Xilinx Inc. XC7Z035-1FBG676C

Name: XC7Z035-1FBG676C
Brand: Xilinx Inc.
SKU: 3828198-XC7Z035-1FBG676C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7Z035-1FBG676C

Manufacturer:: Xilinx Inc.

Ventron No:: 3828198-XC7Z035-1FBG676C

Description:: IC SOC CORTEX-A9 KINTEX7 676BGA

ECAD Model:

Datasheet:: XC7Z035-1FBG676C

Specifications

Xilinx Inc. XC7Z035-1FBG676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-1FBG676C.

Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Package / Case
676-BBGA, FCBGA
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2010
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
676
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1V
Frequency
667MHz
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B676
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage
1.05V
Min Supply Voltage
950mV
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Propagation Delay
120 ps
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
1
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 275K Logic Cells
Number of Registers
343800
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
2.54mm
Length
27mm
Width
27mm
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
The product is a Surface Mount with the series being Zynq®-7000. It has a JESD-609 Code of e1 and a Terminal Form of BALL. The Supply Voltage is 1V and the Core Processor is a Dual ARM® Cortex®-A9 MPCore™ with CoreSight™. The Peripherals include DMA and the Primary Attributes consist of a Kintex™-7 FPGA with 275K Logic Cells. It also has 343800 Registers and is ROHS3 Compliant.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z035-1FBG676C System On Chip (SoC) applications.

Central inverter
Deep learning hardware
Measurement tools
Microcontroller
USB hard disk enclosure
Wireless networking
Measurement testers
Healthcare
Body control module
ARM Cortex M4 microcontroller

XC7Z035-1FBG676C More Descriptions

FPGA Kintex-7 Family 275000 Cells 28nm Technology Automotive Medical 676-Pin Lidless FCBGA
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-676
Processors - Application Specialized XC7Z035-1FBG676C
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC 7035 / XC7Z035-1FBG676C FBGA676
IC SOC CORTEX-A9 KINTEX7 676BGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-1FBG676C

Product Comparison

The three parts on the right have similar specifications to XC7Z035-1FBG676C.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Mount

Package / Case

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Frequency

Reflow Temperature-Max (s)

JESD-30 Code

Interface

Max Supply Voltage

Min Supply Voltage

Number of I/O

RAM Size

Core Processor

Peripherals

Propagation Delay

Connectivity

Architecture

Core Architecture

Boundary Scan

Speed Grade

RAM (words)

Primary Attributes

Number of Registers

Bus Compatibility

Height Seated (Max)

Length

Width

RoHS Status

Surface Mount

Pbfree Code

HTS Code

Terminal Pitch

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Speed

Clock Frequency

Number of Pins

ECCN Code

Additional Feature

Turn On Delay Time

View Compare
XC7Z035-1FBG676C

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

676-BBGA, FCBGA

0°C~85°C TJ

Tray

2010

Zynq®-7000

e1

Active

3 (168 Hours)

676

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

667MHz

NOT SPECIFIED

S-PBGA-B676

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.05V

950mV

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

120 ps

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

1

256000

Kintex™-7 FPGA, 275K Logic Cells

343800

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

27mm

27mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-
XC7Z014S-1CLG484I

Xilinx Inc.

10 Weeks

-

-

484-LFBGA, CSPBGA

-40°C~100°C TJ

Tray

2016

Zynq®-7000

e3

Active

3 (168 Hours)

484

Matte Tin (Sn)

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

-

NOT SPECIFIED

S-PBGA-B484

-

-

-

200

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

YES

-

256000

Artix™-7 FPGA, 65K Logic Cells

-

CAN; ETHERNET; I2C; SPI; UART; USB

1.6mm

19mm

19mm

ROHS3 Compliant

YES

yes

8542.31.00.01

0.8mm

1.05V

0.95V

667MHz

667MHz

-

-

-

-

XC7Z035-1FBG676C vs XC7Z014S-1CLG484I
XC7Z045-3FFV676E

Xilinx Inc.

10 Weeks

-

-

676-BBGA, FCBGA

0°C~100°C TJ

Bulk

2009

Zynq®-7000

-

Active

4 (72 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

-

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

-

Kintex™-7 FPGA, 350K Logic Cells

-

-

-

-

-

ROHS3 Compliant

-

-

-

-

-

-

1GHz

-

-

-

-

-

XC7Z035-1FBG676C vs XC7Z045-3FFV676E
XC7Z100-L2FFG900I

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

4 (72 Hours)

900

Tin/Silver/Copper (Sn/Ag/Cu)

CMOS

BOTTOM

BALL

245

1V

800MHz

30

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.05V

950mV

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

120 ps

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

-

256000

Kintex™-7 FPGA, 444K Logic Cells

554800

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

31mm

31mm

ROHS3 Compliant

-

-

8542.39.00.01

1mm

-

-

-

-

900

3A991.D

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

120 ps

XC7Z035-1FBG676C vs XC7Z100-L2FFG900I