Microsemi Corporation A2F200M3F-FG256

Name: A2F200M3F-FG256
Brand: Microsemi Corporation
SKU: 4544159-A2F200M3F-FG256
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F200M3F-FG256

Manufacturer:: Microsemi Corporation

Ventron No:: 4544159-A2F200M3F-FG256

Description:: IC FPGA 200K GATES 256KB 256-BGA

ECAD Model:

Datasheet:: A2F200M3F-FG256

Specifications

Microsemi Corporation A2F200M3F-FG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-FG256.

Factory Lead Time
12 Weeks
Mount
Surface Mount
Package / Case
256-LBGA
Number of Pins
256
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2012
Series
SmartFusion®
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
Terminal Finish
TIN LEAD/TIN LEAD SILVER
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Supply Voltage
1.5V
Terminal Pitch
1mm
Frequency
80MHz
Reflow Temperature-Max (s)
30
Base Part Number
A2F200
Number of Outputs
66
Qualification Status
Not Qualified
Operating Supply Voltage
1.5V
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Operating Supply Current
2mA
Number of I/O
MCU - 25, FPGA - 66
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Core Architecture
ARM
Number of Gates
200000
Number of Logic Blocks (LABs)
8
Primary Attributes
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size
256KB
Height Seated (Max)
1.7mm
Length
17mm
Width
17mm
RoHS Status
Non-RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
In 2012, a new technology was published that revolutionized the world of electronics. This technology, known as CMOS, utilized a terminal position of BOTTOM and a terminal form of BALL. The base part number associated with this technology was A2F200, and it boasted an impressive number of 66 outputs. In addition, this technology was equipped with advanced peripherals such as DMA, POR, and WDT. Its architecture included both MCU and FPGA components, making it a versatile and powerful tool for various applications. With a whopping 200,000 gates, this technology was able to handle complex tasks with ease. And despite its impressive capabilities, it maintained a compact length of only 17mm. Truly a game-changing innovation in the world of electronics.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F200M3F-FG256 System On Chip (SoC) applications.

Flow Sensors
Medical Pressure
Cyber security for critical applications in the aerospace
High-end PLC
Transmitters
Video Imaging
Digital Signal Processing
External USB hard disk/SSD
Cyberphysical system-on-chip
Smartphones

A2F200M3F-FG256 More Descriptions

FPGA SmartFusion 200K Gates 2000 Cells 100MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA
FPGA 4608 CLBS 200000 GATES PBGA256
IC FPGA 200K GATES 256KB 256-BGA
IC SOC CORTEX-M3 166MHZ 256FBGA

Product Comparison

The three parts on the right have similar specifications to A2F200M3F-FG256.

Image

Part Number

Manufacturer

Factory Lead Time

Mount

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

Base Part Number

Number of Outputs

Qualification Status

Operating Supply Voltage

Interface

Max Supply Voltage

Min Supply Voltage

Operating Supply Current

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Programmable Logic Type

Core Architecture

Number of Gates

Number of Logic Blocks (LABs)

Primary Attributes

Flash Size

Height Seated (Max)

Length

Width

RoHS Status

Supplier Device Package

Max Operating Temperature

Min Operating Temperature

Speed

Max Frequency

Number of Registers

Radiation Hardening

Surface Mount

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

JESD-609 Code

View Compare
A2F200M3F-FG256

Microsemi Corporation

12 Weeks

Surface Mount

256-LBGA

256

0°C~85°C TJ

Tray

2012

SmartFusion®

Active

3 (168 Hours)

256

TIN LEAD/TIN LEAD SILVER

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1.5V

1mm

80MHz

30

A2F200

66

Not Qualified

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

2mA

MCU - 25, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

FIELD PROGRAMMABLE GATE ARRAY

ARM

200000

8

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

1.7mm

17mm

17mm

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-
A2F200M3F-PQ208

Microsemi Corporation

2 Weeks

-

208-BFQFP

208

0°C~85°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

80MHz

-

A2F200

-

-

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

-

MCU - 22, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

-

ARM

-

8

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

-

-

-

Non-RoHS Compliant

208-PQFP (28x28)

85°C

0°C

80MHz

100MHz

4608

No

-

-

-

-

A2F200M3F-FG256 vs A2F200M3F-PQ208
A2F200M3F-1FG256

Microsemi Corporation

12 Weeks

-

256-LBGA

256

0°C~85°C TJ

Tray

2009

SmartFusion®

Active

3 (168 Hours)

256

TIN LEAD/TIN LEAD SILVER

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1.5V

1mm

100MHz

30

A2F200

66

-

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

-

-

3mA

MCU - 25, FPGA - 66

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

FIELD PROGRAMMABLE GATE ARRAY

ARM

200000

8

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

1.7mm

17mm

17mm

Non-RoHS Compliant

-

-

-

-

-

-

No

YES

1.575V

1.425V

-

A2F200M3F-FG256 vs A2F200M3F-1FG256
A2F200M3F-FG484

Microsemi Corporation

12 Weeks

-

484-BGA

484

0°C~85°C TJ

Tray

-

SmartFusion®

Active

3 (168 Hours)

484

Tin/Lead (Sn/Pb)

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1.5V

1mm

80MHz

30

A2F200

94

Not Qualified

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

-

-

2mA

MCU - 41, FPGA - 94

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

MCU, FPGA

FIELD PROGRAMMABLE GATE ARRAY

ARM

200000

8

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

2.44mm

23mm

23mm

Non-RoHS Compliant

-

-

-

-

-

-

-

YES

1.575V

1.425V

e0

A2F200M3F-FG256 vs A2F200M3F-FG484