Microsemi Corporation A2F200M3F-1FGG484I

Name: A2F200M3F-1FGG484I
Brand: Microsemi Corporation
SKU: 3828055-A2F200M3F-1FGG484I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F200M3F-1FGG484I

Manufacturer:: Microsemi Corporation

Ventron No:: 3828055-A2F200M3F-1FGG484I

Description:: IC FPGA 200K GATES 256KB 256-BGA

ECAD Model:

Datasheet:: A2F200M3F-1FGG484I

Specifications

Microsemi Corporation A2F200M3F-1FGG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-1FGG484I.

Factory Lead Time
12 Weeks
Package / Case
484-BGA
Surface Mount
YES
Number of Pins
484
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2015
Series
SmartFusion®
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
484
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1.5V
Terminal Pitch
1mm
Frequency
100MHz
Reflow Temperature-Max (s)
30
Base Part Number
A2F200
Number of Outputs
94
Qualification Status
Not Qualified
Operating Supply Voltage
1.5V
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Operating Supply Current
1mA
Number of I/O
MCU - 41, FPGA - 94
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Core Architecture
ARM
Number of Gates
200000
Number of Logic Blocks (LABs)
8
Primary Attributes
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size
256KB
Height Seated (Max)
2.44mm
Length
23mm
Width
23mm
RoHS Status
RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
Microsemi Corporation offers a highly advanced solution in the form of their Embedded - System On Chip (SoC) chip. This chip falls under the Embedded - System On Chip (SoC) category and boasts impressive features such as a Tray packaging, 484 terminations, CMOS technology, 1mm terminal pitch, 94 outputs, and a RAM size of 64KB. Although the chip is not yet qualified, it operates at a low voltage of 1.5V and offers connectivity options such as EBI/EMI, Ethernet, I2C, SPI, and UART/USART. Additionally, the chip has a maximum seated height of 2.44mm, making it a compact and efficient choice for various embedded systems.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F200M3F-1FGG484I System On Chip (SoC) applications.

Smartphone accessories
Level
Sensor network-on-chip (sNoC)
Keywords
AC drive control module
Industrial automation devices
Fitness
Self-aware system-on-chip (SoC)
Smartphones
Avionics

A2F200M3F-1FGG484I More Descriptions

A2F200M3F-1Fgg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip A2F200M3F-1FGG484I
IC SOC CORTEX-M3 100MHZ 484FBGA
IC FPGA 200K GATES 256KB 256-BGA
IC SOC CORTEX-M3 166MHZ 400VFBGA

Product Comparison

The three parts on the right have similar specifications to A2F200M3F-1FGG484I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Number of Pins

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

Base Part Number

Number of Outputs

Qualification Status

Operating Supply Voltage

Interface

Max Supply Voltage

Min Supply Voltage

Operating Supply Current

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Programmable Logic Type

Core Architecture

Number of Gates

Number of Logic Blocks (LABs)

Primary Attributes

Flash Size

Height Seated (Max)

Length

Width

RoHS Status

Mount

Supplier Device Package

Speed

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

View Compare
A2F200M3F-1FGG484I

Microsemi Corporation

12 Weeks

484-BGA

YES

484

-40°C~100°C TJ

Tray

2015

SmartFusion®

e1

Active

3 (168 Hours)

484

Tin/Silver/Copper (Sn/Ag/Cu)

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

250

1.5V

1mm

100MHz

30

A2F200

94

Not Qualified

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

1mA

MCU - 41, FPGA - 94

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

FIELD PROGRAMMABLE GATE ARRAY

ARM

200000

8

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

2.44mm

23mm

23mm

RoHS Compliant

-

-

-

-

-

-
A2F200M3F-FG256

Microsemi Corporation

12 Weeks

256-LBGA

-

256

0°C~85°C TJ

Tray

2012

SmartFusion®

-

Active

3 (168 Hours)

256

TIN LEAD/TIN LEAD SILVER

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1.5V

1mm

80MHz

30

A2F200

66

Not Qualified

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

2mA

MCU - 25, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

FIELD PROGRAMMABLE GATE ARRAY

ARM

200000

8

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

1.7mm

17mm

17mm

Non-RoHS Compliant

Surface Mount

-

-

-

-

A2F200M3F-1FGG484I vs A2F200M3F-FG256
A2F200M3F-1FGG256I

Microsemi Corporation

12 Weeks

256-LBGA

-

-

-40°C~100°C TJ

Tray

2015

SmartFusion®

-

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

A2F200

-

-

-

-

-

-

-

MCU - 25, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

-

-

-

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

-

-

-

RoHS Compliant

-

256-FPBGA (17x17)

100MHz

-

-

A2F200M3F-1FGG484I vs A2F200M3F-1FGG256I
A2F200M3F-FG484

Microsemi Corporation

12 Weeks

484-BGA

YES

484

0°C~85°C TJ

Tray

-

SmartFusion®

e0

Active

3 (168 Hours)

484

Tin/Lead (Sn/Pb)

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1.5V

1mm

80MHz

30

A2F200

94

Not Qualified

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

-

-

2mA

MCU - 41, FPGA - 94

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

FIELD PROGRAMMABLE GATE ARRAY

ARM

200000

8

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

2.44mm

23mm

23mm

Non-RoHS Compliant

-

-

-

1.575V

1.425V

A2F200M3F-1FGG484I vs A2F200M3F-FG484