Xilinx Inc. XC7Z035-1FFG900I
- Part Number:
- XC7Z035-1FFG900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3828120-XC7Z035-1FFG900I
- Description:
- IC SOC CORTEX-A9 KINTEX7 900BGA
- Datasheet:
- XC7Z035-1FFG900I
Xilinx Inc. XC7Z035-1FFG900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z035-1FFG900I.
- Factory Lead Time10 Weeks
- Package / Case900-BBGA, FCBGA
- Surface MountYES
- Number of Pins900
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2010
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Frequency667MHz
- Reflow Temperature-Max (s)30
- Operating Supply Voltage1V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- Propagation Delay130 ps
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade1
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 275K Logic Cells
- Number of Registers343800
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)3.35mm
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Its package is 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.Internally, this SoC design uses the MCU, FPGA technique.The system on a chip is part of the series Zynq?-7000.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.It is important to note that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1V.In total, there are 900 terminations, which makes system on a chip possible.The wireless SoC works at a frequency of 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.In this computer SoC, there are 900 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z035-1FFG900I System On Chip (SoC) applications.
Fitness
sequence controllers
String inverter
Published Paper
Industrial
AC drive control module
Central inverter
Medical
External USB hard disk/SSD
Remote control
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Its package is 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.Internally, this SoC design uses the MCU, FPGA technique.The system on a chip is part of the series Zynq?-7000.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.It is important to note that this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1V.In total, there are 900 terminations, which makes system on a chip possible.The wireless SoC works at a frequency of 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.In this computer SoC, there are 900 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z035-1FFG900I System On Chip (SoC) applications.
Fitness
sequence controllers
String inverter
Published Paper
Industrial
AC drive control module
Central inverter
Medical
External USB hard disk/SSD
Remote control
XC7Z035-1FFG900I More Descriptions
FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FC-BGA Tray
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-900
IC SOC CORTEX-A9 667MHZ 900FCBGA
IC SOC CORTEX-A9 800MHZ 676FCBGA
Product Description Demo for Development.
Processors - Application Specialized
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-1FFG900I
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-900
IC SOC CORTEX-A9 667MHZ 900FCBGA
IC SOC CORTEX-A9 800MHZ 676FCBGA
Product Description Demo for Development.
Processors - Application Specialized
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z035-1FFG900I
The three parts on the right have similar specifications to XC7Z035-1FFG900I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageFrequencyReflow Temperature-Max (s)Operating Supply VoltageInterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsPropagation DelayConnectivityArchitectureCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesNumber of RegistersBus CompatibilityHeight Seated (Max)RoHS StatusSpeedContact PlatingMountJESD-30 CodeMax Supply VoltageMin Supply VoltageLengthWidthECCN CodeAdditional FeatureHTS CodeTerminal PitchTurn On Delay TimeView Compare
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XC7Z035-1FFG900I10 Weeks900-BBGA, FCBGAYES900-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)900Tin/Silver/Copper (Sn/Ag/Cu)CMOSBOTTOMBALL2451V667MHz301VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA130 psCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES1256000Kintex™-7 FPGA, 275K Logic Cells343800CAN; ETHERNET; I2C; SPI; UART; USB3.35mmROHS3 Compliant--------------
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10 Weeks676-BBGA, FCBGA--0°C~100°C TJBulk2009Zynq®-7000-Active4 (72 Hours)-----------130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA-CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA----Kintex™-7 FPGA, 350K Logic Cells---ROHS3 Compliant1GHz------------
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10 Weeks676-BBGA, FCBGA--0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)CMOSBOTTOMBALLNOT SPECIFIED1V667MHzNOT SPECIFIED-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA120 psCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES1256000Kintex™-7 FPGA, 275K Logic Cells343800CAN; ETHERNET; I2C; SPI; UART; USB2.54mmROHS3 Compliant-Copper, Silver, TinSurface MountS-PBGA-B6761.05V950mV27mm27mm-----
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10 Weeks900-BBGA, FCBGA-900-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)900Tin/Silver/Copper (Sn/Ag/Cu)CMOSBOTTOMBALL2451V800MHz30-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMA120 psCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES-256000Kintex™-7 FPGA, 444K Logic Cells554800CAN; ETHERNET; I2C; SPI; UART; USB3.35mmROHS3 Compliant-Copper, Silver, TinSurface Mount-1.05V950mV31mm31mm3A991.DPL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY8542.39.00.011mm120 ps
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