Microsemi Corporation A2F060M3E-TQG144I
- Part Number:
- A2F060M3E-TQG144I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3828033-A2F060M3E-TQG144I
- Description:
- IC FPGA 60K GATES 128KB 144-TQFP
- Datasheet:
- SmartFusion cSoC Datasheet
Microsemi Corporation A2F060M3E-TQG144I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F060M3E-TQG144I.
- Factory Lead Time12 Weeks
- Package / Case144-LQFP
- Supplier Device Package144-TQFP (20x20)
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2011
- SeriesSmartFusion®
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature100°C
- Min Operating Temperature-40°C
- Frequency80MHz
- Base Part NumberA2F060M3E
- InterfaceEBI/EMI, I2C, SPI, UART, USART
- Number of I/OMCU - 21, FPGA - 33
- Speed80MHz
- RAM Size16KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDMA, POR, WDT
- ConnectivityEBI/EMI, I2C, SPI, UART/USART
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Primary AttributesProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
- Flash Size128KB
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).The manufacturer assigns this system on a chip with a 144-LQFP package.The SoC chip provides users with reliable performance because it is implemented with 16KB RAM.Internally, this SoC design uses the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops and that is something to note.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are MCU - 21, FPGA - 33.The flash size of the SoC meaning is 128KB.Searching A2F060M3E will yield system on chips with similar specs and purposes.There is 80MHz frequency associated with the wireless SoC.In terms of core architecture, the SoC meaning relies on ARM.In order for the SoC computing to start up, -40°C is sufficient.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 100°C.
ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-TQG144I System On Chip (SoC) applications.
Industrial transport
POS Terminals
Robotics
Medical
Efficient hardware for inference of neural networks
Healthcare
Apple smart watch
Defense
sequence controllers
Transmitters
This SoC is built on ARM? Cortex?-M3 core processor(s).The manufacturer assigns this system on a chip with a 144-LQFP package.The SoC chip provides users with reliable performance because it is implemented with 16KB RAM.Internally, this SoC design uses the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops and that is something to note.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are MCU - 21, FPGA - 33.The flash size of the SoC meaning is 128KB.Searching A2F060M3E will yield system on chips with similar specs and purposes.There is 80MHz frequency associated with the wireless SoC.In terms of core architecture, the SoC meaning relies on ARM.In order for the SoC computing to start up, -40°C is sufficient.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 100°C.
ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-TQG144I System On Chip (SoC) applications.
Industrial transport
POS Terminals
Robotics
Medical
Efficient hardware for inference of neural networks
Healthcare
Apple smart watch
Defense
sequence controllers
Transmitters
A2F060M3E-TQG144I More Descriptions
FPGA SmartFusion 60K Gates 700 Cells 100MHz 130nm (CMOS) Technology 1.5V 144-Pin TQFP
IC FPGA 60K GATES 128KB 144-TQFP
IC SOC CORTEX-M3 80MHZ 144TQFP
IC FPGA 60K GATES 128KB 144-TQFP
IC SOC CORTEX-M3 80MHZ 144TQFP
The three parts on the right have similar specifications to A2F060M3E-TQG144I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitecturePrimary AttributesFlash SizeRoHS StatusMountNumber of PinsJESD-609 CodeNumber of TerminationsTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Operating Supply VoltageMax Supply VoltageMin Supply VoltageMemory SizeOperating Supply CurrentData RateProgrammable Logic TypeNumber of Logic Elements/CellsNumber of GatesHeight Seated (Max)LengthWidthReach Compliance CodeView Compare
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A2F060M3E-TQG144I12 Weeks144-LQFP144-TQFP (20x20)-40°C~100°C TJTray2011SmartFusion®Obsolete3 (168 Hours)100°C-40°C80MHzA2F060M3EEBI/EMI, I2C, SPI, UART, USARTMCU - 21, FPGA - 3380MHz16KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, I2C, SPI, UART/USARTMCU, FPGAARMProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops128KBRoHS Compliant---------------------------
-
2 Weeks256-LBGA-0°C~85°C TJTray2015SmartFusion®Obsolete3 (168 Hours)--80MHzA2F060M3EEBI/EMI, I2C, SPI, UART, USARTMCU - 26, FPGA - 66-16KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, I2C, SPI, UART/USARTMCU, FPGAARMProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops128KBRoHS CompliantSurface Mount256e1256Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2501.5V1mm301.5V1.575V1.425V4.5kB3mA400 kbpsFIELD PROGRAMMABLE GATE ARRAY660600001.7mm17mm17mm-
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-256-LBGA256-FPBGA (17x17)-55°C~125°C TJTray-SmartFusion®Obsolete3 (168 Hours)125°C-55°C100MHzA2F060M3EEBI/EMI, I2C, SPI, UART, USARTMCU - 26, FPGA - 66100MHz16KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, I2C, SPI, UART/USARTMCU, FPGAARMProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops128KBRoHS Compliant-256------------------------
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-256-LBGA--55°C~125°C TJTray-SmartFusion®Obsolete3 (168 Hours)--100MHzA2F060M3EEBI/EMI, I2C, SPI, UART, USARTMCU - 26, FPGA - 66-16KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, I2C, SPI, UART/USARTMCU, FPGAARMProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops128KBNon-RoHS Compliant-256---8542.39.00.01-------------------unknown
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