XC7Z045-2FBG676CES

Xilinx Inc. XC7Z045-2FBG676CES

Part Number:
XC7Z045-2FBG676CES
Manufacturer:
Xilinx Inc.
Ventron No:
3162723-XC7Z045-2FBG676CES
Description:
IC SOC CORTEX-A9 KINTEX7 676FBGA
ECAD Model:
Datasheet:
XC7Z045-2FBG676CES

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Specifications
Xilinx Inc. XC7Z045-2FBG676CES technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-2FBG676CES.
  • Factory Lead Time
    7 Weeks
  • Package / Case
    676-BBGA, FCBGA
  • Supplier Device Package
    676-FCBGA (27x27)
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    0°C
  • Frequency
    800MHz
  • Base Part Number
    XC7Z045
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • Speed
    800MHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Core Architecture
    ARM
  • Primary Attributes
    Kintex™-7 FPGA, 350K Logic Cells
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
The package/case for this product is 676-BBGA or FCBGA. The supplier device package is 676-FCBGA with dimensions of 27x27. This product is currently obsolete and has a moisture sensitivity level of 4, meaning it can withstand 72 hours of exposure to moisture. The maximum operating temperature for this product is 85°C. It has a frequency of 800MHz and a total of 130 I/Os. The RAM size is 256KB and it has DMA peripherals. The primary attribute of this product is its Kintex™-7 FPGA with 350K logic cells.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z045-2FBG676CES System On Chip (SoC) applications.

Medical
ARM Cortex M4 microcontroller
Measurement tools
Microprocessors
Deep learning hardware
Central alarm system
Special Issue Information
AC drive control module
Industrial
String inverter
XC7Z045-2FBG676CES More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 733MHz 1.2V/3.3V 676-Pin
Xc7Z045-2Fbg676Ces |Amd Xilinx XC7Z045-2FBG676CES
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Product Comparison
The three parts on the right have similar specifications to XC7Z045-2FBG676CES.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Core Architecture
    Primary Attributes
    RoHS Status
    Surface Mount
    JESD-609 Code
    Pbfree Code
    Number of Terminations
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Clock Frequency
    Boundary Scan
    RAM (words)
    Bus Compatibility
    Height Seated (Max)
    Length
    Width
    Contact Plating
    ECCN Code
    Operating Supply Voltage
    Memory Type
    Data Bus Width
    Speed Grade
    Radiation Hardening
    Mount
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Number of Registers
    View Compare
  • XC7Z045-2FBG676CES
    XC7Z045-2FBG676CES
    7 Weeks
    676-BBGA, FCBGA
    676-FCBGA (27x27)
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    Obsolete
    4 (72 Hours)
    85°C
    0°C
    800MHz
    XC7Z045
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    800MHz
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    Kintex™-7 FPGA, 350K Logic Cells
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z012S-2CLG485I
    10 Weeks
    484-LFBGA, CSPBGA
    -
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    150
    766MHz
    256KB
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    Artix™-7 FPGA, 55K Logic Cells
    ROHS3 Compliant
    YES
    e3
    yes
    485
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    0.8mm
    NOT SPECIFIED
    S-PBGA-B485
    1.05V
    0.95V
    800MHz
    YES
    256000
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    19mm
    19mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-2FFG676E
    10 Weeks
    676-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    Active
    4 (72 Hours)
    -
    -
    800MHz
    XC7Z045
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    Kintex™-7 FPGA, 350K Logic Cells
    ROHS3 Compliant
    YES
    e1
    -
    676
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    30
    S-PBGA-B676
    1.05V
    -
    -
    YES
    256000
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.37mm
    27mm
    -
    Copper, Silver, Tin
    3A991.D
    1V
    ROMless
    32b
    -2
    No
    -
    -
    -
    -
    -
  • XC7Z035-1FBG676C
    10 Weeks
    676-BBGA, FCBGA
    -
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    Active
    3 (168 Hours)
    -
    -
    667MHz
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    Kintex™-7 FPGA, 275K Logic Cells
    ROHS3 Compliant
    -
    e1
    -
    676
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    -
    NOT SPECIFIED
    S-PBGA-B676
    -
    -
    -
    YES
    256000
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    Copper, Silver, Tin
    -
    -
    -
    -
    1
    -
    Surface Mount
    1.05V
    950mV
    120 ps
    343800
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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