Microsemi Corporation A2F060M3E-1CS288

Name: A2F060M3E-1CS288
Brand: Microsemi Corporation
SKU: 3162372-A2F060M3E-1CS288
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F060M3E-1CS288

Manufacturer:: Microsemi Corporation

Ventron No:: 3162372-A2F060M3E-1CS288

Description:: IC FPGA 60K GATES 128KB 288-CSP

ECAD Model:

Datasheet:: SmartFusion cSoC Datasheet

Specifications

Microsemi Corporation A2F060M3E-1CS288 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F060M3E-1CS288.

Mount
Surface Mount
Package / Case
288-TFBGA, CSPBGA
Number of Pins
288
Supplier Device Package
288-CSP (11x11)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2015
Series
SmartFusion®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Frequency
100MHz
Base Part Number
A2F060M3E
Operating Supply Voltage
1.5V
Interface
EBI/EMI, I2C, SPI, UART, USART
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Number of I/O
MCU - 28, FPGA - 68
Speed
100MHz
RAM Size
16KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Max Frequency
100MHz
Number of Logic Blocks (LABs)
8
Primary Attributes
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size
128KB
RoHS Status
Non-RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
This product features a high pin count of 288, making it suitable for complex electronic designs. The supplier device package is 288-CSP (11x11), providing a compact and efficient form factor. With a publication date of 2015, this product is equipped with the latest technology and advancements. It has a moisture sensitivity level of 3 (168 hours), ensuring its durability and reliability. The minimum operating temperature of 0°C allows for use in various environments. With a speed of 100MHz, this product offers fast and efficient performance. Its peripherals include DMA, POR, and WDT, providing additional functionality. The connectivity options of EBI/EMI, I2C, SPI, and UART/USART make this product versatile and compatible with various systems. The architecture of this product includes both MCU and FPGA, offering flexibility and adaptability. With a maximum frequency of 100MHz, this product can handle demanding tasks with ease.

ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-1CS288 System On Chip (SoC) applications.

Wireless networking
Medical Pressure
Robotics
Healthcare
Industrial AC-DC
CNC control
Industrial Pressure
Automotive
Embedded systems
Networked sensors

A2F060M3E-1CS288 More Descriptions

ACTEL'S SMARTFUSION INTELLIGENT MIXED-SIGNAL FPGAS
IC FPGA 60K GATES 128KB 288-CSP
IC SOC CORTEX-M3 100MHZ 288CSP

Product Comparison

The three parts on the right have similar specifications to A2F060M3E-1CS288.

Image

Part Number

Manufacturer

Mount

Package / Case

Number of Pins

Supplier Device Package

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Operating Supply Voltage

Interface

Max Supply Voltage

Min Supply Voltage

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Max Frequency

Number of Logic Blocks (LABs)

Primary Attributes

Flash Size

RoHS Status

Factory Lead Time

Memory Size

Operating Supply Current

Data Rate

Number of Logic Elements/Cells

Number of Gates

View Compare
A2F060M3E-1CS288

Microsemi Corporation

Surface Mount

288-TFBGA, CSPBGA

288

288-CSP (11x11)

0°C~85°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

85°C

0°C

100MHz

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

1.575V

1.425V

MCU - 28, FPGA - 68

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

100MHz

8

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

Non-RoHS Compliant

-

-

-

-

-

-

-
A2F060M3E-FGG256I

Microsemi Corporation

-

256-LBGA

256

256-FPBGA (17x17)

-40°C~100°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

100°C

-40°C

80MHz

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

1.575V

1.425V

MCU - 26, FPGA - 66

80MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

100MHz

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

RoHS Compliant

12 Weeks

4.5kB

3mA

400 kbps

660

60000

A2F060M3E-1CS288 vs A2F060M3E-FGG256I
A2F060M3E-1FGG256M

Microsemi Corporation

-

256-LBGA

256

256-FPBGA (17x17)

-55°C~125°C TJ

Tray

-

SmartFusion®

Obsolete

3 (168 Hours)

125°C

-55°C

100MHz

A2F060M3E

-

EBI/EMI, I2C, SPI, UART, USART

-

-

MCU - 26, FPGA - 66

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

-

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

RoHS Compliant

-

-

-

-

-

-

A2F060M3E-1CS288 vs A2F060M3E-1FGG256M
A2F060M3E-TQ144I

Microsemi Corporation

-

144-LQFP

-

144-TQFP (20x20)

-40°C~100°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

100°C

-40°C

80MHz

A2F060M3E

-

EBI/EMI, I2C, SPI, UART, USART

-

-

MCU - 21, FPGA - 33

80MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

-

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

128KB

Non-RoHS Compliant

12 Weeks

-

-

-

-

-

A2F060M3E-1CS288 vs A2F060M3E-TQ144I