Microsemi Corporation A2F200M3F-FGG256I
- Part Number:
- A2F200M3F-FGG256I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 4544094-A2F200M3F-FGG256I
- Description:
- IC FPGA 200K GATES 256KB 256-BGA
- Datasheet:
- A2F200M3F-FGG256I
Microsemi Corporation A2F200M3F-FGG256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-FGG256I.
- Factory Lead Time16 Weeks
- Package / Case256-LBGA
- Number of Pins256
- Supplier Device Package256-FPBGA (17x17)
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published1997
- SeriesSmartFusion®
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature100°C
- Min Operating Temperature-40°C
- Frequency80MHz
- Base Part NumberA2F200
- Operating Supply Voltage1.5V
- InterfaceEBI/EMI, Ethernet, I2C, SPI, UART, USART
- Max Supply Voltage1.575V
- Min Supply Voltage1.425V
- Memory Size4.5kB
- Operating Supply Current7mA
- Number of I/OMCU - 25, FPGA - 66
- Speed80MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDMA, POR, WDT
- ConnectivityEBI/EMI, Ethernet, I2C, SPI, UART/USART
- Data Rate400 kbps
- ArchitectureMCU, FPGA
- Number of Logic Elements/Cells2500
- Core ArchitectureARM
- Number of Gates200000
- Max Frequency100MHz
- Primary AttributesProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
- Flash Size256KB
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.Package 256-LBGA is assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion? is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops, an important feature to keep in mind.It comes in a state-of-the-art Tray package.As a whole, this SoC part includes MCU - 25, FPGA - 66 I/Os.There is a flash of 256KB on it.Searching A2F200 will yield system on chips with similar specs and purposes.wireless SoCs operate at 80MHz.It uses ARM as its core architecture.There is a 256-pin version of this computer SoC available.In order for the SoC computing to start, -40°C is just about right.There is a design maximum operating temperature of 100°C for this SoC system on chip.A maximum supply voltage of 1.575V is specified for the SoC security.At least 1.425V power is delivered to it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-FGG256I System On Chip (SoC) applications.
Three phase UPS
Remote control
Optical drive
Healthcare
Industrial automation devices
External USB hard disk/SSD
POS Terminals
CNC control
Sports
Mobile computing
A core processor ARM? Cortex?-M3 is used to build this SoC.Package 256-LBGA is assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion? is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops, an important feature to keep in mind.It comes in a state-of-the-art Tray package.As a whole, this SoC part includes MCU - 25, FPGA - 66 I/Os.There is a flash of 256KB on it.Searching A2F200 will yield system on chips with similar specs and purposes.wireless SoCs operate at 80MHz.It uses ARM as its core architecture.There is a 256-pin version of this computer SoC available.In order for the SoC computing to start, -40°C is just about right.There is a design maximum operating temperature of 100°C for this SoC system on chip.A maximum supply voltage of 1.575V is specified for the SoC security.At least 1.425V power is delivered to it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F200M3F-FGG256I System On Chip (SoC) applications.
Three phase UPS
Remote control
Optical drive
Healthcare
Industrial automation devices
External USB hard disk/SSD
POS Terminals
CNC control
Sports
Mobile computing
A2F200M3F-FGG256I More Descriptions
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 80MHz, 4608-Cell, CMOS, PBGA256
A2F200 Series 200000 System Gate 117 I/O 1.57 V Surface Mount FPGA - FPBGA-256
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 80MHz, 4608-Cell, CMOS, PBGA256
A2F200 Series 200000 System Gate 117 I/O 1.57 V Surface Mount FPGA - FPBGA-256
The three parts on the right have similar specifications to A2F200M3F-FGG256I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberOperating Supply VoltageInterfaceMax Supply VoltageMin Supply VoltageMemory SizeOperating Supply CurrentNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityData RateArchitectureNumber of Logic Elements/CellsCore ArchitectureNumber of GatesMax FrequencyPrimary AttributesFlash SizeRoHS StatusSurface MountJESD-609 CodeNumber of TerminationsTerminal FinishSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Number of OutputsQualification StatusProgrammable Logic TypeNumber of Logic Blocks (LABs)Height Seated (Max)LengthWidthSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Radiation HardeningView Compare
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A2F200M3F-FGG256I16 Weeks256-LBGA256256-FPBGA (17x17)-40°C~100°C TJTray1997SmartFusion®Active3 (168 Hours)100°C-40°C80MHzA2F2001.5VEBI/EMI, Ethernet, I2C, SPI, UART, USART1.575V1.425V4.5kB7mAMCU - 25, FPGA - 6680MHz64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART400 kbpsMCU, FPGA2500ARM200000100MHzProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KBRoHS Compliant-----------------------
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12 Weeks484-BGA484--40°C~100°C TJTray2015SmartFusion®Active3 (168 Hours)--100MHzA2F2001.5VEBI/EMI, Ethernet, I2C, SPI, UART, USART1.575V1.425V-1mAMCU - 41, FPGA - 94-64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART-MCU, FPGA-ARM200000-ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KBRoHS CompliantYESe1484Tin/Silver/Copper (Sn/Ag/Cu)Field Programmable Gate ArraysCMOSBOTTOMBALL2501.5V1mm3094Not QualifiedFIELD PROGRAMMABLE GATE ARRAY82.44mm23mm23mm---
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12 Weeks256-LBGA256--40°C~100°C TJTray2009SmartFusion®Active3 (168 Hours)--100MHzA2F200-EBI/EMI, Ethernet, I2C, SPI, UART, USART---3mAMCU - 25, FPGA - 66-64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART-MCU, FPGA-ARM200000-ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KBNon-RoHS CompliantYESe0256Tin/Lead (Sn/Pb)Field Programmable Gate ArraysCMOSBOTTOMBALL2251.5V1mm2066-FIELD PROGRAMMABLE GATE ARRAY81.7mm17mm17mm1.575V1.425VNo
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12 Weeks484-BGA484-0°C~85°C TJTray-SmartFusion®Active3 (168 Hours)--80MHzA2F200-EBI/EMI, Ethernet, I2C, SPI, UART, USART---2mAMCU - 41, FPGA - 94-64KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, Ethernet, I2C, SPI, UART/USART-MCU, FPGA-ARM200000-ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops256KBNon-RoHS CompliantYESe0484Tin/Lead (Sn/Pb)Field Programmable Gate ArraysCMOSBOTTOMBALL2251.5V1mm3094Not QualifiedFIELD PROGRAMMABLE GATE ARRAY82.44mm23mm23mm1.575V1.425V-
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