200M3F-1FGG256I System On Chip (SoC) applications.

String inverter
Industrial automation devices
Robotics
CNC control
Special Issue Editors
Apple smart watch
Industrial
Deep learning hardware
Measurement tools
Three phase UPS
A2F200M3F-1FGG256I More Descriptions
FPGA SmartFusion Family 200K Gates 350MHz 130nm Technology 1.5V 256-Pin FPBGA
IC SOC CORTEX-M3 100MHZ 256FBGA
IC FPGA 200K GATES 256KB 256-BGA
IC SOC CORTEX-M3 166MHZ 484FBGA
Product Comparison
The three parts on the right have similar specifications to A2F200M3F-1FGG256I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Base Part Number
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    Flash Size
    RoHS Status
    Surface Mount
    Number of Pins
    JESD-609 Code
    Number of Terminations
    Terminal Finish
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Number of Outputs
    Qualification Status
    Operating Supply Voltage
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Operating Supply Current
    Programmable Logic Type
    Core Architecture
    Number of Gates
    Number of Logic Blocks (LABs)
    Height Seated (Max)
    Length
    Width
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Radiation Hardening
    Mount
    Max Operating Temperature
    Min Operating Temperature
    Memory Size
    Data Rate
    Number of Logic Elements/Cells
    Max Frequency
    Lead Free
    View Compare
  • A2F200M3F-1FGG256I
    A2F200M3F-1FGG256I
    12 Weeks
    256-LBGA
    256-FPBGA (17x17)
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®
    Active
    3 (168 Hours)
    A2F200
    MCU - 25, FPGA - 66
    100MHz
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    MCU, FPGA
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
    256KB
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F200M3F-1FGG484I
    12 Weeks
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®
    Active
    3 (168 Hours)
    A2F200
    MCU - 41, FPGA - 94
    -
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    MCU, FPGA
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
    256KB
    RoHS Compliant
    YES
    484
    e1
    484
    Tin/Silver/Copper (Sn/Ag/Cu)
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    250
    1.5V
    1mm
    100MHz
    30
    94
    Not Qualified
    1.5V
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    1.575V
    1.425V
    1mA
    FIELD PROGRAMMABLE GATE ARRAY
    ARM
    200000
    8
    2.44mm
    23mm
    23mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F200M3F-1FG256I
    12 Weeks
    256-LBGA
    -
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®
    Active
    3 (168 Hours)
    A2F200
    MCU - 25, FPGA - 66
    -
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    MCU, FPGA
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
    256KB
    Non-RoHS Compliant
    YES
    256
    e0
    256
    Tin/Lead (Sn/Pb)
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    225
    1.5V
    1mm
    100MHz
    20
    66
    -
    -
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    -
    -
    3mA
    FIELD PROGRAMMABLE GATE ARRAY
    ARM
    200000
    8
    1.7mm
    17mm
    17mm
    1.575V
    1.425V
    No
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F200M3F-FGG484I
    12 Weeks
    484-BGA
    484-FPBGA (23x23)
    -40°C~100°C TJ
    Tray
    2013
    SmartFusion®
    Active
    3 (168 Hours)
    A2F200
    MCU - 41, FPGA - 94
    80MHz
    64KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, Ethernet, I2C, SPI, UART/USART
    MCU, FPGA
    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
    256KB
    RoHS Compliant
    -
    484
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    100MHz
    -
    -
    -
    1.5V
    EBI/EMI, Ethernet, I2C, SPI, UART, USART
    1.575V
    1.425V
    7mA
    -
    ARM
    200000
    -
    -
    -
    -
    -
    -
    No
    Surface Mount
    100°C
    -40°C
    4.5kB
    400 kbps
    2500
    100MHz
    Lead Free
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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