Microsemi Corporation A2F060M3E-FG256M

Name: A2F060M3E-FG256M
Brand: Microsemi Corporation
SKU: 4544240-A2F060M3E-FG256M
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F060M3E-FG256M

Manufacturer:: Microsemi Corporation

Ventron No:: 4544240-A2F060M3E-FG256M

Description:: IC FPGA 60K GATES 128KB 256FBGA

ECAD Model:

Datasheet:: Military Grade SmartFusion (cSoC)

Specifications

Microsemi Corporation A2F060M3E-FG256M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F060M3E-FG256M.

Package / Case
256-LBGA
Number of Pins
256
Supplier Device Package
256-FPBGA (17x17)
Operating Temperature
-55°C~125°C TJ
Packaging
Tray
Series
SmartFusion®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Frequency
80MHz
Base Part Number
A2F060M3E
Interface
EBI/EMI, I2C, SPI, UART, USART
Number of I/O
MCU - 26, FPGA - 66
Speed
80MHz
RAM Size
16KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Primary Attributes
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size
128KB
RoHS Status
Non-RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
This product is packaged in a 256-LBGA case and has a supplier device package of 256-FPBGA (17x17). It is currently obsolete and has a moisture sensitivity level of 3 (168 hours). The maximum operating temperature for this product is 125°C and it has a frequency of 80MHz. The product is designed with a combination of MCU and FPGA architecture and its primary attributes include a ProASIC®3 FPGA with 60K gates and 1536 D-flip-flops. It also has a flash size of 128KB and is currently non-RoHS compliant.

ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-FG256M System On Chip (SoC) applications.

Networked Media Encode/Decode
Keyboard
Medical Pressure
Vending machines
High-end PLC
Measurement testers
POS Terminals
Automotive gateway
PC peripherals
Optical drive

A2F060M3E-FG256M More Descriptions

IC FPGA 60K GATES 128KB 256FBGA
IC SOC CORTEX-M3 100MHZ 256FBGA

Product Comparison

The three parts on the right have similar specifications to A2F060M3E-FG256M.

Image

Part Number

Manufacturer

Package / Case

Number of Pins

Supplier Device Package

Operating Temperature

Packaging

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Interface

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Primary Attributes

Flash Size

RoHS Status

Factory Lead Time

Published

Operating Supply Voltage

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Data Rate

Number of Logic Elements/Cells

Number of Gates

Max Frequency

Number of Logic Blocks (LABs)

Speed Grade

Number of Registers

Radiation Hardening

View Compare
A2F060M3E-FG256M

Microsemi Corporation

256-LBGA

256

256-FPBGA (17x17)

-55°C~125°C TJ

Tray

SmartFusion®

Obsolete

3 (168 Hours)

125°C

-55°C

80MHz

A2F060M3E

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

80MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
A2F060M3E-FGG256I

Microsemi Corporation

256-LBGA

256

256-FPBGA (17x17)

-40°C~100°C TJ

Tray

SmartFusion®

Obsolete

3 (168 Hours)

100°C

-40°C

80MHz

A2F060M3E

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

80MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

RoHS Compliant

12 Weeks

2015

1.5V

1.575V

1.425V

4.5kB

3mA

400 kbps

660

60000

100MHz

-

-

-

-

A2F060M3E-FG256M vs A2F060M3E-FGG256I
A2F060M3E-TQ144I

Microsemi Corporation

144-LQFP

-

144-TQFP (20x20)

-40°C~100°C TJ

Tray

SmartFusion®

Obsolete

3 (168 Hours)

100°C

-40°C

80MHz

A2F060M3E

EBI/EMI, I2C, SPI, UART, USART

MCU - 21, FPGA - 33

80MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

Non-RoHS Compliant

12 Weeks

2015

-

-

-

-

-

-

-

-

-

-

-

-

-

A2F060M3E-FG256M vs A2F060M3E-TQ144I
A2F060M3E-1FG256

Microsemi Corporation

256-LBGA

256

256-FPBGA (17x17)

0°C~85°C TJ

Tray

SmartFusion®

Obsolete

3 (168 Hours)

85°C

0°C

100MHz

A2F060M3E

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

Non-RoHS Compliant

-

2009

1.5V

-

-

-

-

-

-

-

100MHz

8

1

1536

No

A2F060M3E-FG256M vs A2F060M3E-1FG256