Microsemi Corporation A2F060M3E-1FG256M

Name: A2F060M3E-1FG256M
Brand: Microsemi Corporation
SKU: 3669307-A2F060M3E-1FG256M
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F060M3E-1FG256M

Manufacturer:: Microsemi Corporation

Ventron No:: 3669307-A2F060M3E-1FG256M

Description:: IC FPGA 60K GATES 128KB 256FBGA

ECAD Model:

Datasheet:: Military Grade SmartFusion (cSoC)

Specifications

Microsemi Corporation A2F060M3E-1FG256M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F060M3E-1FG256M.

Package / Case
256-LBGA
Number of Pins
256
Operating Temperature
-55°C~125°C TJ
Packaging
Tray
Series
SmartFusion®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
HTS Code
8542.39.00.01
Reach Compliance Code
unknown
Frequency
100MHz
Base Part Number
A2F060M3E
Interface
EBI/EMI, I2C, SPI, UART, USART
Number of I/O
MCU - 26, FPGA - 66
RAM Size
16KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Primary Attributes
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size
128KB
RoHS Status
Non-RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
The operating temperature range for the A2F060M3E base part is -55°C to 125°C, making it suitable for a wide range of applications. However, it should be noted that the part status is now considered obsolete, meaning it may be difficult to find or may have limited availability. The moisture sensitivity level (MSL) for this part is 3, which means it can withstand exposure to moisture for up to 168 hours. The frequency for this part is 100MHz, providing high-speed performance. With a total of 26 I/O for MCUs and 66 for FPGAs, this part offers versatile connectivity options through EBI/EMI, I2C, SPI, UART, and USART interfaces. Additionally, the ARM® Cortex®-M3 core processor and 16KB RAM size provide efficient processing and memory capabilities. Overall, this part offers a reliable and versatile solution for various electronic applications.

ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-1FG256M System On Chip (SoC) applications.

Mobile computing
Keyboard
Robotics
Communication interfaces ( I2C, SPI )
ARM Cortex M4 microcontroller
Sports
Defense
String inverter
PC peripherals
Functional safety for critical applications in the aerospace

A2F060M3E-1FG256M More Descriptions

IC SOC CORTEX-M3 100MHZ 256FBGA
IC FPGA 60K GATES 128KB 256FBGA

Product Comparison

The three parts on the right have similar specifications to A2F060M3E-1FG256M.

Image

Part Number

Manufacturer

Package / Case

Number of Pins

Operating Temperature

Packaging

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Reach Compliance Code

Frequency

Base Part Number

Interface

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Primary Attributes

Flash Size

RoHS Status

Factory Lead Time

Supplier Device Package

Published

Max Operating Temperature

Min Operating Temperature

Operating Supply Voltage

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Speed

Data Rate

Number of Logic Elements/Cells

Number of Gates

Max Frequency

Weight

Speed Grade

Number of Registers

Height

Length

Width

Radiation Hardening

View Compare
A2F060M3E-1FG256M

Microsemi Corporation

256-LBGA

256

-55°C~125°C TJ

Tray

SmartFusion®

Obsolete

3 (168 Hours)

8542.39.00.01

unknown

100MHz

A2F060M3E

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
A2F060M3E-FGG256I

Microsemi Corporation

256-LBGA

256

-40°C~100°C TJ

Tray

SmartFusion®

Obsolete

3 (168 Hours)

-

-

80MHz

A2F060M3E

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

RoHS Compliant

12 Weeks

256-FPBGA (17x17)

2015

100°C

-40°C

1.5V

1.575V

1.425V

4.5kB

3mA

80MHz

400 kbps

660

60000

100MHz

-

-

-

-

-

-

-

A2F060M3E-1FG256M vs A2F060M3E-FGG256I
A2F060M3E-1TQG144

Microsemi Corporation

144-LQFP

144

0°C~85°C TJ

Tray

SmartFusion®

Obsolete

3 (168 Hours)

-

-

100MHz

A2F060M3E

EBI/EMI, I2C, SPI, UART, USART

MCU - 21, FPGA - 33

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

RoHS Compliant

-

144-TQFP (20x20)

2015

85°C

0°C

1.5V

1.575V

1.425V

-

-

100MHz

-

-

-

-

1.319103g

1

1536

1.4mm

20mm

20mm

No

A2F060M3E-1FG256M vs A2F060M3E-1TQG144
A2F060M3E-1FGG256M

Microsemi Corporation

256-LBGA

256

-55°C~125°C TJ

Tray

SmartFusion®

Obsolete

3 (168 Hours)

-

-

100MHz

A2F060M3E

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

RoHS Compliant

-

256-FPBGA (17x17)

-

125°C

-55°C

-

-

-

-

-

100MHz

-

-

-

-

-

-

-

-

-

-

-

A2F060M3E-1FG256M vs A2F060M3E-1FGG256M