XC7Z012S-2CLG485I

Xilinx Inc. XC7Z012S-2CLG485I

Part Number:
XC7Z012S-2CLG485I
Manufacturer:
Xilinx Inc.
Ventron No:
4544072-XC7Z012S-2CLG485I
Description:
IC FPGA SOC 150I/O 485BGA
ECAD Model:
Datasheet:
XC7Z012S-2CLG485I

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Xilinx Inc. XC7Z012S-2CLG485I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z012S-2CLG485I.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    484-LFBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq®-7000
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    485
  • Terminal Finish
    Matte Tin (Sn)
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1V
  • Terminal Pitch
    0.8mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B485
  • Supply Voltage-Max (Vsup)
    1.05V
  • Supply Voltage-Min (Vsup)
    0.95V
  • Number of I/O
    150
  • Speed
    766MHz
  • RAM Size
    256KB
  • Core Processor
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Clock Frequency
    800MHz
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Boundary Scan
    YES
  • RAM (words)
    256000
  • Primary Attributes
    Artix™-7 FPGA, 55K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    1.6mm
  • Length
    19mm
  • Width
    19mm
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Single ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Single ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Manufacturer assigns package 484-LFBGA, CSPBGA to this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.This SoC security combines Artix?-7 FPGA, 55K Logic Cells and that is something to note.A state-of-the-art Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 150 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1V.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.Power supplies of at least 0.95V are required.A system on a chip benefits from having 485 terminations.SoCs with 800MHz clock frequencies are used in this design.

Single ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Clock Frequency: 800MHz

There are a lot of Xilinx Inc.
XC7Z012S-2CLG485I System On Chip (SoC) applications.

Sports
Smartphone accessories
Industrial AC-DC
System-on-chip (SoC)
Avionics
Automotive gateway
Mobile market
Industrial automation devices
Functional safety for critical applications in the aerospace
Servo drive control module
XC7Z012S-2CLG485I More Descriptions
FPGA Zynq-7000 Family 55000 Cells 766MHz 28nm 1V 485-Pin WCBGA Tray
High Speed CMOS Logic Quad 2-Input AND Gates 14-TSSOP -55 to 125
PSOC, ARM CORTEX-A9, 766MHZ, BGA-485
IC SOC CORTEX-A9 766MHZ 485CSBGA
IC SOC CORTEX-A9 667MHZ 484BGA
Processors - Application Specialized
Psoc, Arm Cortex-A9, 766Mhz, Bga-485; Product Range:Zynq Family 7000S Series Microprocessors; Cpu Speed:766Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Bga; No. Of Pins:485Pins; Msl:-; Ic Case/Package:Bga Rohs Compliant: Yes |Amd Xilinx XC7Z012S-2CLG485I
Product Comparison
The three parts on the right have similar specifications to XC7Z012S-2CLG485I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Clock Frequency
    Connectivity
    Architecture
    Boundary Scan
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Contact Plating
    Mount
    Frequency
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Core Architecture
    Speed Grade
    Number of Registers
    Number of Pins
    Operating Supply Voltage
    View Compare
  • XC7Z012S-2CLG485I
    XC7Z012S-2CLG485I
    10 Weeks
    484-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    e3
    yes
    Active
    3 (168 Hours)
    485
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    0.8mm
    NOT SPECIFIED
    S-PBGA-B485
    1.05V
    0.95V
    150
    766MHz
    256KB
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    800MHz
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Artix™-7 FPGA, 55K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    19mm
    19mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z014S-1CLG484I
    10 Weeks
    484-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq®-7000
    e3
    yes
    Active
    3 (168 Hours)
    484
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    0.8mm
    NOT SPECIFIED
    S-PBGA-B484
    1.05V
    0.95V
    200
    667MHz
    256KB
    Single ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    667MHz
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Artix™-7 FPGA, 65K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    1.6mm
    19mm
    19mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z035-3FBG676E
    10 Weeks
    676-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    -
    Active
    3 (168 Hours)
    676
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    NOT SPECIFIED
    S-PBGA-B676
    -
    -
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    ROHS3 Compliant
    Copper, Silver, Tin
    Surface Mount
    800MHz
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    1.05V
    950mV
    110 ps
    ARM
    3
    343800
    -
    -
  • XC7Z035-1FFG900I
    10 Weeks
    900-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    -
    Active
    4 (72 Hours)
    900
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    CMOS
    BOTTOM
    BALL
    245
    1V
    -
    30
    -
    -
    -
    130
    -
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    -
    -
    ROHS3 Compliant
    -
    -
    667MHz
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    -
    -
    130 ps
    ARM
    1
    343800
    900
    1V
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 18 January 2024

    What is the BTN8982TA Bridge and How Does it Work?

    Ⅰ. Introduction to BTN8982TAⅡ. Block diagram of BTN8982TAⅢ. Specifications of BTN8982TAⅣ. Working principle of BTN8982TAⅤ. BTN8982TA symbol, footprint and pin configurationⅥ. Features of BTN8982TAⅦ. Application fields of BTN8982TABTN8982TA...
  • 18 January 2024

    TPS51200DRCR: Advanced Regulator Solution for DDR Termination

    Ⅰ. Overview of TPS51200DRCRⅡ. Technical parameters of TPS51200DRCRⅢ. What are the advantages of TPS51200DRCR?Ⅳ. Absolute maximum ratings of TPS51200DRCRⅤ. How to use TPS51200DRCR?Ⅵ. Where is TPS51200DRCR used?Ⅶ. TPS51200DRCR...
  • 19 January 2024

    TXB0104PWR Alternatives, Package, Specifications and Applications

    Ⅰ. TXB0104PWR overviewⅡ. Operating principle of TXB0104PWRⅢ. Package of TXB0104PWRⅣ. Specifications of TXB0104PWRⅤ. How to use TXB0104PWR?Ⅵ. What are the applications of TXB0104PWR?Ⅶ. How does TXB0104PWR realize automatic...
  • 19 January 2024

    The Best Tutorial for ISO3082DWR

    Ⅰ. Overview of ISO3082DWRⅡ. Technical parameters of ISO3082DWRⅢ. What are the characteristics of ISO3082DWR?Ⅳ. How does ISO3082DWR work?Ⅴ. ISO3082DWR symbol, footprint and pin configurationⅥ. Layout principles of ISO3082DWRⅦ....
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.