Microsemi Corporation A2F060M3E-TQ144I
- Part Number:
- A2F060M3E-TQ144I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3668589-A2F060M3E-TQ144I
- Description:
- IC FPGA 60K GATES 128KB 144-TQFP
- ECAD Model:
-
- Datasheet:
- SmartFusion cSoC Datasheet
Microsemi Corporation A2F060M3E-TQ144I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F060M3E-TQ144I.
- Factory Lead Time12 Weeks
- Package / Case144-LQFP
- Supplier Device Package144-TQFP (20x20)
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature100°C
- Min Operating Temperature-40°C
- Frequency80MHz
- Base Part NumberA2F060M3E
- InterfaceEBI/EMI, I2C, SPI, UART, USART
- Number of I/OMCU - 21, FPGA - 33
- Speed80MHz
- RAM Size16KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDMA, POR, WDT
- ConnectivityEBI/EMI, I2C, SPI, UART/USART
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Primary AttributesProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
- Flash Size128KB
- RoHS StatusNon-RoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The package or case for this particular device is a 144-LQFP, while the supplier device package is a 144-TQFP (20x20). It was published in the year 2015, but unfortunately, its part status is now obsolete. The moisture sensitivity level (MSL) for this device is at level 3, which means it can only withstand 168 hours of exposure before it becomes damaged. The base part number for this device is A2F060M3E, and its interface includes EBI/EMI, I2C, SPI, UART, and USART. The core processor for this device is an ARM® Cortex®-M3, and it also has peripherals such as DMA, POR, and WDT. Lastly, the flash size for this device is 128KB.
ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-TQ144I System On Chip (SoC) applications.
Robotics
Keywords
Fitness
Microprocessors
Networked sensors
Vending machines
Mobile market
Level
Healthcare
CNC control
The package or case for this particular device is a 144-LQFP, while the supplier device package is a 144-TQFP (20x20). It was published in the year 2015, but unfortunately, its part status is now obsolete. The moisture sensitivity level (MSL) for this device is at level 3, which means it can only withstand 168 hours of exposure before it becomes damaged. The base part number for this device is A2F060M3E, and its interface includes EBI/EMI, I2C, SPI, UART, and USART. The core processor for this device is an ARM® Cortex®-M3, and it also has peripherals such as DMA, POR, and WDT. Lastly, the flash size for this device is 128KB.
ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-TQ144I System On Chip (SoC) applications.
Robotics
Keywords
Fitness
Microprocessors
Networked sensors
Vending machines
Mobile market
Level
Healthcare
CNC control
A2F060M3E-TQ144I More Descriptions
IC FPGA 60K Gates 128KB 144-TQFP
IC SOC CORTEX-M3 100MHZ 144TQFP
IC SOC CORTEX-M3 100MHZ 144TQFP
The three parts on the right have similar specifications to A2F060M3E-TQ144I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitecturePrimary AttributesFlash SizeRoHS StatusNumber of PinsOperating Supply VoltageMax Supply VoltageMin Supply VoltageMemory SizeOperating Supply CurrentData RateNumber of Logic Elements/CellsNumber of GatesMax FrequencyHTS CodeReach Compliance CodeView Compare
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A2F060M3E-TQ144I12 Weeks144-LQFP144-TQFP (20x20)-40°C~100°C TJTray2015SmartFusion®Obsolete3 (168 Hours)100°C-40°C80MHzA2F060M3EEBI/EMI, I2C, SPI, UART, USARTMCU - 21, FPGA - 3380MHz16KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, I2C, SPI, UART/USARTMCU, FPGAARMProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops128KBNon-RoHS Compliant------------- -
12 Weeks256-LBGA256-FPBGA (17x17)-40°C~100°C TJTray2015SmartFusion®Obsolete3 (168 Hours)100°C-40°C80MHzA2F060M3EEBI/EMI, I2C, SPI, UART, USARTMCU - 26, FPGA - 6680MHz16KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, I2C, SPI, UART/USARTMCU, FPGAARMProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops128KBRoHS Compliant2561.5V1.575V1.425V4.5kB3mA400 kbps66060000100MHz--
-
-256-LBGA256-FPBGA (17x17)-55°C~125°C TJTray-SmartFusion®Obsolete3 (168 Hours)125°C-55°C100MHzA2F060M3EEBI/EMI, I2C, SPI, UART, USARTMCU - 26, FPGA - 66100MHz16KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, I2C, SPI, UART/USARTMCU, FPGAARMProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops128KBRoHS Compliant256-----------
-
-256-LBGA--55°C~125°C TJTray-SmartFusion®Obsolete3 (168 Hours)--100MHzA2F060M3EEBI/EMI, I2C, SPI, UART, USARTMCU - 26, FPGA - 66-16KBARM® Cortex®-M3DMA, POR, WDTEBI/EMI, I2C, SPI, UART/USARTMCU, FPGAARMProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops128KBNon-RoHS Compliant256---------8542.39.00.01unknown
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