Microsemi Corporation A2F060M3E-FGG256I

Name: A2F060M3E-FGG256I
Brand: Microsemi Corporation
SKU: 4544092-A2F060M3E-FGG256I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F060M3E-FGG256I

Manufacturer:: Microsemi Corporation

Ventron No:: 4544092-A2F060M3E-FGG256I

Description:: IC FPGA 60K GATES 128KB 256FBGA

ECAD Model:

Datasheet:: SmartFusion cSoC Datasheet

Specifications

Microsemi Corporation A2F060M3E-FGG256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F060M3E-FGG256I.

Factory Lead Time
12 Weeks
Package / Case
256-LBGA
Number of Pins
256
Supplier Device Package
256-FPBGA (17x17)
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2015
Series
SmartFusion®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Frequency
80MHz
Base Part Number
A2F060M3E
Operating Supply Voltage
1.5V
Interface
EBI/EMI, I2C, SPI, UART, USART
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Memory Size
4.5kB
Operating Supply Current
3mA
Number of I/O
MCU - 26, FPGA - 66
Speed
80MHz
RAM Size
16KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, I2C, SPI, UART/USART
Data Rate
400 kbps
Architecture
MCU, FPGA
Number of Logic Elements/Cells
660
Core Architecture
ARM
Number of Gates
60000
Max Frequency
100MHz
Primary Attributes
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size
128KB
RoHS Status
RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
The 2015 published device boasts impressive specifications, including a maximum operating temperature of 100°C and a frequency of 80MHz. With an operating temperature range of -40°C~100°C TJ, this device can withstand extreme conditions. It requires an operating supply voltage of 1.5V and has a flash size of 128KB. Additionally, it has a total of 256 pins, providing ample connectivity options. The MCU has 26 I/O pins while the FPGA has 66, allowing for a wide range of input and output possibilities. The device also features 660 logic elements/cells, offering powerful processing capabilities. With a maximum frequency of 100MHz, this device is a high-performance option for a variety of applications.

ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-FGG256I System On Chip (SoC) applications.

Sensor network-on-chip (sNoC)
Healthcare
Mouse
POS Terminals
Avionics
Self-aware system-on-chip (SoC)
Smartphones
Test and Measurement
Wireless networking
Industrial Pressure

A2F060M3E-FGG256I More Descriptions

FPGA SmartFusion 60K Gates 700 Cells 100MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA
IC SOC CORTEX-M3 100MHZ 256FBGA
IC FPGA 60K GATES 128KB 256FBGA

Product Comparison

The three parts on the right have similar specifications to A2F060M3E-FGG256I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Number of Pins

Supplier Device Package

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Operating Supply Voltage

Interface

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Data Rate

Architecture

Number of Logic Elements/Cells

Core Architecture

Number of Gates

Max Frequency

Primary Attributes

Flash Size

RoHS Status

HTS Code

Reach Compliance Code

View Compare
A2F060M3E-FGG256I

Microsemi Corporation

12 Weeks

256-LBGA

256

256-FPBGA (17x17)

-40°C~100°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

100°C

-40°C

80MHz

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

1.575V

1.425V

4.5kB

3mA

MCU - 26, FPGA - 66

80MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

400 kbps

MCU, FPGA

660

ARM

60000

100MHz

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

RoHS Compliant

-

-

-
A2F060M3E-TQG144I

Microsemi Corporation

12 Weeks

144-LQFP

-

144-TQFP (20x20)

-40°C~100°C TJ

Tray

2011

SmartFusion®

Obsolete

3 (168 Hours)

100°C

-40°C

80MHz

A2F060M3E

-

EBI/EMI, I2C, SPI, UART, USART

-

-

-

-

MCU - 21, FPGA - 33

80MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

-

MCU, FPGA

-

ARM

-

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

RoHS Compliant

-

-

A2F060M3E-FGG256I vs A2F060M3E-TQG144I
A2F060M3E-1FGG256M

Microsemi Corporation

-

256-LBGA

256

256-FPBGA (17x17)

-55°C~125°C TJ

Tray

-

SmartFusion®

Obsolete

3 (168 Hours)

125°C

-55°C

100MHz

A2F060M3E

-

EBI/EMI, I2C, SPI, UART, USART

-

-

-

-

MCU - 26, FPGA - 66

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

-

MCU, FPGA

-

ARM

-

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

RoHS Compliant

-

-

A2F060M3E-FGG256I vs A2F060M3E-1FGG256M
A2F060M3E-1FG256M

Microsemi Corporation

-

256-LBGA

256

-

-55°C~125°C TJ

Tray

-

SmartFusion®

Obsolete

3 (168 Hours)

-

-

100MHz

A2F060M3E

-

EBI/EMI, I2C, SPI, UART, USART

-

-

-

-

MCU - 26, FPGA - 66

-

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

-

MCU, FPGA

-

ARM

-

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

Non-RoHS Compliant

8542.39.00.01

unknown

A2F060M3E-FGG256I vs A2F060M3E-1FG256M