Microsemi Corporation A2F200M3F-1FGG256I
- Part Number:
- A2F200M3F-1FGG256I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3669208-A2F200M3F-1FGG256I
- Description:
- IC FPGA 200K GATES 256KB 256-BGA
- Datasheet:
- A2F200M3F-1FGG256I
Microsemi Corporation A2F200M3F-1FGG256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-1FGG256I.
- Factory Lead Time12 Weeks
- Package / Case256-LBGA
- Supplier Device Package256-FPBGA (17x17)
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Base Part NumberA2F200
- Number of I/OMCU - 25, FPGA - 66
- Speed100MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDMA, POR, WDT
- ConnectivityEBI/EMI, Ethernet, I2C, SPI, UART/USART
- ArchitectureMCU, FPGA
- Primary AttributesProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
- Flash Size256KB
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).According to the manufacturer, this system on a chip has a package of 256-LBGA.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 25, FPGA - 66 I/Os are available in this SoC part.There is a flash of 256KB on it.Search A2F200 for system on chips with similar specs and purposes.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
A2F200M3F-1FGG256I System On Chip (SoC) applications.
String inverter
Industrial automation devices
Robotics
CNC control
Special Issue Editors
Apple smart watch
Industrial
Deep learning hardware
Measurement tools
Three phase UPS
This SoC is built on ARM? Cortex?-M3 core processor(s).According to the manufacturer, this system on a chip has a package of 256-LBGA.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.MCU - 25, FPGA - 66 I/Os are available in this SoC part.There is a flash of 256KB on it.Search A2F200 for system on chips with similar specs and purposes.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
A2F200M3F-1FGG256I System On Chip (SoC) applications.
String inverter
Industrial automation devices
Robotics
CNC control
Special Issue Editors
Apple smart watch
Industrial
Deep learning hardware
Measurement tools
Three phase UPS
A2F200M3F-1FGG256I More Descriptions
FPGA SmartFusion Family 200K Gates 350MHz 130nm Technology 1.5V 256-Pin FPBGA
IC SOC CORTEX-M3 100MHZ 256FBGA
IC FPGA 200K GATES 256KB 256-BGA
IC SOC CORTEX-M3 166MHZ 484FBGA
IC SOC CORTEX-M3 100MHZ 256FBGA
IC FPGA 200K GATES 256KB 256-BGA
IC SOC CORTEX-M3 166MHZ 484FBGA
The three parts on the right have similar specifications to A2F200M3F-1FGG256I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Base Part NumberNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesFlash SizeRoHS StatusSurface MountNumber of PinsJESD-609 CodeNumber of TerminationsTerminal FinishSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Number of OutputsQualification StatusOperating Supply VoltageInterfaceMax Supply VoltageMin Supply VoltageOperating Supply CurrentProgrammable Logic TypeCore ArchitectureNumber of GatesNumber of Logic Blocks (LABs)Height Seated (Max)LengthWidthSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Radiation HardeningMountMax Operating TemperatureMin Operating TemperatureMemory SizeData RateNumber of Logic Elements/CellsMax FrequencyLead FreeView Compare
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A2F200M3F-1FGG256I12 Weeks256-LBGA256-FPBGA (17x17)-40°C~100°C TJTray2015SmartFusion®Active3 (168 Hours)A2F200MCU - 25, FPGA - 66100MHz64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USARTMCU, FPGAProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KBRoHS Compliant----------------------------------------
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12 Weeks484-BGA--40°C~100°C TJTray2015SmartFusion®Active3 (168 Hours)A2F200MCU - 41, FPGA - 94-64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USARTMCU, FPGAProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KBRoHS CompliantYES484e1484Tin/Silver/Copper (Sn/Ag/Cu)Field Programmable Gate ArraysCMOSBOTTOMBALL2501.5V1mm100MHz3094Not Qualified1.5VEBI/EMI, Ethernet, I2C, SPI, UART, USART1.575V1.425V1mAFIELD PROGRAMMABLE GATE ARRAYARM20000082.44mm23mm23mm-----------
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12 Weeks256-LBGA--40°C~100°C TJTray2009SmartFusion®Active3 (168 Hours)A2F200MCU - 25, FPGA - 66-64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USARTMCU, FPGAProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KBNon-RoHS CompliantYES256e0256Tin/Lead (Sn/Pb)Field Programmable Gate ArraysCMOSBOTTOMBALL2251.5V1mm100MHz2066--EBI/EMI, Ethernet, I2C, SPI, UART, USART--3mAFIELD PROGRAMMABLE GATE ARRAYARM20000081.7mm17mm17mm1.575V1.425VNo--------
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12 Weeks484-BGA484-FPBGA (23x23)-40°C~100°C TJTray2013SmartFusion®Active3 (168 Hours)A2F200MCU - 41, FPGA - 9480MHz64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USARTMCU, FPGAProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KBRoHS Compliant-484----------100MHz---1.5VEBI/EMI, Ethernet, I2C, SPI, UART, USART1.575V1.425V7mA-ARM200000------NoSurface Mount100°C-40°C4.5kB400 kbps2500100MHzLead Free
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