Xilinx Inc. XC7Z045-2FBG676I
- Part Number:
- XC7Z045-2FBG676I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3828225-XC7Z045-2FBG676I
- Description:
- IC SOC CORTEX-A9 KINTEX7 676FBGA
- Datasheet:
- XC7Z045-2FBG676I
Xilinx Inc. XC7Z045-2FBG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-2FBG676I.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case676-BBGA, FCBGA
- Surface MountYES
- Number of Pins676
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency800MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z045
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Memory TypeROMless
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-2
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)2.54mm
- Length27mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.In the Zynq?-7000 series, this system on chip SoC is included.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.Ideally, a power supply with a voltage of 1V should be used.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.It is really beneficial to have system on a chip since there are 676 terminations in total.Search XC7Z045 for system on chips with similar specs and purposes.A frequency of 800MHz is used by the wireless SoC to operate.This SoC meaning utilizes a core architecture of ARM as its foundation.Currently, the computer SoC is available in a 676-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FBG676I System On Chip (SoC) applications.
Smartphones
Keywords
Industrial automation devices
Print Special Issue Flyer
Mobile computing
ARM Cortex M4 microcontroller
Flow Sensors
Optical drive
Samsung galaxy gear
Automotive gateway
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.In the Zynq?-7000 series, this system on chip SoC is included.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.Ideally, a power supply with a voltage of 1V should be used.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.It is really beneficial to have system on a chip since there are 676 terminations in total.Search XC7Z045 for system on chips with similar specs and purposes.A frequency of 800MHz is used by the wireless SoC to operate.This SoC meaning utilizes a core architecture of ARM as its foundation.Currently, the computer SoC is available in a 676-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-2FBG676I System On Chip (SoC) applications.
Smartphones
Keywords
Industrial automation devices
Print Special Issue Flyer
Mobile computing
ARM Cortex M4 microcontroller
Flow Sensors
Optical drive
Samsung galaxy gear
Automotive gateway
XC7Z045-2FBG676I More Descriptions
FPGA Kintex-7 Family 350000 Cells 28nm Technology 1V Automotive 676-Pin Lidless FCBGA
MPU Zynq-7000 Thumb-2 32-Bit 733MHz 1.2V/3.3V 676-Pin FCBGA
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-676
Processors - Application Specialized XC7Z045-2FBG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z045-2FBG676I
MPU Zynq-7000 Thumb-2 32-Bit 733MHz 1.2V/3.3V 676-Pin FCBGA
PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-676
Processors - Application Specialized XC7Z045-2FBG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA
IC SOC CORTEX-A9 KINTEX7 676FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 800Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:800Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z045-2FBG676I
The three parts on the right have similar specifications to XC7Z045-2FBG676I.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeMemory TypeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusMountJESD-30 CodeMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersWidthAdditional FeatureTurn On Delay TimeView Compare
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XC7Z045-2FBG676I10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES676-40°C~100°C TJTray2009Zynq®-7000e1Active3 (168 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z0451V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mmNoROHS3 Compliant----------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGA--0°C~100°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676---CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIED---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES3256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 CompliantSurface MountS-PBGA-B6761.05V950mV110 ps34380027mm--
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGA--0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)-CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIED---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 CompliantSurface MountS-PBGA-B6761.05V950mV120 ps34380027mm--
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10 WeeksCopper, Silver, Tin900-BBGA, FCBGA-900-40°C~100°C TJTray2010Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30---CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES-256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm-ROHS3 CompliantSurface Mount-1.05V950mV120 ps55480031mmPL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY120 ps
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