Microsemi Corporation A2F060M3E-FGG256

Name: A2F060M3E-FGG256
Brand: Microsemi Corporation
SKU: 4544123-A2F060M3E-FGG256
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F060M3E-FGG256

Manufacturer:: Microsemi Corporation

Ventron No:: 4544123-A2F060M3E-FGG256

Description:: IC FPGA 60K GATES 128KB 256FBGA

ECAD Model:

Datasheet:: SmartFusion cSoC Datasheet

Specifications

Microsemi Corporation A2F060M3E-FGG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F060M3E-FGG256.

Factory Lead Time
2 Weeks
Mount
Surface Mount
Package / Case
256-LBGA
Number of Pins
256
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2015
Series
SmartFusion®
JESD-609 Code
e1
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1.5V
Terminal Pitch
1mm
Frequency
80MHz
Reflow Temperature-Max (s)
30
Base Part Number
A2F060M3E
Operating Supply Voltage
1.5V
Interface
EBI/EMI, I2C, SPI, UART, USART
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Memory Size
4.5kB
Operating Supply Current
3mA
Number of I/O
MCU - 26, FPGA - 66
RAM Size
16KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, I2C, SPI, UART/USART
Data Rate
400 kbps
Architecture
MCU, FPGA
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
660
Core Architecture
ARM
Number of Gates
60000
Primary Attributes
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size
128KB
Height Seated (Max)
1.7mm
Length
17mm
Width
17mm
RoHS Status
RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
The ARM® Cortex®-M3 is the core processor of a device with 256 pins, published in 2015. However, its part status is now considered obsolete. The terminal finish of this device is Tin/Silver/Copper (Sn/Ag/Cu), and the terminal position is located at the bottom. It offers various peripherals such as DMA, POR, and WDT. In terms of connectivity, it supports EBI/EMI, I2C, SPI, and UART/USART. Additionally, it utilizes a Field Programmable Gate Array as its programmable logic type, providing flexibility for customization. The device has a total of 660 logic elements/cells, enabling complex and advanced functionalities.

ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-FGG256 System On Chip (SoC) applications.

Vending machines
Digital Signal Processing
Transmitters
Keyboard
Industrial automation devices
Temperature Sensors
Vending machines
Servo drive control module
Digital Media
Central alarm system

A2F060M3E-FGG256 More Descriptions

FPGA SmartFusion Family 60K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA
ACTEL'S SMARTFUSION INTELLIGENT MIXED-SIGNAL FPGAS
FPGA 1536 CLBS 60000 GATES PBGA256
IC FPGA 60K GATES 128KB 256FBGA
IC SOC CORTEX-M3 80MHZ 256FBGA

Product Comparison

The three parts on the right have similar specifications to A2F060M3E-FGG256.

Image

Part Number

Manufacturer

Factory Lead Time

Mount

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Reflow Temperature-Max (s)

Base Part Number

Operating Supply Voltage

Interface

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Data Rate

Architecture

Programmable Logic Type

Number of Logic Elements/Cells

Core Architecture

Number of Gates

Primary Attributes

Flash Size

Height Seated (Max)

Length

Width

RoHS Status

Reach Compliance Code

Supplier Device Package

Max Operating Temperature

Min Operating Temperature

Speed

Max Frequency

Number of Logic Blocks (LABs)

Speed Grade

Number of Registers

Radiation Hardening

View Compare
A2F060M3E-FGG256

Microsemi Corporation

2 Weeks

Surface Mount

256-LBGA

256

0°C~85°C TJ

Tray

2015

SmartFusion®

e1

Obsolete

3 (168 Hours)

256

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1.5V

1mm

80MHz

30

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

1.575V

1.425V

4.5kB

3mA

MCU - 26, FPGA - 66

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

400 kbps

MCU, FPGA

FIELD PROGRAMMABLE GATE ARRAY

660

ARM

60000

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

1.7mm

17mm

17mm

RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-
A2F060M3E-1FG256M

Microsemi Corporation

-

-

256-LBGA

256

-55°C~125°C TJ

Tray

-

SmartFusion®

-

Obsolete

3 (168 Hours)

-

-

8542.39.00.01

-

-

-

-

-

-

100MHz

-

A2F060M3E

-

EBI/EMI, I2C, SPI, UART, USART

-

-

-

-

MCU - 26, FPGA - 66

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

-

MCU, FPGA

-

-

ARM

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

-

-

-

Non-RoHS Compliant

unknown

-

-

-

-

-

-

-

-

-

A2F060M3E-FGG256 vs A2F060M3E-1FG256M
A2F060M3E-TQ144I

Microsemi Corporation

12 Weeks

-

144-LQFP

-

-40°C~100°C TJ

Tray

2015

SmartFusion®

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

80MHz

-

A2F060M3E

-

EBI/EMI, I2C, SPI, UART, USART

-

-

-

-

MCU - 21, FPGA - 33

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

-

MCU, FPGA

-

-

ARM

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

-

-

-

Non-RoHS Compliant

-

144-TQFP (20x20)

100°C

-40°C

80MHz

-

-

-

-

-

A2F060M3E-FGG256 vs A2F060M3E-TQ144I
A2F060M3E-1FG256

Microsemi Corporation

-

-

256-LBGA

256

0°C~85°C TJ

Tray

2009

SmartFusion®

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

100MHz

-

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

-

-

-

-

MCU - 26, FPGA - 66

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

-

MCU, FPGA

-

-

ARM

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

-

-

-

Non-RoHS Compliant

-

256-FPBGA (17x17)

85°C

0°C

100MHz

100MHz

8

1

1536

No

A2F060M3E-FGG256 vs A2F060M3E-1FG256