Microsemi Corporation A2F060M3E-1TQG144

Name: A2F060M3E-1TQG144
Brand: Microsemi Corporation
SKU: 3828880-A2F060M3E-1TQG144
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F060M3E-1TQG144

Manufacturer:: Microsemi Corporation

Ventron No:: 3828880-A2F060M3E-1TQG144

Description:: IC FPGA 60K GATES 128KB 144-TQFP

ECAD Model:

Datasheet:: SmartFusion cSoC Datasheet

Specifications

Microsemi Corporation A2F060M3E-1TQG144 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F060M3E-1TQG144.

Package / Case
144-LQFP
Number of Pins
144
Supplier Device Package
144-TQFP (20x20)
Weight
1.319103g
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2015
Series
SmartFusion®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Frequency
100MHz
Base Part Number
A2F060M3E
Operating Supply Voltage
1.5V
Interface
EBI/EMI, I2C, SPI, UART, USART
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Number of I/O
MCU - 21, FPGA - 33
Speed
100MHz
RAM Size
16KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Speed Grade
1
Primary Attributes
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Number of Registers
1536
Flash Size
128KB
Height
1.4mm
Length
20mm
Width
20mm
Radiation Hardening
No
RoHS Status
RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
The SmartFusion® series product, with base part number A2F060M3E, comes in a 144-LQFP package and weighs 1.319103g. It is powered by an ARM® Cortex®-M3 core processor and offers connectivity options such as EBI/EMI, I2C, SPI, and UART/USART. The product has a speed grade of 1 and a flash size of 128KB. It measures 20mm in length and has a height of 1.4mm.

ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-1TQG144 System On Chip (SoC) applications.

sequence controllers
AC drive control module
Medical Pressure
Optical drive
Temperature
Industrial robot
Smartphone accessories
Robotics
POS Terminals
Cyberphysical system-on-chip

A2F060M3E-1TQG144 More Descriptions

FPGA SmartFusion Family 60K Gates 350MHz 130nm Technology 1.5V 144-Pin TQFP
IC FPGA 60K GATES 128KB 144-TQFP
IC SOC CORTEX-M3 100MHZ 144TQFP

Product Comparison

The three parts on the right have similar specifications to A2F060M3E-1TQG144.

Image

Part Number

Manufacturer

Package / Case

Number of Pins

Supplier Device Package

Weight

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Operating Supply Voltage

Interface

Max Supply Voltage

Min Supply Voltage

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Speed Grade

Primary Attributes

Number of Registers

Flash Size

Height

Length

Width

Radiation Hardening

RoHS Status

Factory Lead Time

Mount

JESD-609 Code

Number of Terminations

Terminal Finish

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Memory Size

Operating Supply Current

Data Rate

Programmable Logic Type

Number of Logic Elements/Cells

Number of Gates

Height Seated (Max)

Max Frequency

Number of Logic Blocks (LABs)

View Compare
A2F060M3E-1TQG144

Microsemi Corporation

144-LQFP

144

144-TQFP (20x20)

1.319103g

0°C~85°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

85°C

0°C

100MHz

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

1.575V

1.425V

MCU - 21, FPGA - 33

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

1

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

1536

128KB

1.4mm

20mm

20mm

No

RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
A2F060M3E-FGG256

Microsemi Corporation

256-LBGA

256

-

-

0°C~85°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

-

-

80MHz

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

1.575V

1.425V

MCU - 26, FPGA - 66

-

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

-

128KB

-

17mm

17mm

-

RoHS Compliant

2 Weeks

Surface Mount

e1

256

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1.5V

1mm

30

4.5kB

3mA

400 kbps

FIELD PROGRAMMABLE GATE ARRAY

660

60000

1.7mm

-

-

A2F060M3E-1TQG144 vs A2F060M3E-FGG256
A2F060M3E-TQG144I

Microsemi Corporation

144-LQFP

-

144-TQFP (20x20)

-

-40°C~100°C TJ

Tray

2011

SmartFusion®

Obsolete

3 (168 Hours)

100°C

-40°C

80MHz

A2F060M3E

-

EBI/EMI, I2C, SPI, UART, USART

-

-

MCU - 21, FPGA - 33

80MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

-

128KB

-

-

-

-

RoHS Compliant

12 Weeks

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

A2F060M3E-1TQG144 vs A2F060M3E-TQG144I
A2F060M3E-1FG256

Microsemi Corporation

256-LBGA

256

256-FPBGA (17x17)

-

0°C~85°C TJ

Tray

2009

SmartFusion®

Obsolete

3 (168 Hours)

85°C

0°C

100MHz

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

-

-

MCU - 26, FPGA - 66

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

1

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

1536

128KB

-

-

-

No

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

100MHz

8

A2F060M3E-1TQG144 vs A2F060M3E-1FG256