XC7Z100-L2FFG900I

Xilinx Inc. XC7Z100-L2FFG900I

Part Number:
XC7Z100-L2FFG900I
Manufacturer:
Xilinx Inc.
Ventron No:
3828139-XC7Z100-L2FFG900I
Description:
IC SOC CORTEX-A9 KINTEX7 900BGA
ECAD Model:
Datasheet:
XC7Z100-L2FFG900I

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Specifications
Xilinx Inc. XC7Z100-L2FFG900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z100-L2FFG900I.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Mount
    Surface Mount
  • Package / Case
    900-BBGA, FCBGA
  • Number of Pins
    900
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    900
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Additional Feature
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    800MHz
  • Reflow Temperature-Max (s)
    30
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Max Supply Voltage
    1.05V
  • Min Supply Voltage
    950mV
  • Number of I/O
    130
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Propagation Delay
    120 ps
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Turn On Delay Time
    120 ps
  • Architecture
    MCU, FPGA
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 444K Logic Cells
  • Number of Registers
    554800
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    3.35mm
  • Length
    31mm
  • Width
    31mm
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the Zynq?-7000 series.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines Kintex?-7 FPGA, 444K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 130 I/Os.A 1V power supply is recommended.In total, there are 900 terminations, so system on a chip is really aided by this.800MHz is the wireless SoC's frequency.This SoC meaning utilizes a core architecture of ARM as its foundation.Further features of this SoC processor are PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.There is a 900-pin version of this computer SoC available.There is a maximum supply voltage of 1.05V.Power is supplied to it at least in the amount of 950mV.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.
XC7Z100-L2FFG900I System On Chip (SoC) applications.

Smart appliances
Efficient hardware for training of neural networks
Temperature Sensors
Automotive
Networked sensors
CNC control
Vending machines
Industrial sectors
Digital Media
Industrial AC-DC
XC7Z100-L2FFG900I More Descriptions
FPGA Zynq-7000 Family 444000 Cells 28nm Technology 1V 900-Pin FC-BGA
Field Programmable Gate Array, 192 CLBs, 600 Gates, CMOS, PQFP44
Processors - Application Specialized XC7Z100-L2FFG900I
IC SOC CORTEX-A9 800MHZ 900FCBGA
IC EEPROM 16K I2C 400KHZ 8TSSOP
IC SOC CORTEX-A9 KINTEX7 900BGA
Product Comparison
The three parts on the right have similar specifications to XC7Z100-L2FFG900I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Propagation Delay
    Connectivity
    Turn On Delay Time
    Architecture
    Core Architecture
    Boundary Scan
    RAM (words)
    Primary Attributes
    Number of Registers
    Bus Compatibility
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Speed
    JESD-30 Code
    Speed Grade
    Surface Mount
    Operating Supply Voltage
    View Compare
  • XC7Z100-L2FFG900I
    XC7Z100-L2FFG900I
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    900-BBGA, FCBGA
    900
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    800MHz
    30
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    1.05V
    950mV
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    120 ps
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    120 ps
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 444K Logic Cells
    554800
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    31mm
    31mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
  • XC7Z045-3FFV676E
    10 Weeks
    -
    -
    676-BBGA, FCBGA
    -
    0°C~100°C TJ
    Bulk
    2009
    Zynq®-7000
    -
    Active
    4 (72 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    -
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    -
    MCU, FPGA
    -
    -
    -
    Kintex™-7 FPGA, 350K Logic Cells
    -
    -
    -
    -
    -
    ROHS3 Compliant
    1GHz
    -
    -
    -
    -
  • XC7Z035-1FBG676C
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    676-BBGA, FCBGA
    -
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    -
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    -
    667MHz
    NOT SPECIFIED
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    1.05V
    950mV
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    120 ps
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    -
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    343800
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    27mm
    ROHS3 Compliant
    -
    S-PBGA-B676
    1
    -
    -
  • XC7Z035-1FFG900I
    10 Weeks
    -
    -
    900-BBGA, FCBGA
    900
    -40°C~100°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    -
    CMOS
    BOTTOM
    BALL
    245
    1V
    -
    667MHz
    30
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    -
    -
    130
    256KB
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    130 ps
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    -
    MCU, FPGA
    ARM
    YES
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    343800
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    -
    -
    ROHS3 Compliant
    -
    -
    1
    YES
    1V
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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