Microsemi Corporation A2F060M3E-1FG256

Name: A2F060M3E-1FG256
Brand: Microsemi Corporation
SKU: 3668516-A2F060M3E-1FG256
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F060M3E-1FG256

Manufacturer:: Microsemi Corporation

Ventron No:: 3668516-A2F060M3E-1FG256

Description:: IC FPGA 60K GATES 128KB 256FBGA

ECAD Model:

Datasheet:: SmartFusion cSoC Datasheet

Specifications

Microsemi Corporation A2F060M3E-1FG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F060M3E-1FG256.

Package / Case
256-LBGA
Number of Pins
256
Supplier Device Package
256-FPBGA (17x17)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
SmartFusion®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Frequency
100MHz
Base Part Number
A2F060M3E
Operating Supply Voltage
1.5V
Interface
EBI/EMI, I2C, SPI, UART, USART
Number of I/O
MCU - 26, FPGA - 66
Speed
100MHz
RAM Size
16KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Max Frequency
100MHz
Number of Logic Blocks (LABs)
8
Speed Grade
1
Primary Attributes
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Number of Registers
1536
Flash Size
128KB
Radiation Hardening
No
RoHS Status
Non-RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
This part is manufactured by Microsemi Corporation and falls under the Embedded - System On Chip (SoC) category. It is an SoC chip with 256 pins and comes in a 256-FPBGA (17x17) package. This specific chip is part of the SmartFusion® series, but it is now considered obsolete. It operates at a voltage of 1.5V and has connectivity options such as EBI/EMI, I2C, SPI, and UART/USART. The maximum frequency for this chip is 100MHz and it contains 1536 registers. However, it is not radiation hardened and is not compliant with RoHS standards.

ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-1FG256 System On Chip (SoC) applications.

Functional safety for critical applications in the automotive
Efficient hardware for inference of neural networks
Functional safety for critical applications in the aerospace
Special Issue Information
Digital Media
POS Terminals
Fitness
Self-aware system-on-chip (SoC)
Mouse
Smart appliances

A2F060M3E-1FG256 More Descriptions

FPGA SmartFusion Family 60K Gates 100MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA
IC SOC CORTEX-M3 100MHZ 256FBGA
IC FPGA 60K GATES 128KB 256FBGA

Product Comparison

The three parts on the right have similar specifications to A2F060M3E-1FG256.

Image

Part Number

Manufacturer

Package / Case

Number of Pins

Supplier Device Package

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Operating Supply Voltage

Interface

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Max Frequency

Number of Logic Blocks (LABs)

Speed Grade

Primary Attributes

Number of Registers

Flash Size

Radiation Hardening

RoHS Status

Factory Lead Time

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Data Rate

Number of Logic Elements/Cells

Number of Gates

Weight

Height

Length

Width

View Compare
A2F060M3E-1FG256

Microsemi Corporation

256-LBGA

256

256-FPBGA (17x17)

0°C~85°C TJ

Tray

2009

SmartFusion®

Obsolete

3 (168 Hours)

85°C

0°C

100MHz

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

100MHz

8

1

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

1536

128KB

No

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-
A2F060M3E-FGG256I

Microsemi Corporation

256-LBGA

256

256-FPBGA (17x17)

-40°C~100°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

100°C

-40°C

80MHz

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

80MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

100MHz

-

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

-

128KB

-

RoHS Compliant

12 Weeks

1.575V

1.425V

4.5kB

3mA

400 kbps

660

60000

-

-

-

-

A2F060M3E-1FG256 vs A2F060M3E-FGG256I
A2F060M3E-1TQG144

Microsemi Corporation

144-LQFP

144

144-TQFP (20x20)

0°C~85°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

85°C

0°C

100MHz

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

MCU - 21, FPGA - 33

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

-

-

1

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

1536

128KB

No

RoHS Compliant

-

1.575V

1.425V

-

-

-

-

-

1.319103g

1.4mm

20mm

20mm

A2F060M3E-1FG256 vs A2F060M3E-1TQG144
A2F060M3E-1FGG256M

Microsemi Corporation

256-LBGA

256

256-FPBGA (17x17)

-55°C~125°C TJ

Tray

-

SmartFusion®

Obsolete

3 (168 Hours)

125°C

-55°C

100MHz

A2F060M3E

-

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

-

-

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

-

128KB

-

RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

A2F060M3E-1FG256 vs A2F060M3E-1FGG256M