Xilinx Inc. XC7Z035-3FBG676E
- Part Number:
- XC7Z035-3FBG676E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3828211-XC7Z035-3FBG676E
- Description:
- IC SOC CORTEX-A9 KINTEX7 676BGA
- Datasheet:
- XC7Z035-3FBG676E
Xilinx Inc. XC7Z035-3FBG676E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-3FBG676E.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- MountSurface Mount
- Package / Case676-BBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2010
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency800MHz
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B676
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Max Supply Voltage1.05V
- Min Supply Voltage950mV
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- Propagation Delay110 ps
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade3
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 275K Logic Cells
- Number of Registers343800
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)2.54mm
- Length27mm
- Width27mm
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 275K Logic Cells.An advanced Tray package houses this SoC system on a chip.130 I/Os are available in this SoC part.For safe operation, it is advisable to utilize a power supply with 1V voltage.It is really beneficial to have system on a chip since there are 676 terminations in total.A frequency of 800MHz is used by the wireless SoC to operate.Based on the core architecture of ARM, the SoC meaning has a high level of performance.A maximum supply voltage of 1.05V is specified for the SoC security.At least 950mV power is delivered to it.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z035-3FBG676E System On Chip (SoC) applications.
Special Issue Information
Multiprocessor system-on-chips (MPSoCs)
Cyber security for critical applications in the aerospace
Industrial AC-DC
Microprocessors
Communication network-on-Chip (cNoC)
Video Imaging
Industrial robot
Cyberphysical system-on-chip
Medical
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 275K Logic Cells.An advanced Tray package houses this SoC system on a chip.130 I/Os are available in this SoC part.For safe operation, it is advisable to utilize a power supply with 1V voltage.It is really beneficial to have system on a chip since there are 676 terminations in total.A frequency of 800MHz is used by the wireless SoC to operate.Based on the core architecture of ARM, the SoC meaning has a high level of performance.A maximum supply voltage of 1.05V is specified for the SoC security.At least 950mV power is delivered to it.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z035-3FBG676E System On Chip (SoC) applications.
Special Issue Information
Multiprocessor system-on-chips (MPSoCs)
Cyber security for critical applications in the aerospace
Industrial AC-DC
Microprocessors
Communication network-on-Chip (cNoC)
Video Imaging
Industrial robot
Cyberphysical system-on-chip
Medical
XC7Z035-3FBG676E More Descriptions
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 676-Pin FCBGA Tray
IC SOC CORTEX-A9 800MHZ 676FCBGA
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-676
IC SOC CORTEX-A9 KINTEX7 676BGA
Product Description Demo for Development.
French Electronic Distributor since 1988
Processors - Application Specialized
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z035-3FBG676E
IC SOC CORTEX-A9 800MHZ 676FCBGA
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-676
IC SOC CORTEX-A9 KINTEX7 676BGA
Product Description Demo for Development.
French Electronic Distributor since 1988
Processors - Application Specialized
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z035-3FBG676E
The three parts on the right have similar specifications to XC7Z035-3FBG676E.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingMountPackage / CaseOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)JESD-30 CodeInterfaceMax Supply VoltageMin Supply VoltageNumber of I/ORAM SizeCore ProcessorPeripheralsPropagation DelayConnectivityArchitectureCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesNumber of RegistersBus CompatibilityHeight Seated (Max)LengthWidthRoHS StatusSurface MountECCN CodeTerminal FinishHTS CodeBase Part NumberOperating Supply VoltageSupply Voltage-Max (Vsup)Memory TypeData Bus WidthRadiation HardeningNumber of PinsView Compare
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XC7Z035-3FBG676E10 WeeksCopper, Silver, TinSurface Mount676-BBGA, FCBGA0°C~100°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIEDS-PBGA-B676CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB1.05V950mV130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA110 psCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES3256000Kintex™-7 FPGA, 275K Logic Cells343800CAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmROHS3 Compliant------------
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10 WeeksCopper, Silver, Tin-676-BBGA, FCBGA0°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)676CMOSBOTTOMBALL2451V1mm800MHz30S-PBGA-B676CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB--130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES-2256000Kintex™-7 FPGA, 350K Logic Cells-CAN; ETHERNET; I2C; SPI; UART; USB3.37mm27mm-ROHS3 CompliantYES3A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01XC7Z0451V1.05VROMless32bNo-
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10 WeeksCopper, Silver, TinSurface Mount676-BBGA, FCBGA0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIEDS-PBGA-B676CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB1.05V950mV130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA120 psCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES1256000Kintex™-7 FPGA, 275K Logic Cells343800CAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mmROHS3 Compliant--Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)--------
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10 Weeks--900-BBGA, FCBGA-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)900CMOSBOTTOMBALL2451V-667MHz30-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB--130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA130 psCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES1256000Kintex™-7 FPGA, 275K Logic Cells343800CAN; ETHERNET; I2C; SPI; UART; USB3.35mm--ROHS3 CompliantYES-Tin/Silver/Copper (Sn/Ag/Cu)--1V----900
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