A2F060M3E-TQG144I

Microsemi Corporation A2F060M3E-TQG144I

Part Number:
A2F060M3E-TQG144I
Manufacturer:
Microsemi Corporation
Ventron No:
3828033-A2F060M3E-TQG144I
Description:
IC FPGA 60K GATES 128KB 144-TQFP
ECAD Model:
Datasheet:
SmartFusion cSoC Datasheet

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Microsemi Corporation A2F060M3E-TQG144I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F060M3E-TQG144I.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    144-LQFP
  • Supplier Device Package
    144-TQFP (20x20)
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2011
  • Series
    SmartFusion®
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature
    100°C
  • Min Operating Temperature
    -40°C
  • Frequency
    80MHz
  • Base Part Number
    A2F060M3E
  • Interface
    EBI/EMI, I2C, SPI, UART, USART
  • Number of I/O
    MCU - 21, FPGA - 33
  • Speed
    80MHz
  • RAM Size
    16KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DMA, POR, WDT
  • Connectivity
    EBI/EMI, I2C, SPI, UART/USART
  • Architecture
    MCU, FPGA
  • Core Architecture
    ARM
  • Primary Attributes
    ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Flash Size
    128KB
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).The manufacturer assigns this system on a chip with a 144-LQFP package.The SoC chip provides users with reliable performance because it is implemented with 16KB RAM.Internally, this SoC design uses the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops and that is something to note.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are MCU - 21, FPGA - 33.The flash size of the SoC meaning is 128KB.Searching A2F060M3E will yield system on chips with similar specs and purposes.There is 80MHz frequency associated with the wireless SoC.In terms of core architecture, the SoC meaning relies on ARM.In order for the SoC computing to start up, -40°C is sufficient.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 100°C.

ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-TQG144I System On Chip (SoC) applications.

Industrial transport
POS Terminals
Robotics
Medical
Efficient hardware for inference of neural networks
Healthcare
Apple smart watch
Defense
sequence controllers
Transmitters
A2F060M3E-TQG144I More Descriptions
FPGA SmartFusion 60K Gates 700 Cells 100MHz 130nm (CMOS) Technology 1.5V 144-Pin TQFP
IC FPGA 60K GATES 128KB 144-TQFP
IC SOC CORTEX-M3 80MHZ 144TQFP
Product Comparison
The three parts on the right have similar specifications to A2F060M3E-TQG144I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Core Architecture
    Primary Attributes
    Flash Size
    RoHS Status
    Mount
    Number of Pins
    JESD-609 Code
    Number of Terminations
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Operating Supply Voltage
    Max Supply Voltage
    Min Supply Voltage
    Memory Size
    Operating Supply Current
    Data Rate
    Programmable Logic Type
    Number of Logic Elements/Cells
    Number of Gates
    Height Seated (Max)
    Length
    Width
    Reach Compliance Code
    View Compare
  • A2F060M3E-TQG144I
    A2F060M3E-TQG144I
    12 Weeks
    144-LQFP
    144-TQFP (20x20)
    -40°C~100°C TJ
    Tray
    2011
    SmartFusion®
    Obsolete
    3 (168 Hours)
    100°C
    -40°C
    80MHz
    A2F060M3E
    EBI/EMI, I2C, SPI, UART, USART
    MCU - 21, FPGA - 33
    80MHz
    16KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, I2C, SPI, UART/USART
    MCU, FPGA
    ARM
    ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
    128KB
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F060M3E-FGG256
    2 Weeks
    256-LBGA
    -
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®
    Obsolete
    3 (168 Hours)
    -
    -
    80MHz
    A2F060M3E
    EBI/EMI, I2C, SPI, UART, USART
    MCU - 26, FPGA - 66
    -
    16KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, I2C, SPI, UART/USART
    MCU, FPGA
    ARM
    ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
    128KB
    RoHS Compliant
    Surface Mount
    256
    e1
    256
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    250
    1.5V
    1mm
    30
    1.5V
    1.575V
    1.425V
    4.5kB
    3mA
    400 kbps
    FIELD PROGRAMMABLE GATE ARRAY
    660
    60000
    1.7mm
    17mm
    17mm
    -
  • A2F060M3E-1FGG256M
    -
    256-LBGA
    256-FPBGA (17x17)
    -55°C~125°C TJ
    Tray
    -
    SmartFusion®
    Obsolete
    3 (168 Hours)
    125°C
    -55°C
    100MHz
    A2F060M3E
    EBI/EMI, I2C, SPI, UART, USART
    MCU - 26, FPGA - 66
    100MHz
    16KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, I2C, SPI, UART/USART
    MCU, FPGA
    ARM
    ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
    128KB
    RoHS Compliant
    -
    256
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • A2F060M3E-1FG256M
    -
    256-LBGA
    -
    -55°C~125°C TJ
    Tray
    -
    SmartFusion®
    Obsolete
    3 (168 Hours)
    -
    -
    100MHz
    A2F060M3E
    EBI/EMI, I2C, SPI, UART, USART
    MCU - 26, FPGA - 66
    -
    16KB
    ARM® Cortex®-M3
    DMA, POR, WDT
    EBI/EMI, I2C, SPI, UART/USART
    MCU, FPGA
    ARM
    ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
    128KB
    Non-RoHS Compliant
    -
    256
    -
    -
    -
    8542.39.00.01
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    unknown
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 26 September 2023

    W25Q128JVSIQ Footprint, Features and Package

    Ⅰ. W25Q128JVSIQ descriptionⅡ. W25Q128JVSIQ symbol and footprintⅢ. Technical parametersⅣ. Features of W25Q128JVSIQⅤ. Pin configuration of W25Q128JVSIQⅥ. Package of W25Q128JVSIQⅦ. What are the characteristics of the SPI interface of...
  • 26 September 2023

    TDA7560 Audio Power Amplifier: Symbol, Features and Application

    Ⅰ. Overview of TDA7560Ⅱ. Pin connection, symbol and footprint of TDA7560Ⅲ. Technical parametersⅣ. Features of TDA7560Ⅴ. Application of TDA7560Ⅵ. Are TDA7560 and TDA7851 interchangeable?Ⅶ. TDA7560 car power amplifier...
  • 27 September 2023

    BC640 PNP Transistor: Features, Package and Other Details

    Ⅰ. Overview of BC640Ⅱ. Symbol and footprint of BC640Ⅲ. Technical parametersⅣ. Features of BC640Ⅴ. Pinout and package of BC640Ⅵ. Application of BC640Ⅶ. How to optimize the performance of...
  • 27 September 2023

    Introduction to the BTS7960B Motor Drive Module

    Ⅰ. What is BTS7960B?Ⅱ. BTS7960B symbol, footprint and pin configurationⅢ. Technical parametersⅣ. Features of BTS7960BⅤ. What are the advantages and disadvantages of BTS7960B?Ⅵ. How to optimize the BTS7960B...
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.