Cypress Semiconductor Corp S72XS256RE0AHBJ10

S72XS256RE0AHBJ10 Overview
In terms of its memory type, it can be classified as Non-Volatile. The case comes in Tray size. The case is embedded in 133-VFBGA. Memory size on the chip is 256Mbit Flash 2565Mbit DDR DRAM. This device uses takes advantage of the FLASH, RAM format. The device's extended operating temperature range of -25°C~85°C TA makes it ideal for many demanding applications. The device is capable of handling a supply voltage of 1.7V~1.95V. The recommended mounting type for this device is Surface Mount. On the chip, there are 133 terminations. The comprehensive working procedure is supported by 1 functions in this part. A voltage of 1.8V is required for the operation of this memory device. There is a clock frequency rotation of the memory within a 108MHz range. This memory chip requires only 1.8V of power. XS-R series memory devices play an important role in the applications they target. The Other Memory ICs component is usually regarded as a type of this component.

S72XS256RE0AHBJ10 Features
Package / Case: 133-VFBGA


S72XS256RE0AHBJ10 Applications
There are a lot of Cypress Semiconductor Corp
S72XS256RE0AHBJ10 Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer