XC7Z035-1FFG900I

Xilinx Inc. XC7Z035-1FFG900I

Part Number:
XC7Z035-1FFG900I
Manufacturer:
Xilinx Inc.
Ventron No:
3828120-XC7Z035-1FFG900I
Description:
IC SOC CORTEX-A9 KINTEX7 900BGA
ECAD Model:
Datasheet:
XC7Z035-1FFG900I

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Specifications
Xilinx Inc. XC7Z035-1FFG900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-1FFG900I.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    900-BBGA, FCBGA
  • Surface Mount
    YES
  • Number of Pins
    900
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    900
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Frequency
    667MHz
  • Reflow Temperature-Max (s)
    30
  • Operating Supply Voltage
    1V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Propagation Delay
    130 ps
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    1
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 275K Logic Cells
  • Number of Registers
    343800
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    3.35mm
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Its package is 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.Internally, this SoC design uses the MCU, FPGA technique.The system on a chip is part of the series Zynq?-7000.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.It is important to note that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1V.In total, there are 900 terminations, which makes system on a chip possible.The wireless SoC works at a frequency of 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.In this computer SoC, there are 900 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z035-1FFG900I System On Chip (SoC) applications.

Fitness
sequence controllers
String inverter
Published Paper
Industrial
AC drive control module
Central inverter
Medical
External USB hard disk/SSD
Remote control
XC7Z035-1FFG900I More Descriptions
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FC-BGA Tray
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-900
IC SOC CORTEX-A9 667MHZ 900FCBGA
IC SOC CORTEX-A9 800MHZ 676FCBGA
Product Description Demo for Development.
Processors - Application Specialized
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-1FFG900I
Product Comparison
The three parts on the right have similar specifications to XC7Z035-1FFG900I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Frequency
    Reflow Temperature-Max (s)
    Operating Supply Voltage
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Propagation Delay
    Connectivity
    Architecture
    Core Architecture
    Boundary Scan
    Speed Grade
    RAM (words)
    Primary Attributes
    Number of Registers
    Bus Compatibility
    Height Seated (Max)
    RoHS Status
    Speed
    Contact Plating
    Mount
    JESD-30 Code
    Max Supply Voltage
    Min Supply Voltage
    Length
    Width
    ECCN Code
    Additional Feature
    HTS Code
    Terminal Pitch
    Turn On Delay Time
    View Compare
  • XC7Z035-1FFG900I
    XC7Z035-1FFG900I
    10 Weeks
    900-BBGA, FCBGA
    YES
    900
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    Tin/Silver/Copper (Sn/Ag/Cu)
    CMOS
    BOTTOM
    BALL
    245
    1V
    667MHz
    30
    1V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    130 ps
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    1
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    343800
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-3FFV676E
    10 Weeks
    676-BBGA, FCBGA
    -
    -
    0°C~100°C TJ
    Bulk
    2009
    Zynq®-7000
    -
    Active
    4 (72 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    -
    -
    Kintex™-7 FPGA, 350K Logic Cells
    -
    -
    -
    ROHS3 Compliant
    1GHz
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z035-1FBG676C
    10 Weeks
    676-BBGA, FCBGA
    -
    -
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    667MHz
    NOT SPECIFIED
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    120 ps
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    1
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    343800
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    ROHS3 Compliant
    -
    Copper, Silver, Tin
    Surface Mount
    S-PBGA-B676
    1.05V
    950mV
    27mm
    27mm
    -
    -
    -
    -
    -
  • XC7Z100-L2FFG900I
    10 Weeks
    900-BBGA, FCBGA
    -
    900
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    Tin/Silver/Copper (Sn/Ag/Cu)
    CMOS
    BOTTOM
    BALL
    245
    1V
    800MHz
    30
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    120 ps
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    ARM
    YES
    -
    256000
    Kintex™-7 FPGA, 444K Logic Cells
    554800
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    ROHS3 Compliant
    -
    Copper, Silver, Tin
    Surface Mount
    -
    1.05V
    950mV
    31mm
    31mm
    3A991.D
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    8542.39.00.01
    1mm
    120 ps
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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