Microsemi Corporation A2F060M3E-1FGG256M

Name: A2F060M3E-1FGG256M
Brand: Microsemi Corporation
SKU: 3669314-A2F060M3E-1FGG256M
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F060M3E-1FGG256M

Manufacturer:: Microsemi Corporation

Ventron No:: 3669314-A2F060M3E-1FGG256M

Description:: IC FPGA 60K GATES 128KB 256FBGA

ECAD Model:

Datasheet:: Military Grade SmartFusion (cSoC)

Specifications

Microsemi Corporation A2F060M3E-1FGG256M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F060M3E-1FGG256M.

Package / Case
256-LBGA
Number of Pins
256
Supplier Device Package
256-FPBGA (17x17)
Operating Temperature
-55°C~125°C TJ
Packaging
Tray
Series
SmartFusion®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
125°C
Min Operating Temperature
-55°C
Frequency
100MHz
Base Part Number
A2F060M3E
Interface
EBI/EMI, I2C, SPI, UART, USART
Number of I/O
MCU - 26, FPGA - 66
Speed
100MHz
RAM Size
16KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Primary Attributes
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size
128KB
RoHS Status
RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
Microsemi Corporation offers a highly advanced Embedded - System On Chip (SoC) chip, belonging to the Embedded - System On Chip (SoC) category. With a remarkable number of 256 pins, this chip boasts a Supplier Device Package of 256-FPBGA (17x17) and an impressive operating temperature range of -55°C~125°C TJ. Part of the SmartFusion® series, this chip has a maximum operating temperature of 125°C and a minimum operating temperature of -55°C. With a frequency of 100MHz, it falls under the MCU architecture and its primary attributes include a ProASIC®3 FPGA, 60K gates, and 1536D-Flip-Flops. Additionally, this chip is RoHS Compliant, making it a reliable and environmentally-friendly choice.

ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-1FGG256M System On Chip (SoC) applications.

ARM support modules
Wireless sensor networks
Remote control
Temperature Sensors
Medical
Smart appliances
Efficient hardware for training of neural networks
Keyboard
PC peripherals
Cyberphysical system-on-chip

A2F060M3E-1FGG256M More Descriptions

FPGA SmartFusion Family 60K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA
IC SOC CORTEX-M3 100MHZ 256FBGA
IC FPGA 60K GATES 128KB 256FBGA

Product Comparison

The three parts on the right have similar specifications to A2F060M3E-1FGG256M.

Image

Part Number

Manufacturer

Package / Case

Number of Pins

Supplier Device Package

Operating Temperature

Packaging

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Interface

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Primary Attributes

Flash Size

RoHS Status

Factory Lead Time

Mount

Published

JESD-609 Code

Number of Terminations

Terminal Finish

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Operating Supply Voltage

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Data Rate

Programmable Logic Type

Number of Logic Elements/Cells

Number of Gates

Height Seated (Max)

Length

Width

Max Frequency

View Compare
A2F060M3E-1FGG256M

Microsemi Corporation

256-LBGA

256

256-FPBGA (17x17)

-55°C~125°C TJ

Tray

SmartFusion®

Obsolete

3 (168 Hours)

125°C

-55°C

100MHz

A2F060M3E

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
A2F060M3E-FG256M

Microsemi Corporation

256-LBGA

256

256-FPBGA (17x17)

-55°C~125°C TJ

Tray

SmartFusion®

Obsolete

3 (168 Hours)

125°C

-55°C

80MHz

A2F060M3E

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

80MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

A2F060M3E-1FGG256M vs A2F060M3E-FG256M
A2F060M3E-FGG256

Microsemi Corporation

256-LBGA

256

-

0°C~85°C TJ

Tray

SmartFusion®

Obsolete

3 (168 Hours)

-

-

80MHz

A2F060M3E

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

-

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

RoHS Compliant

2 Weeks

Surface Mount

2015

e1

256

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1.5V

1mm

30

1.5V

1.575V

1.425V

4.5kB

3mA

400 kbps

FIELD PROGRAMMABLE GATE ARRAY

660

60000

1.7mm

17mm

17mm

-

A2F060M3E-1FGG256M vs A2F060M3E-FGG256
A2F060M3E-FGG256I

Microsemi Corporation

256-LBGA

256

256-FPBGA (17x17)

-40°C~100°C TJ

Tray

SmartFusion®

Obsolete

3 (168 Hours)

100°C

-40°C

80MHz

A2F060M3E

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

80MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

RoHS Compliant

12 Weeks

-

2015

-

-

-

-

-

-

-

-

-

-

-

1.5V

1.575V

1.425V

4.5kB

3mA

400 kbps

-

660

60000

-

-

-

100MHz

A2F060M3E-1FGG256M vs A2F060M3E-FGG256I