Xilinx Inc. XC7Z030-L2FBG484I

Name: XC7Z030-L2FBG484I
Brand: Xilinx Inc.
SKU: 3669294-XC7Z030-L2FBG484I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7Z030-L2FBG484I

Manufacturer:: Xilinx Inc.

Ventron No:: 3669294-XC7Z030-L2FBG484I

Description:: IC SOC CORTEX-A9 KINTEX7 484BGA

ECAD Model:

Datasheet:: XC7Z030-L2FBG484I

Specifications

Xilinx Inc. XC7Z030-L2FBG484I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z030-L2FBG484I.

Factory Lead Time
10 Weeks
Package / Case
484-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2010
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
484
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1V
Terminal Pitch
1mm
Reach Compliance Code
not_compliant
Frequency
800MHz
Reflow Temperature-Max (s)
30
JESD-30 Code
S-PBGA-B484
Supply Voltage-Max (Vsup)
1.05V
Supply Voltage-Min (Vsup)
0.95V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Core Architecture
ARM
Boundary Scan
YES
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
2.54mm
Length
23mm
Width
23mm
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Moisture Sensitivity Level (MSL) is a crucial factor to consider when dealing with electronic components. In this case, the MSL for the component is 3, meaning it can withstand exposure to moisture for up to 168 hours. This information is important for proper handling and storage of the component. Additionally, the ECCN Code for this component is EAR99, indicating that it is not subject to any export control restrictions. The Terminal Finish, which is Tin/Silver/Copper (Sn/Ag/Cu), is a protective layer that enhances the component's durability and conductivity. Furthermore, the component falls under the HTS Code 8542.39.00.01, which is used for integrated circuits. The technology used in this component is CMOS, with a frequency of 800MHz. Its architecture is a combination of MCU and FPGA, with a core architecture of ARM. Lastly, the component has a length and width of 23mm, making it compact and suitable for various electronic devices.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.
XC7Z030-L2FBG484I System On Chip (SoC) applications.

Industrial automation devices
Industrial AC-DC
DC-input BLDC motor drive
Measurement testers
Industrial sectors
Automotive gateway
Wireless sensor networks
Smart appliances
Functional safety for critical applications in the automotive
Industrial automation devices

XC7Z030-L2FBG484I More Descriptions

FPGA Zynq-7000 125000 Cells 28nm Technology 1V 484-Pin FCBGA Tray
IC SOC CORTEX-A9 800MHZ 484FCBGA
IC SOC CORTEX-A9 KINTEX7 484BGA
Processors - Application Specialized

Product Comparison

The three parts on the right have similar specifications to XC7Z030-L2FBG484I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reach Compliance Code

Frequency

Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Interface

Number of I/O

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Boundary Scan

RAM (words)

Primary Attributes

Bus Compatibility

Height Seated (Max)

Length

Width

RoHS Status

Speed

Contact Plating

Mount

Max Supply Voltage

Min Supply Voltage

Propagation Delay

Speed Grade

Number of Registers

Number of Pins

Turn On Delay Time

View Compare
XC7Z030-L2FBG484I

Xilinx Inc.

10 Weeks

484-BBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

3 (168 Hours)

484

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

CMOS

BOTTOM

BALL

250

1V

1mm

not_compliant

800MHz

30

S-PBGA-B484

1.05V

0.95V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 125K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

23mm

23mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-
XC7Z045-3FFV676E

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

-

0°C~100°C TJ

Bulk

2009

Zynq®-7000

-

Active

4 (72 Hours)

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

Kintex™-7 FPGA, 350K Logic Cells

-

-

-

-

ROHS3 Compliant

1GHz

-

-

-

-

-

-

-

-

-

XC7Z030-L2FBG484I vs XC7Z045-3FFV676E
XC7Z035-1FBG676C

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

-

0°C~85°C TJ

Tray

2010

Zynq®-7000

e1

Active

3 (168 Hours)

676

-

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

-

-

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

-

-

667MHz

NOT SPECIFIED

S-PBGA-B676

-

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 275K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

27mm

27mm

ROHS3 Compliant

-

Copper, Silver, Tin

Surface Mount

1.05V

950mV

120 ps

1

343800

-

-

XC7Z030-L2FBG484I vs XC7Z035-1FBG676C
XC7Z100-L2FFG900I

Xilinx Inc.

10 Weeks

900-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

4 (72 Hours)

900

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

CMOS

BOTTOM

BALL

245

1V

1mm

-

800MHz

30

-

-

-

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 444K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

31mm

31mm

ROHS3 Compliant

-

Copper, Silver, Tin

Surface Mount

1.05V

950mV

120 ps

-

554800

900

120 ps

XC7Z030-L2FBG484I vs XC7Z100-L2FFG900I