Microsemi Corporation A2F200M3F-1FG256

Name: A2F200M3F-1FG256
Brand: Microsemi Corporation
SKU: 3668763-A2F200M3F-1FG256
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F200M3F-1FG256

Manufacturer:: Microsemi Corporation

Ventron No:: 3668763-A2F200M3F-1FG256

Description:: IC FPGA 200K GATES 256KB 256-BGA

ECAD Model:

Datasheet:: A2F200M3F-1FG256

Specifications

Microsemi Corporation A2F200M3F-1FG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-1FG256.

Factory Lead Time
12 Weeks
Package / Case
256-LBGA
Surface Mount
YES
Number of Pins
256
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
SmartFusion®
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
Terminal Finish
TIN LEAD/TIN LEAD SILVER
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Supply Voltage
1.5V
Terminal Pitch
1mm
Frequency
100MHz
Reflow Temperature-Max (s)
30
Base Part Number
A2F200
Number of Outputs
66
Supply Voltage-Max (Vsup)
1.575V
Supply Voltage-Min (Vsup)
1.425V
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Operating Supply Current
3mA
Number of I/O
MCU - 25, FPGA - 66
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Core Architecture
ARM
Number of Gates
200000
Number of Logic Blocks (LABs)
8
Primary Attributes
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size
256KB
Height Seated (Max)
1.7mm
Length
17mm
Width
17mm
Radiation Hardening
No
RoHS Status
Non-RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
This product features a 256-LBGA package/case with 256 pins and a terminal finish of TIN LEAD/TIN LEAD SILVER. Utilizing CMOS technology, it offers 66 outputs and a maximum supply voltage of 1.575V. With an operating supply current of 3mA, it also boasts a high number of I/Os, including 25 for MCU and 66 for FPGA. This product offers versatile connectivity options, including EBI/EMI, Ethernet, I2C, SPI, and UART/USART. Its maximum seated height is 1.7mm, making it a compact and efficient choice for a variety of applications. Trust in the reliability and performance of this product for your electronic needs.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F200M3F-1FG256 System On Chip (SoC) applications.

High-end PLC
Efficient hardware for training of neural networks
Measurement tools
Microcontroller
Optical drive
Mobile computing
Special Issue Editors
RISC-V
Multiprocessor system-on-chips (MPSoCs)
Vending machines

A2F200M3F-1FG256 More Descriptions

MILITARY GRADE SMARTFUSION CUSTOMIZABLE SYSTEM-ON-CHIP (CSOC)
IC SOC CORTEX-M3 100MHZ 256FBGA
IC FPGA 200K GATES 256KB 256-BGA
IC SOC CORTEX-M3 166MHZ 144TQFP

Product Comparison

The three parts on the right have similar specifications to A2F200M3F-1FG256.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Number of Pins

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

Base Part Number

Number of Outputs

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Interface

Operating Supply Current

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Programmable Logic Type

Core Architecture

Number of Gates

Number of Logic Blocks (LABs)

Primary Attributes

Flash Size

Height Seated (Max)

Length

Width

Radiation Hardening

RoHS Status

Supplier Device Package

Max Operating Temperature

Min Operating Temperature

Operating Supply Voltage

Max Supply Voltage

Min Supply Voltage

Speed

Max Frequency

Number of Registers

JESD-609 Code

Qualification Status

View Compare
A2F200M3F-1FG256

Microsemi Corporation

12 Weeks

256-LBGA

YES

256

0°C~85°C TJ

Tray

2009

SmartFusion®

Active

3 (168 Hours)

256

TIN LEAD/TIN LEAD SILVER

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1.5V

1mm

100MHz

30

A2F200

66

1.575V

1.425V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

3mA

MCU - 25, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

FIELD PROGRAMMABLE GATE ARRAY

ARM

200000

8

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

1.7mm

17mm

17mm

No

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-
A2F200M3F-PQ208

Microsemi Corporation

2 Weeks

208-BFQFP

-

208

0°C~85°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

80MHz

-

A2F200

-

-

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

-

MCU - 22, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

-

ARM

-

8

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

-

-

-

No

Non-RoHS Compliant

208-PQFP (28x28)

85°C

0°C

1.5V

1.575V

1.425V

80MHz

100MHz

4608

-

-

A2F200M3F-1FG256 vs A2F200M3F-PQ208
A2F200M3F-1FGG484I

Microsemi Corporation

12 Weeks

484-BGA

YES

484

-40°C~100°C TJ

Tray

2015

SmartFusion®

Active

3 (168 Hours)

484

Tin/Silver/Copper (Sn/Ag/Cu)

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

250

1.5V

1mm

100MHz

30

A2F200

94

-

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1mA

MCU - 41, FPGA - 94

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

FIELD PROGRAMMABLE GATE ARRAY

ARM

200000

8

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

2.44mm

23mm

23mm

-

RoHS Compliant

-

-

-

1.5V

1.575V

1.425V

-

-

-

e1

Not Qualified

A2F200M3F-1FG256 vs A2F200M3F-1FGG484I
A2F200M3F-1FGG256I

Microsemi Corporation

12 Weeks

256-LBGA

-

-

-40°C~100°C TJ

Tray

2015

SmartFusion®

Active

3 (168 Hours)

-

-

-

-

-

-

-

-

-

-

-

A2F200

-

-

-

-

-

MCU - 25, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

-

-

-

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

-

-

-

-

RoHS Compliant

256-FPBGA (17x17)

-

-

-

-

-

100MHz

-

-

-

-

A2F200M3F-1FG256 vs A2F200M3F-1FGG256I